Polyimide polymer composition, method for producing the same, and polyimide film

A technology of polyimide and manufacturing method, applied in the field of polyimide film, can solve the problems of inability to obtain physical properties, etc., and achieve the effect of improving transmittance

Active Publication Date: 2017-07-07
DONGJIN SEMICHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when it is replaced, the required physical properties cannot be obtained, so it is still used

Method used

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  • Polyimide polymer composition, method for producing the same, and polyimide film
  • Polyimide polymer composition, method for producing the same, and polyimide film
  • Polyimide polymer composition, method for producing the same, and polyimide film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] Embodiment 1: the manufacture of the polyimide polymer solution that is used to manufacture transparent polyimide film

[0045] While making nitrogen pass through a temperature-adjustable stirring reactor connected to a nitrogen injection device and a dropping funnel, after filling 704.2 g of DMAC at room temperature, make 32.02 g (0.1 mol) of TFMB as a fluorine-based diamine monomer to dissolve. 8.83 g (0.03 mol) of aromatic monomer BPDA and 31.1 g (0.07 mol) of fluorine monomer 6FDA were put and reacted as an acid anhydride monomer there. After 1 hour of complete dissolution, pyridine and acetic anhydride as a catalyst and a dehydrating agent were charged, heated to 70° C., reacted for 1 hour, and cooled to normal temperature.

[0046] Afterwards, the precipitate was solidified in a mixed solution of MeOH and distilled water (3:1). After fully washing in MeOH, it was fully dried in a vacuum oven at 80° C. for 6 hours to obtain a polyimide polymer solid.

[0047] Af...

Embodiment 2

[0056] Embodiment 2: the manufacture of transparent polyimide film

[0057] Utilize the applicator (applicator), with the wet film thickness of 400 μ m, the polyimide polymer solution obtained in the above-mentioned embodiment 1, comparative example 1 and comparative example 2 is coated on the glass substrate, then in convection oven (convection oven) was heated and dried to 280° C. to manufacture a polyimide film with a thickness of 30 μm.

Embodiment 3

[0058] Embodiment 3: the manufacture of the polyimide polymer solution that is used to manufacture colored polyimide film

[0059]While making nitrogen pass through a temperature-adjustable stirred reactor connected to a nitrogen injection device and a dropping funnel, after filling 242.45 g of DMPA at room temperature, 10.91 g of PPDA was completely dissolved, and then 26.48 g of BPDA and 2.18 g of PMDA. After the complete dissolution and 1 hour later, 0.2 g of PA was injected and reacted for 16 hours to synthesize polyacrylamide (PA A, Polyacrylamide). Afterwards, 4,4'-methylenebis(N,N-diglycidylaniline) with a monomer (DMPA, BPDA and PMDA) content of 4000ppm was dissolved in the same solvent as the reaction solvent, and added to Mixing is carried out in the PAA at the end of the reaction.

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PUM

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Abstract

Provided are a polyimide polymer composition, a method for producing the same, and a polyimide film using the same. The polyimide polymer composition comprises a dimethyl propionamide and a polyamic acid-polyimide copolymer of Chemical Formula 1, thereby providing a thermal expansion coefficient (CTE) as compared with a conventional polar solvent and the like.(wherein R1 is a fluorine group or an aromatic anhydride monomer, R is a diamine monomer Body, n is a constant from 1 to 1,000, and m is a constant from 1 to 1,000.

Description

technical field [0001] The present invention relates to a polyimide polymer composition, a method for producing the same, and a polyimide film using the polyimide polymer composition. Background technique [0002] Compared with other polymers, polyimide resin has excellent electrical, thermal, chemical, and mechanical properties, so it is widely used in the fields of heat-resistant advanced materials and electronic materials. In particular, in the field of displays, it has attracted attention as a material for producing flexible substrates because of its high heat resistance. [0003] In order to synthesize a polyimide, a diamine monomer, a dianhydride monomer, and a polar solvent are generally used. Depending on the imidization method, thermal imidization methods, chemical imidization methods, etc. are often used, and in order to apply chemical imidization methods, chemical imidization reactions are also performed using catalysts and dehydrating agents. [0004] In order ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08G73/10C08J5/18
CPCC08G73/1067C08J5/18C08J2379/08
Inventor 车荣哲朴势周安民石李承埈边滋勋洪宇成朴圣然郑载勋裵珉英梁奇锡李相准金东敏
Owner DONGJIN SEMICHEM CO LTD
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