Epoxylite low temperature cured type high strength adhesive
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A curing-type, epoxy-based technology, applied in the direction of adhesives, epoxy resin glue, non-polymer adhesive additives, etc., can solve the problem that structural adhesives cannot meet the construction conditions, the degree of crosslinking of epoxy adhesives is not enough, Reinforced quality impact and other issues, to achieve the effect of good structure, low odor, and stability
Inactive Publication Date: 2017-07-07
CARBON COMPOSITESTIANJIN CO LTD
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[0004] Since the development of society, due to environmental and other related factors, some projects need to be constructed in a low temperature environment. Conventional epoxy structural adhesives need to be cured at room temperature or in a heated environment to achieve the expected strength and adhesion. Therefore, the conventional structure Adhesives can no longer meet the construction conditions
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Embodiment 1
[0032] An epoxy low-temperature curing type high-strength adhesive, according to parts by weight of raw materials, includes:
[0033] Modified bisphenol A epoxy resin: 20 parts;
[0034] Modified bisphenol F type epoxy resin: 60 parts;
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Abstract
The invention discloses an epoxylite low temperature cured type high strength adhesive. The epoxylite low temperature cured type high strength adhesive is prepared from, by weight, modified bisphenol A epoxy resin, modified bisphenol F epoxy resin, an -SH group modified amine curing agent, 692 epoxy active diluent, a silane coupling agent and a special accelerant. According to the epoxylite low temperature cured type high strength adhesive, the problems are solved that a common epoxylite adhesive is not sufficient in curing cross-linked density and poor in adhesive force in a low temperature environment, can be cured from a low temperature (15 DEG C) to a normal temperature, can reach high cross-linking density as usual without post curing, is small in smell, is extremely low in toxicity and good in toughness, is not fractured at the low temperature, can maintain a good constitutive property after being cured, thus guarantee structural stability, has good adhesive strength both for most metal and non-metal building materials, is used in the low temperature environment, is matched with carbon fiber for curing construction and adhesive curing for waterproofing, anti-corrosion paints and other low temperature application occasions, and is widely applied to many fields of electron, buildings, chemical building materials and the like.
Description
Technical field [0001] The invention relates to an adhesive, in particular to an epoxy low-temperature curing type high-strength adhesive. Background technique [0002] Structural adhesive refers to high strength, that is, compressive strength> 65 MPa, steel-steel positive tensile bonding strength> 30 MPa, shear strength> 18 MPa, can withstand larger loads, and is resistant to aging, fatigue, and corrosion. Stable performance during the life span, suitable for adhesives for bonding strong structural parts. Therefore, structural adhesives are widely used in engineering, mainly used for reinforcement, anchoring, bonding, repairing, etc., such as bonded steel, bonded carbon fiber, bonded magnetic steel, planted reinforcement, crack reinforcement, sealing, hole repair, road studs Pasting, surface protection, concrete bonding, etc. Non-structural adhesives have low strength and poor durability, and can only be used for bonding, sealing, and fixing of ordinary and temporary ...
Claims
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Application Information
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