Automatic optical alignment device and method of silicon-based photonic device

Abstract

The present invention discloses an automatic optical alignment device and method of a silicon-based photonic device. The method comprises the following steps that: an optic fiber probe performs two-dimensional scanning in a delimited region of the surface of a chip to be detected point by point, and reflected light optical power detection is performed on points which are separated from each other by certain positions, and the delimited region contains a target device and reflectors; after the scanning of the delimited region is completed, corresponding information of the positions and optical power is obtained, and coordinates enabling maximum power are found out, and the coordinates are the position of one of the reflector, and the position of the other reflector is obtained with the same manner described above; and the relative positions of the positions of the reflectors and the input / output point of the target device are fixed, so that the input / output point of the target device is found out through the positions of the two reflectors, and an input / output optical fiber is aligned with the vertical coupling grating structure of the target device. The device and method have the advantages of simple operation, greater simplicity in algorithm implementation and short optical alignment time. With the automatic optical alignment device and method adopted, the process of optical alignment is greatly simplified, and the cost of a system is decreased. The automatic optical alignment device and method are suitable for the operation of ordinary users.

Description

technical field [0001] The invention relates to a silicon-based photonic chip detection technology, in particular to an automatic light alignment device and method for a silicon-based photonic device. Background technique [0002] Silicon-based photonic integration technology has received extensive attention in the past ten years, and has developed rapidly in the fields of communication transmission, data processing, and biochemical sensing. With the development of these technologies, the coupling packaging technology of silicon-based photonic chips has also been widely studied. For silicon-based photonic integrated chips, there are currently two coupling methods, one is end-face coupling, that is, the end face of the optical waveguide and the optical fiber. The end faces are aligned in parallel, and the light emitted by the optical fiber or waveguide is directly sent and received by a certain degree of collimation; the other is vertical coupling, and the signal is received ...

AI Technical Summary

Problems solved by technology

In the field of biochemical sensing, silicon-based micro-nano devices (such as micro-rings) can achieve a high degree of integration on a tiny chip due to their ultra-small sensor size, thereby realizing multi-substance sensing on the same chip. To supply the coupled and packaged chips to customers, it is bound to use array fibers to transmit multiple sensor signals on the chip in batches. However, this method will inevitably increase the packaging cost of a single chip due to the introduction of array fibers.

At present, the image recognition technology is used to realize the positioning of the sensor. The algorithm of the image recognition technology is more complicated, the cost is high, and it is not suitable for mass production.

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