Printed circuit board character marking ink composition and circuit board

A printed circuit board and ink composition technology, which is applied to printed circuit components, ink, circuit inspection/recognition, etc., can solve the problems of complex process, low efficiency, and inability to fundamentally eliminate easy color variation, and achieve good attachment Concentrates and prevents the effect of heterochromia

Active Publication Date: 2017-07-14
深圳市容大感光科技股份有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, printed circuit boards usually undergo the following process after the circuit is made: printing solder resist ink-pre-baking-exposure-development-drying-printing characters-final curing-chemical gold plating-wave soldering, but the characters under this process Marking inks are prone to heterochromia (i.e. the composition tends to turn pink)
In order to avoid this kind of phenomenon, the usual solution is to improve the easy color phenomenon by adjusting the sequence of character printing, that is: printing solder resist ink - pre-baking - exposure - develo

Method used

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  • Printed circuit board character marking ink composition and circuit board
  • Printed circuit board character marking ink composition and circuit board
  • Printed circuit board character marking ink composition and circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0053] Mix the components shown in Table 1 according to the ratio (unit: gram) shown in Table 1, disperse at high speed for 10 minutes with a disperser, and then grind with a three-roll mill to obtain a printed circuit with a particle size of less than 20 microns Plate character marking ink composition.

[0054] Table 1:

[0055]

[0056]

[0057] #1: E51 purchased from Kunshan Nanya Electronics Company;

[0058] #2: Purchased from Shandong Shengquan phenolic epoxy resin SQPN-051;

[0059] #3: Superfine melamine purchased from Nanjing Meikai Company;

[0060] #4: Antioxidant Irganox1010 purchased from BASF, Germany;

[0061] #5: Titanium dioxide R930 purchased from Ishihara, Japan;

[0062] #6: Superfine talcum powder purchased from Guangxi Guihua brand;

[0063] #7: A1 precipitated barium sulfate purchased from Guangzhou Jimei Company;

[0064] #8: dispersant dispersant dispersant-111 purchased from German BYK chemical company;

[0065] #9: Silicone defoamer purc...

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PUM

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Abstract

The invention relates to a printed circuit board character marking ink composition. The composition comprises (A) 10 to 60% by weight of epoxy resin, (B) 0.5 to 20% by weight of an epoxy resin curing agent, (C) 0.05 to 5% by weight of an antioxidant, (D) 5 to 50% by weight of a white pigment, (E) 5 to 50% by weight of an inorganic filler, (F) 0.05 to 10% by weight of a surfactant and (G) 0.05 to 20% by weight of an organic solvent and optionally, assistants such as a dispersing agent, a defoaming agent, a thixotropic agent and an adhesion promoter. The printed circuit board character marking ink composition is characterized in that the surfactant comprises polytetrafluoroethylene powder. In addition, the invention relates to a circuit board using the printed circuit board character marking ink composition.

Description

technical field [0001] The invention relates to a printed circuit board character marking ink composition and a circuit board. Background technique [0002] When forming a symbol mark on a printed circuit board, the conventional method is: after applying the printed circuit board character mark ink composition to the substrate by a printing method such as screen printing, the ink is cured by heating. Recently, with the continuous improvement of printed circuit board manufacturing technology, people not only have higher and higher requirements for the performance of printed circuit boards, but also put forward stricter requirements for the appearance of printed circuit boards. At present, the printed circuit board usually undergoes the following process after the completion of the circuit: printing solder resist ink - pre-baking - exposure - development - drying - printing characters - final curing - chemical gold plating - wave soldering, but the characters under this proces...

Claims

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Application Information

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IPC IPC(8): C09D11/102C09D11/03H05K1/02
CPCC09D11/03C09D11/102H05K1/0266
Inventor 卜江杨遇春邹绍祥
Owner 深圳市容大感光科技股份有限公司
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