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Boron bismuth white light glass matched with blue-ray LED chip and preparation method thereof

A technology of LED chip and white light, which is applied in the field of boron-bismuth white light glass and its preparation, can solve the problems of high cost of white light LED glass, and achieve the effects of convenient large-scale production, good thermal stability and low preparation cost

Inactive Publication Date: 2017-08-15
JIANGXI UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the defects of high cost and room for further improvement of the luminous properties of the existing white light LED glass, and provide a boron-bismuth white light glass matching the blue light LED chip and its preparation method

Method used

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  • Boron bismuth white light glass matched with blue-ray LED chip and preparation method thereof
  • Boron bismuth white light glass matched with blue-ray LED chip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] Weigh H 3 BO 3 1.219g, Bi 2 O 3 8.01g, SiO 2 0.135g, ZnO 0.146g, CaCO3 0.36g, Eu 2 O 3 0.317g, after mixing and grinding the above raw materials uniformly, put it into a high-temperature furnace, uniformly heat it from room temperature to 900 ℃, keep the temperature for 60 minutes, then naturally cool to room temperature and grind it, then mix the powder with YAG:Ce 0.357g and grind it uniformly, Heating evenly from room temperature to 700°C, holding for 20 minutes, taking out the high temperature and pouring it into a graphite mold, then placing it in a 400°C annealing furnace for 120 minutes, naturally cooling to room temperature and then grinding and polishing, the obtained BBSZCE white glass has a glass transition point temperature At 425°C, under the excitation of a current of 350mw and a 450nm blue light chip, the color coordinates are (0.349, 0.386), the color temperature is 4961K, the color rendering index is 71.3, and the lumen efficiency is 62.3lm / w. ...

Embodiment 2

[0021] Weigh H 3 BO 3 1.196g, Bi 2 O 3 9.436g, Sb 2 O 3 0.656g, CaCO3 0.225g, Eu 2 O 3 0.317g, after mixing and grinding the above raw materials evenly, put it into a high-temperature furnace, uniformly heat it from room temperature to 850 ℃, keep it for 80 minutes, then naturally cool to room temperature and grind it, then mix the powder with YAG:Ce 0.473g and grind it evenly, Heating evenly from room temperature to 670°C, holding for 15 minutes, taking out the high temperature and pouring it into a graphite mold, and then placing it in a 380°C annealing furnace for 120 minutes, naturally cooling to room temperature and then grinding and polishing. The obtained BBSCE white glass has a glass transition point temperature. At 395°C, under the excitation of a current of 350mw and a 450nm blue light chip, the color coordinates are (0.346, 0.382), the color temperature is 4872K, the color rendering index is 72.1, and the lumen efficiency is 63.5lm / w.

Embodiment 3

[0023] Weigh H 3 BO 3 1.169g, Bi 2 O 3 9.645g, Sb 2 O 3 0.656g, BaCO3 0.444g, Eu 2 O 3 0.317g, after mixing and grinding the above raw materials uniformly, put it into a high-temperature furnace, uniformly heat it from room temperature to 800 ℃, keep the temperature for 70 minutes, then naturally cool to room temperature and grind it, then mix the powder with YAG:Ce 0.489g and grind it uniformly, Heating evenly from room temperature to 650°C, holding for 15 minutes, taking out the high temperature and pouring it into a graphite mold, then placing it in a 370°C annealing furnace for 120 minutes, naturally cooling to room temperature and then grinding and polishing, the obtained BBSBE white glass has a glass transition point temperature At 390°C, under the excitation of a current of 350mw and a 450nm blue light chip, the color coordinates are (0.339, 0.387), the color temperature is 4892K, the color rendering index is 71.8, and the lumen efficiency is 65.6lm / w.

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Abstract

The invention discloses a boron bismuth white light glass matched with a blue-ray LED chip. A chemical formula is x1B2O3.x2Bi2O3.x3SiO2.x4Sb2O3.x5ZnO.x6MO.x7Eu2O3.x8(YAG:Ce), wherein M is one or more of Ca, Sr and Ba; x1 to x7 is at mole ratio; x8 is the weight percent of the materials related to x1 to x7 in the total weight; x1 is more than or equal to 0.25 and less than or equal to 0.7; x2 is more than or equal to 0.15 and less than or equal to 0.6; x3 is more than or equal to 0 and less than or equal to 0.15; x4 is more than or equal to 0 and less than or equal to 0.1; x5 is more than or equal to 0 and less than or equal to 0.2; x6 is more than or equal to 0 and less than or equal to 0.2; x7 is more than or equal to 0.005 and less than or equal to 0.05; x8 is more than or equal to 0.02 and less than or equal to 0.1. The boron bismuth white light glass can effectively match with the present commercial blue-ray LED chip for emitting white light. The method is characterized by low preparation cost, low product color temperature, high thermal stability and moderate color rendering index and light emitting rate.

Description

technical field [0001] The invention relates to the light-emitting technical field of light-exciting semiconductor blue-light chips and emitting warm white light, in particular to a boron-bismuth white light glass matching a blue-light LED chip and a preparation method thereof. Background technique [0002] White LEDs are widely used in general lighting, indicating displays, backlights, automotive headlights and other fields because of their long life, energy saving, and environmental friendliness. At present, the white light emitted by commercial LEDs is mainly composed of the blue light emitted by the InGaN semiconductor chip and the yellow light emitted by the YAG phosphor under the excitation of the blue light chip. Although this device has a mature preparation process, it has obvious shortcomings. On the one hand, since YAG phosphors are applied to the chip by means of silica gel or epoxy resin organic compounds, these organic compounds are easily aged or yellowed due t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C03C3/068C03C3/15C03C4/12
CPCC03C3/068C03C3/15C03C4/12
Inventor 夏李斌肖青辉李子成王林生叶信宇游维雄
Owner JIANGXI UNIV OF SCI & TECH