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Copper bonding wire

A brazing and high-quality technology, applied in the direction of electrical components, circuits, electrical solid devices, etc., can solve problems such as difficulty in controlling the shape of 1st joints and difficulty in coping with fine pitches

Inactive Publication Date: 2017-08-29
TATSUTA ELECTRICWIRE & CABLE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the copper bonding wire of the following patent document 1, it is difficult to control the shape of the 1st joint part, and there is a problem that it is difficult to cope with finer pitches.

Method used

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  • Copper bonding wire
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Examples

Experimental program
Comparison scheme
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Embodiment

[0035] Hereinafter, although an Example demonstrates this invention more concretely, this invention is not limited to these Examples.

[0036] Using a copper raw material with a purity of 99.99% by mass or higher and a copper raw material with a purity of 99.9999% by mass or higher, a copper alloy having a composition shown in Table 1 below was melted, and a rod-shaped ingot with a diameter of 8 mm was produced by a continuous casting method. The produced rod-shaped ingot was subjected to wire drawing to reduce the diameter to 20 μm in diameter, and then subjected to quenching and tempering heat treatment to form a copper wire.

[0037] [Table 1]

[0038]

[0039] For the bonding wires produced in Examples 1 to 21 and Comparative Examples 1 to 4, the stability of the FAB shape, the roundness of the 1st joint, the corrosion resistance of the wire (HTST: High Temperature Storage Test), and the 1st joint were evaluated. Corrosion resistance (HAST), economy and comprehensive eva...

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Abstract

Provided is a copper bonding wire with which an FAB having a satisfactory shape can be formed even when nitrogen gas is used as the atmosphere gas during FAB formation, and a satisfactory circle can be obtained for the shape of the FAB when brought into contact with an electrode and crushed. This invention has a gold content of 0.5-5.0 mass% and a sulfur content of 1-15 mass ppm, with the remainder made up by copper and unavoidable impurities.

Description

technical field [0001] The present invention relates to a copper bonding wire that connects electrodes of a semiconductor element and electrodes of a substrate. Background technique [0002] In general, bonding wires used for connecting electrodes on a semiconductor element and electrodes on a substrate are very thin, so a metal material with good electrical conductivity and excellent workability is used. In particular, from the standpoint of chemical stability and ease of handling in the atmosphere, gold bonding wires made of gold (Au) have been used conventionally. However, since more than 99% of the weight of gold bonding wires is gold, the price is very high, so it is desired to use cheaper Copper (Cu) copper bonding wire. [0003] However, in order to form a free air ball (FAB: Free Air Ball) with a high sphericity and a good shape when performing ball bonding to the electrode of a semiconductor element with a copper bonding wire, it is necessary to mix hydrogen, which...

Claims

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Application Information

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IPC IPC(8): H01L21/60C22C9/00C22F1/00C22F1/08
CPCH01L24/05H01L24/43H01L24/45H01L2224/05624H01L2224/4321H01L2224/43848H01L2224/45015H01L2224/45144H01L2224/45147H01L2224/48463H01L2224/48507H01L2224/85045H01L2924/00011H01L2924/01016H01L2924/01079H01L2924/01202H01L2924/00015H01L2924/01078H01L2924/01046H01L2924/20751H01L2924/20752H01L2924/20753H01L2924/20754H01L2924/20755H01L2924/00014H01L2924/01047H01L2924/01204H01L2924/20108H01L2924/20109H01L2924/2011H01L2924/20111H01L2924/01206H01L2924/01004H01L2924/01033H01L2924/01205H01L2224/45114
Inventor 长谷川刚哈齐克·沙姆斯丁
Owner TATSUTA ELECTRICWIRE & CABLE