Layered electroforming method for slotted rectangular waveguides
A rectangular waveguide and electroforming technology, which is used in electroforming and electrolysis processes to achieve the effects of strong process adaptability, improved processing efficiency and reduced processing time.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2019-01-11
Smart Images

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Abstract
Description
Technical field
[0001] The layered electroforming method of a slotted rectangular waveguide of the present invention mainly relates to electroforming processing and belongs to the technical field of electric processing. Background technique
[0002] Terahertz waves refer to electromagnetic waves with frequencies ranging from 0.1 THz to 10 THz and wavelengths ranging from 0.03 mm to 3 mm. The unique properties of terahertz waves have had a profound impact on broadband communications, radar imaging, electronic countermeasures, electromagnetic weapons, security inspections, non-destructive testing and other fields, and have broad application prospects in the field of national security. For example, compared with microwave radar, terahertz radar has the advantages of high resolution, strong confidentiality, outstanding anti-interference ability, and strong ion body penetration ability.
[0003] Metal waveguide is a commonly used transmission line in the THz low-frequency band. ...
Examples
Embodiment Construction
[0028] The slotted rectangular waveguide that needs to be prepared is as Figure 10 As shown, the following preparation process is adopted:
[0029] Step 1: coating a layer of photoresist 2 with a thickness of L1 on the surface of the substrate 1;
[0030] Step 2: Place the substrate 1 that has been coated for the first time in step 1 on the stage of the lithography machine, and use the first exposure mask 3 to perform the first exposure;
[0031] Step 3: Put the substrate 1 after the first exposure in step 2 into the developing solution for the first development, wash and dry after development;
[0032] Step 4: Electroform a layer of thickness L1 on the surface of the substrate 1 after the first development in step 3
[0033] Copper 4;
[0034] Step 5: Perform precision polishing on the surface of the electroformed copper 4 in step 4 to ensure that the thickness of the first layer of copper 4 is L2;
[0035] Step 6: Coating a layer of photolithography with a thickness of ...