Laser multi-focus dynamic machining method and system

A dynamic processing and multi-focus technology, which is applied in the direction of metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the difficulty of debugging the same optical axis of each focusing sheet with increased error, the increase of accumulated error of multi-focus lens groups, and the laser Increased energy loss and other issues, to achieve the effect of reducing laser energy loss, increasing thickness, and increasing distance

Pending Publication Date: 2017-10-13
HUAZHONG UNIV OF SCI & TECH
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Problems solved by technology

[0008] However, this method also requires an increase in the number of static laser focal points as the thickness of the material increases, resulting in an increase in the number of focusing lenses in the multi-focus lens group. The laser energy loss increases due to absorption. On the other hand, with the increase in the number of focusing lenses, it not only increases the difficulty of design and production, but also increases the cost sharply. Moreover

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  • Laser multi-focus dynamic machining method and system
  • Laser multi-focus dynamic machining method and system
  • Laser multi-focus dynamic machining method and system

Examples

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example 1

[0044] In this embodiment, one of the laser multi-focus dynamic processing systems of the present invention is used to cut and separate the KDP crystal with a thickness of 100 mm.

[0045] The laser source in the laser multi-focus dynamic processing system is a fiber continuous laser with a wavelength of 1064nm, an output power of 100W, an output spot diameter of 0.8mm, and a dynamic focusing lens with a focal length of 150mm. The first total reflection mirror in the multi-focus derivative system is a spherical mirror with a diameter of 60 mm, a mirror focal length of 35 mm, and a small hole diameter of 1 mm; the second total reflection mirror is an aspheric mirror with a mirror focal length of 48.5 mm. The transparent material to be processed is KDP crystal (full name in Chinese: potassium dihydrogen phosphate crystal), with a thickness of 100mm and an absorption rate of 5% for a wavelength of 1064nm. The distance from the first total reflection mirror to the surface of the t...

example 2

[0048] In this embodiment, the second laser multi-focus dynamic processing system of the present invention is used to cut and separate soda-lime glass with a thickness of 40 mm.

[0049] The system uses an ytterbium-doped fiber laser with an output wavelength of 1070nm and a peak power of 1000W to cut and separate soda-lime glass with a size of 100mm×100mm and a thickness of 40mm.

[0050] Experimental method: Three focusing lenses are used to form a multi-focus lens group, and the position and parameters of each laser focusing lens are adjusted to generate four focal points in the soda-lime glass, which are evenly distributed along the thickness direction of the soda-lime glass. The first laser focus generated is located in the soda-lime glass, 5mm away from the incident surface of the material. The energy distribution of the four laser focuses is 20%, 30%, 30%, and 20% respectively, and the distance between each focus is 10mm. The focal length of the dynamic focusing lens is...

example 3

[0053] Two pairs of KDP crystals with a thickness of 200 mm are cut and separated by using the laser multi-focus dynamic processing system of the present invention.

[0054] The laser light source is an all-solid-state green laser with a wavelength of 532nm and a peak output power of 500W. The KDP crystal sample with a size of 500mm×500mm and a thickness of 200mm is cut and separated.

[0055] Experimental method: A multi-focus lens group composed of three focusing lenses is used to adjust the position and parameters of the laser focusing lens so that the focused laser beam produces four laser focuses in the KDP crystal, and the focal distance is 40mm. The distance between the first laser focal point and the incident surface of the KDP crystal is 40mm. The energy distribution of the four laser focal points is 20%, 30%, 25%, and 25%. The laser power is adjusted to 500W, and the laser scanning speed is 0.2mm / s. , scan along a straight line trajectory.

[0056] Experimental resu...

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Abstract

The invention discloses a laser multi-focus dynamic machining method and system, and belongs to the technical field of laser machining application. The method includes the steps that multiple same-optical-axis focus points incoming into a to-be-machined object do back and forth movement at set frequency along the direction of the optical axis, and therefore each laser focus does linear back and forth movement in the thickness direction of the to-be-machined object, and therefore the static point heating manner is converted into linear dynamic heating manner. The invention further provides a device for achieving the above method. A multi-focus derivative system or multi-focusing-lens set is adopted for enabling lasers to form multiple laser focuses in the to-be-machined transparent material. By means of the method, high quality and high efficiency cutting separation of the thicker transparent fragile material can be achieved. The device is relatively simple in structure and easy to control.

Description

technical field [0001] The invention belongs to the technical field of laser processing applications, and in particular relates to a laser multi-focus dynamic processing method and system. Background technique [0002] When laser cutting and separating transmissive brittle materials, laser thermal crack control method is usually used. The principle of cutting and separation is: using the high absorption rate of a transparent material for a laser beam to form a surface to absorb laser light energy, heating the surface of a transparent brittle material, or using the characteristics of a low absorption rate of a transparent brittle material for a certain laser beam to make the laser The beam runs through the entire transparent and brittle material, forming a body to absorb the laser light energy, and heating the transparent and brittle material as a whole. The heated part of the material forms a larger compressive stress due to expansion. With the movement of the laser beam, ...

Claims

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Application Information

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IPC IPC(8): B23K26/046B23K26/38B23K26/402
CPCB23K26/046B23K26/38B23K26/402
Inventor 段军邓磊敏刘朋曾晓雁
Owner HUAZHONG UNIV OF SCI & TECH
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