Low-temperature Ge-containing Sn-Bi solder used for photovoltaic solder strip and preparation method thereof

A photovoltaic ribbon and low-temperature solder technology, applied in welding equipment, welding/cutting media/materials, welding media, etc., can solve problems such as increasing alloy brittleness, improve corrosion resistance, ensure accuracy, and prevent metal oxidation Effect

Inactive Publication Date: 2017-10-20
SUZHOU YOURBEST NEW TYPE MATERIALS +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, higher Bi content increases the brittleness of the alloy

Method used

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  • Low-temperature Ge-containing Sn-Bi solder used for photovoltaic solder strip and preparation method thereof
  • Low-temperature Ge-containing Sn-Bi solder used for photovoltaic solder strip and preparation method thereof
  • Low-temperature Ge-containing Sn-Bi solder used for photovoltaic solder strip and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048]When smelting, first mechanically stir metal powders such as pure tin (Sn), pure bismuth (Bi) and pure germanium (Ge) with mass ratios of 54.975wt%, 45wt%, and 0.025wt%, respectively, and mix the metal powders evenly placed in a quartz crucible. Cover the surface of the metal powder with KCl and LiCl mixed salt with a mass ratio of 1.3:1, and then place the quartz crucible in a resistance furnace at 500°C for heating until the metal powder and mixed salt are melted to form molten solder, and stir once every 15 minutes. The tissue is homogenized to form liquid solder. The liquid solder was cooled to room temperature, and the mixed salts were washed away by ultrasonic cleaning to obtain Ge-containing low-temperature Sn-Bi solder, and the solder prepared in this embodiment was made into a solder ribbon. According to the national standard GB / T 228.1-2010, the as-cast alloy was prepared into a tensile sample, and the mechanical properties of the alloy were measured at a tens...

Embodiment 2

[0052] During smelting, the pure tin, pure bismuth and pure germanium powders with mass ratios of 54.9wt%, 45wt%, and 0.1wt% were mechanically stirred, and the obtained uniformly mixed metal powders were placed in a quartz crucible. Cover the mixed salt of KCl and LiCl with a mass ratio of 1.3:1 on the surface of the uniformly mixed metal powder, place the quartz crucible in a resistance furnace at 550°C for heating, and wait for the metal powder and mixed salt to melt to form molten solder, 15 Stir once every minute to homogenize the tissue and form liquid solder. The liquid solder was cooled to room temperature, and the salts were washed away by ultrasonic cleaning to obtain Ge-containing low-temperature Sn-Bi solder, and the solder prepared in this embodiment was made into a solder strip. According to the national standard GB / T 228.1-2010, the as-cast alloy was prepared into a tensile sample, and the mechanical properties of the alloy were measured at a tensile rate of 6mm / ...

Embodiment 3

[0056] During smelting, the metal powders of pure tin, pure bismuth and pure germanium with a mass ratio of 49.75wt%, 52wt%, and 0.05wt% were mechanically stirred, and the obtained uniformly mixed metal powders were placed in a quartz crucible. Cover the surface of the uniformly mixed metal powder with KCl and LiCl mixed salt with a mass ratio of 1.3:1, place the quartz crucible in a resistance furnace at 600°C for heating, and wait for the metal powder and mixed salt to melt to form molten solder, 15 Stir once every minute to homogenize the tissue and form liquid solder. The liquid solder was cooled to room temperature, and the salts were washed away by ultrasonic cleaning to obtain Ge-containing low-temperature Sn-Bi solder, and the solder prepared in this embodiment was made into a solder strip. According to the national standard GB / T 228.1-2010, the as-cast alloy was prepared into a tensile sample, and the mechanical properties of the alloy were measured at a tensile rate ...

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Abstract

The invention discloses low-temperature Ge-containing Sn-Bi solder used for a photovoltaic solder strip. The low-temperature Ge-containing Sn-Bi solder used for the photovoltaic solder strip comprises, by weight, 35%-52% of Bi, 0.025%-0.1% of Ge, and the balance Sn. The invention further discloses a preparation method of the low-temperature Ge-containing Sn-Bi solder used for the photovoltaic solder strip. According to the low-temperature Ge-containing Sn-Bi solder used for the photovoltaic solder strip, by controlling the content of the key element Bi and adding the trace element Ge, grains are refined, and the corrosion resistance of Sn-Bi alloy is improved; and the melting point of the solder is low, and the wettability of the solder is good, so that it is ensured that a copper strip is effectively wetted by the solder, and traditional Sn-Pb solder can be replaced by the low-temperature Ge-containing Sn-Bi solder.

Description

technical field [0001] The invention relates to a low-temperature solder and a preparation method thereof, in particular to a low-temperature Sn-Bi solder for a Ge-containing photovoltaic ribbon and a preparation method thereof. Background technique [0002] To realize the power generation function of solar modules, photovoltaic ribbons must be used to connect solar cell modules to meet the current and voltage requirements. Photovoltaic ribbon is the conductive lead belt of solar cells. It will lead the electrical energy converted from light energy on silicon wafers to electrical equipment, and also play a role in heat dissipation and mechanical manufacturing. It is one of the important functional components of solar photovoltaic cells. Ribbon is an important raw material in the welding process of photovoltaic modules. The quality of the ribbon will directly affect the current collection efficiency of photovoltaic modules and greatly affect the power of photovoltaic modules....

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/264B23K35/262B23K35/40
Inventor 肖锋周健田爽朱骄峰李赛鹏
Owner SUZHOU YOURBEST NEW TYPE MATERIALS
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