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Preparation process of high-purity oxygen-free copper tube target material for sputtering

An oxygen-free copper tube and preparation process technology, which is applied in metal material coating process, sputtering plating, ion implantation plating, etc., can solve the problems of long procurement cycle, complicated process and high cost

Inactive Publication Date: 2017-10-20
中铝洛阳铜加工有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to its high cost, complex process, high technical and quality requirements, and long procurement cycle, it needs a large amount of imports. In order to develop the country's economy and technology, how to replace imported materials with domestic materials to meet international standards for high-end high-purity copper targets, It has become a technical problem that has been difficult to solve for a long time

Method used

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  • Preparation process of high-purity oxygen-free copper tube target material for sputtering

Examples

Experimental program
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Effect test

Embodiment 1

[0030] Manufacture of LC1012 alloy pipes in M ​​state ф159×122 (inner)×895mm:

[0031] Preheating: The raw material is made of high-purity oxygen-free copper alloy, the copper content is more than 99.99%, the oxygen content is less than 5ppm, the surrounding burr is cut off, the thickness is more than 15mm, there is no copper bean or patina, dry and clean, for raw materials with copper bean or patina After removing the copper beans or verdigris, dry and clean them for later use, and then enter the preheating drying furnace for preheating. The preheating drying furnace adopts a cathode copper baking furnace, and the preheated raw materials are equal to or greater than 200°C;

[0032] Smelting: Add the preheated raw materials into the melting furnace at a feeding rate of 2 to 3 minutes per block. Slits are set on the melting furnace so that the raw materials to be added can be fed into the melting furnace through the slits. Deoxidation is not added to the melting furnace Precipi...

Embodiment 2

[0044] Preheating: The raw material is made of high-purity oxygen-free copper alloy, the copper content is more than 99.99%, the oxygen content is less than 5ppm, the surrounding burr is cut off, the thickness is more than 15mm, there is no copper bean or patina, dry and clean, for raw materials with copper bean or patina After removing the copper beans or verdigris, dry and clean them for later use, and then enter the preheating drying furnace for preheating. The preheating drying furnace adopts a cathode copper baking furnace, and the preheated raw materials are equal to or greater than 200°C;

[0045] Smelting: Add the preheated raw materials into the melting furnace at a feeding rate of 2 to 3 minutes per block. Slits are set on the melting furnace so that the raw materials to be added can be fed into the melting furnace through the slits. Deoxidation is not added to the melting furnace Precipitation deoxidation or deoxidation through charcoal diffusion to achieve low oxyge...

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Abstract

A high-purity oxygen-free copper tube target preparation process for sputtering, mainly used in the IC industry. Casting—heating—extrusion—primary stretching—annealing—secondary stretching—bright annealing—finishing—checking mechanical properties—storage process steps to achieve a purity of more than 99.99%, and impurities below 0.0003% P and 0.0002% Mn, Low-oxygen ultra-low impurity high-purity oxygen-free copper preparation, its purity is higher than the national standard TU1 material, with a purity of more than 99.97%, reaching the American standard C10100 standard, with a purity of more than 99.99%; processing technology research, using appropriate extrusion technology, suitable processing Rate, recrystallization annealing and other measures to make the internal structure of the material uniform and the grain size ≤ 0.080mm.

Description

technical field [0001] The invention relates to a non-ferrous metal material processing technology, in particular to a high-purity oxygen-free copper tube target preparation technology for sputtering. Background technique [0002] At present, the high-end high-purity copper targets required by the IC industry basically all need to be imported, which is not only expensive, but also has complicated import procedures. With the development of China's economy and the deepening of the global industrial division of labor, many flat panel display manufacturers in Japan, South Korea and my country's Taiwan region have transferred their manufacturing bases to mainland China. In the future, mainland China will become the world's largest LCD panel manufacturing center. To reduce production costs, LCD panel manufacturers are shifting their purchase plans of high-purity copper for targets from abroad to domestically. [0003] Since the utilization rate of the copper tube target is as high...

Claims

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Application Information

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IPC IPC(8): C23C14/34
CPCC23C14/3414
Inventor 卢燕游金阁肖赛竹杨海丽苏东东朱迎利王峰施积海赵向东张健张宏涛
Owner 中铝洛阳铜加工有限公司
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