Negative pressure type medium cavity chip system

Abstract

The invention discloses a negative pressure type medium cavity chip system. The system includes a chip assembly and a pumping device, wherein the chip assembly includes a chip film layer, the chip film layer is provided with an inlet, an outlet, and a medium cavity communicated with the inlet and the outlet, the inlet is used for sending a to-be-detected medium to the medium cavity, and the medium cavity is used for holding the to-be-detected medium; and the pumping device is provided with a suction port, and the suction port is in close communication with the outlet of the chip film layer to exhaust the medium cavity so as to form a negative pressure inside the medium cavity. The negative pressure type medium cavity chip system of the present invention facilitates the encapsulation of the to-be-detected medium in the medium cavity, reduces the packaging and manufacturing cost, simplifies the packaging process, and realizes in-situ observation of the liquid-liquid phase and solid-liquid phase interface appearance and / or biochemical reaction performance characterization.

Description

technical field [0001] The invention relates to the technical field of chip systems for transmission electron microscopes, in particular to a negative-pressure dielectric cavity chip system. Background technique [0002] In recent years, due to the transmission electron microscope (TEM, Transmission Electron Microscope), scanning electron microscope (SEM, Scanning Electron Microscope), optical microscope, synchrotron radiation and other equipment, it has been possible to observe high-resolution ultrafine structures. It plays a pivotal role in many frontier research fields such as biology. [0003] However, for further observation of the liquid morphology and reaction changes of nanoscale structures, the working environment under high vacuum conditions of electron microscopy or synchrotron radiation is very limited, thus greatly reducing the scope of application, and also limiting human progress in the liquid microstructure understand and recognize. [0004] At present, in ...

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Problems solved by technology

[0006] 1. The operation steps are complicated and easily lead to the rupture of the observation window of the silicon nitride film;

[0007] 2. Rigorous packaging technology is required. If the resin is used too much, it is easy to contaminate the liquid, and if it is used too little, it will affect the sealing between the windows;

[0008] 3. It is necessary to control the amount of packaging liquid. If the amount is large, the electron beam cannot penetrate, and if the amount is small, it will be volatile;

[0009] 4. The formed chip carrier has a large thickness, which does not match the height of the sample placement port of the TEM sample rod, making it difficult to put it into the TEM for observation

[0010] 5. The yield rate is low, the two silicon nitride films are difficult to align, and the cost is high

[0012] However, it is still difficult to encapsulate the liquid, and a large amount of liquid will be squeezed out when the upper silicon nitride film is covered, so it is impossible to determine whether the liquid is successfully encapsulated into the liquid cavity, the production cost is high, and the chip structure is complicated

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