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Method for manufacturing aluminum alloy electronic device with excellent package airtightness

A technology of electronic devices and aluminum alloys, which is applied in the field of improving the airtightness of aluminum alloy electronic device packaging, and can solve the problems of high scrap rate

Inactive Publication Date: 2019-10-01
成都盘涅科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even with the most advanced laser welding equipment and the most optimized welding process, it is very difficult to make the airtight pass rate of the product reach more than 95%. If the requirements of the standard GJB548B-2005 are followed, the rejection rate is even higher

Method used

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  • Method for manufacturing aluminum alloy electronic device with excellent package airtightness
  • Method for manufacturing aluminum alloy electronic device with excellent package airtightness
  • Method for manufacturing aluminum alloy electronic device with excellent package airtightness

Examples

Experimental program
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Effect test

example 1

[0031] Ultrasonic clean the aluminum alloy packaged device that has been laser welded in acetone for 10 minutes, and then place it in an oven at 50±5°C for 45 minutes and dry it for use. It was observed that there were multiple through-cracks and through-holes formed on the welding seam of the aluminum alloy packaging device that had been laser welded, resulting in that its airtightness could not meet the requirements.

[0032] The aluminum alloy powder whose particle size is in the range of 30-150 μm and whose composition is basically the same as that of the aluminum alloy matrix is ​​used as the first powder. Mechanically mix it with the second powder at a mass ratio of 5:1 to form the powder to be clad, and place the powder to be clad in an oven at 55±5°C for 30 minutes to dry for use. Wherein, the second powder is aluminum brazing flux composed of alkali metal chloride, fluoride, Mg and other active agents.

[0033] Based on the thickness of the standard feeler gauge of 0.5...

example 2

[0037] Ultrasonic clean the aluminum alloy packaged device containing the welding seam in acetone for 15 minutes, and then place it in an oven at 60±5°C for 45 minutes and dry it for use. It has been observed that multiple cracks and through-holes are formed on the welding seam of the aluminum alloy packaging device that has been laser welded, resulting in that its airtightness cannot meet the requirements.

[0038] The aluminum alloy powder whose particle size is in the range of 60-110 μm and whose composition is basically the same as that of the aluminum alloy matrix is ​​used as the first powder. Mechanically mix it with the second powder at a mass ratio of 8:1 to form the powder to be clad, and place the powder to be clad in an oven at 60±5°C to dry for 30 minutes before use. Among them, the second powder is aluminum brazing flux composed of alkaline earth metal fluoride and Ti and other active agents.

[0039] Spread the powder to be clad evenly on the surface of the are...

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Abstract

The invention provides a method for improving the packaging air tightness of an aluminum alloy electronic device. The method comprises the steps that a weld joint formed through welding is cleaned; and a to-be-clad powder layer covering the outer surface of the weld joint is arranged, laser cladding is conducted, the cladding temperature is controlled to be not higher than the temperature tolerance upper limit value of an electronic element in the aluminum alloy electronic device all the time and not higher than 100 DEG C, and therefore a compact bonding layer is formed on the weld joint. According to the method, the air tightness and the yield of aluminum alloy electronic device packaging can be remarkably improved, even the yield can reach 99%, the requirements of many fields such as aerospace can be met, additional protective gas is not needed, the production cost is greatly reduced, and meanwhile operation is easy and convenient.

Description

technical field [0001] The invention relates to the technical field of mechanical manufacturing, in particular, to a method for manufacturing an aluminum alloy electronic device with excellent package airtightness, and a method for improving the package airtightness of an aluminum alloy electronic device. Background technique [0002] Lightweight and miniaturized aluminum alloy electronic devices are important electronic equipment components in aerospace and other fields. In order to protect the bare chips in the device from environmental corrosion and mechanical damage, the bare chips must be packaged in an airtight housing. [0003] In recent years, with the improvement of the harsh level of sealing of electronic devices in engineering applications, almost all newly designed products are packaged by laser welding. However, even with the most advanced laser welding equipment and the most optimized welding process, it is very difficult to achieve an airtight pass rate of mor...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K31/02C23C24/10B23K101/36
CPCB23K31/02B23K2101/36C23C24/103
Inventor 唐建超邓伟唐文骏王进
Owner 成都盘涅科技有限公司