Green immobilized abrasive material polished wafer and preparation method thereof

A polishing sheet and abrasive technology, applied in the direction of grinding/polishing equipment, abrasives, grinding devices, etc., can solve the problems of undiscovered patent documents, etc., to ensure coating uniformity, improve stickiness, and ensure surface processing quality Effect

Inactive Publication Date: 2017-11-17
TIANJIN VOCATIONAL INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] Through the search of published patent documents, no published patent documents identical or similar to this patent application have been found

Method used

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  • Green immobilized abrasive material polished wafer and preparation method thereof
  • Green immobilized abrasive material polished wafer and preparation method thereof
  • Green immobilized abrasive material polished wafer and preparation method thereof

Examples

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Embodiment 1

[0036] A green fixed abrasive polishing sheet, its innovation lies in: it is composed of a base layer and a coating layer, the base layer is a PET film, the thickness of the PET film is 60um, and the thickness of the coating layer is 60um.

[0037] Components and percentages by weight of the coating layer are:

[0038] Silica 2g

[0039] Cornstarch 4g

[0040] Polyketone resin 4g.

[0041] The particle diameter of silicon oxide is 0.1 nm.

[0042] A method for preparing a green fixed abrasive polishing sheet is innovative in that the steps of the preparation method are:

[0043] (1) Weighing: Weigh 2g silicon oxide; 4g cornstarch; 4g polyketone resin, and measure 4g of absolute ethanol;

[0044] (2) Preparation of coating solution: Add the weighed polyketone resin, silicon oxide and starch into a test tube filled with absolute ethanol, and then use an ultrasonic oscillator to mix evenly, so that the polyketone resin, silicon oxide and starch are evenly mixed. Dispersed in...

Embodiment 2

[0048] A green fixed abrasive polishing sheet, its innovation lies in: it is composed of a base layer and a coating layer, the base layer is a PET film, the thickness of the PET film is 70um, and the thickness of the coating layer is 150um.

[0049] Components and percentages by weight of the coating layer are:

[0050] Aluminum oxide 4g

[0051] Cornstarch 3g

[0052] Polyketone resin 3g.

[0053] The particle size of silicon oxide is 1um.

[0054] A method for preparing a green fixed abrasive polishing sheet is innovative in that the steps of the preparation method are:

[0055] (1) Weighing: weigh 4g alumina; 3g cornstarch; 3g polyketone resin, and measure 3g absolute ethanol;

[0056] (2) Preparation of coating solution: Add the weighed polyketone resin, aluminum oxide and starch into a test tube filled with absolute ethanol, and then use an ultrasonic oscillator to mix evenly, so that the polyketone resin, aluminum oxide and starch are evenly mixed. Dispersed in abso...

Embodiment 3

[0060] A green fixed abrasive polishing sheet, its innovation lies in: it is composed of a base layer and a coating layer, the base layer is a PET film, the thickness of the PET film is 80um, and the thickness of the coating layer is 200um.

[0061] Components and percentages by weight of the coating layer are:

[0062] Cerium oxide 5g

[0063] Glutinous rice starch 2.5g

[0064] Polyketone resin 2.5g.

[0065] The particle size of cerium oxide is 100um.

[0066] A method for preparing a green fixed abrasive polishing sheet is innovative in that the steps of the preparation method are:

[0067] (1) Weighing: Weigh 5g cerium oxide; 2.5g glutinous rice starch; 2.5g polyketone resin, measure 2.5g absolute ethanol;

[0068] (2) Preparation of coating solution: Add the weighed polyketone resin, cerium oxide and starch into a test tube filled with absolute ethanol, and then use an ultrasonic oscillator to mix evenly, so that the cerium oxide, starch and polyketone resin are evenly...

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Abstract

The invention relates to a green immobilized abrasive material polished wafer. The green immobilized abrasive material polished wafer is characterized by being composed of a base layer and a coating layer. The base layer is a PET membrane and comprises the following components in percentages by weight: 20-50wt% of an immobilized abrasive material, 25-40wt% of starch and 25-40wt% of polyketone resin. A preparation method of the green immobilized abrasive material polished wafer provided by the invention comprises the following steps of: (1) weighing; (2) preparation of a coating liquid; (3) coating of a coating layer; and (4) curing. According to the immobilized abrasive material polished wafer provided by the invention, both the starch and the polyketone resin are taken as a green and pollution-free adhesive. Single starch as the coating layer of the adhesive is polished in an aqueous condition will be dissolved and the coating layer which is cured is easy to generate fractures. The starch and the polyketone resin which are mixed can improve the uniformity of particles of the coating layer, so that the membrane forming quality is improved, and the membrane forming speed is greatly increased, the work efficiency is increased, the process parameters are controllable, and the green immobilized abrasive material polished wafer is environmental-friendly and pollution-free and convenient to operate, and the polishing effect can be guaranteed.

Description

technical field [0001] The invention belongs to the field of precision machining and relates to a fixed abrasive polishing sheet, in particular to a green fixed abrasive polishing sheet and a preparation method thereof. Background technique [0002] At present, various microelectronic substrate materials (such as substrates of Si, SiC, glass, etc.), fixed abrasive insulating films and ultra-precision processing of microelectronic components need to be polished to ensure the accuracy of the use, and free abrasives are generally used for processing Polishing fluid. However, the free abrasive polishing liquid produces waste liquid after use, which will cause environmental pollution and requires post-processing, and the polishing liquid is suitable for polishing large-area electrical components. [0003] For microelectronic components with a small processing surface, such as the polishing of optical fiber connectors, the use of polishing liquid not only has pollution problems, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D3/00B24D18/00
CPCB24D3/004B24D18/0054
Inventor 林隆华高绮
Owner TIANJIN VOCATIONAL INST
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