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Selective laser sintering method and device based on surface light source

A technology of selective laser sintering and surface light source, applied in the field of additive manufacturing, can solve the problems of different powder sintering times, uneven sintering quality, limited processing range, etc., to achieve uniform molding quality, convenient operation, and improve efficiency.

Inactive Publication Date: 2017-11-24
XI AN JIAOTONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This method of scanning from point to line, from line to surface, and from surface to body through software control of the spot according to the cross-sectional shape of the three-dimensional part model is inefficient. The sintering times are different and difficult to control, the sintering quality is uneven, the precision is poor, and because some materials do not absorb infrared light, the processing range is limited

Method used

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  • Selective laser sintering method and device based on surface light source
  • Selective laser sintering method and device based on surface light source
  • Selective laser sintering method and device based on surface light source

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Effect test

Embodiment 1

[0031] see figure 1 , Figure 4 , Figure 9 and Figure 10 , a selective area laser sintering device based on a surface light source, including a powder spreading system connected to a computer 1, a temperature control system, a light source and an optical path system, wherein the light source is an LED light source group 8, and the optical path system is composed of a TFT liquid crystal display 7. The powder system includes a drum 4, a powder supply cylinder 5, a molding cylinder 6, and a lifting table 11. The temperature control system includes a heater 2 and a temperature sensor 3. The LED light source group 8 includes a plurality of light emitting units 81, and the array of multiple light emitting units 81 Arrangement, a plurality of light emitting units 81 are electrically connected with a light source control unit 82 to control the lighting and extinguishing of the plurality of light emitting units 81, and each light emitting unit of the plurality of light emitting uni...

Embodiment 2

[0034] see figure 2 , Figure 5 , Figure 9 and Figure 10 , a selective laser sintering device based on a surface light source, including a powder spreading system connected to a computer 1, a temperature control system, a light source and an optical path system, wherein the light source is composed of a beam expander 9 and a laser 10. The optical path system consists of a TFT liquid crystal display 7, the powder spreading system includes a drum 4, a powder supply cylinder 5, a forming cylinder 6 and a lifting platform 11, and the temperature control system includes a heater 2 and a temperature sensor 3.

[0035] The work process of the present embodiment is: draw three-dimensional solid model in computer 1, carry out slice processing to three-dimensional solid by software, obtain the information of each section layer and show corresponding two-dimensional image on TFT liquid crystal screen 7; Two-dimensional image The corresponding solid cross-sectional area is a light-t...

Embodiment 3

[0037] see image 3 , Figure 6 , Figure 7 , Figure 8 , Figure 9 and Figure 10 , a selective area laser sintering device based on a surface light source, including a powder spreading system connected to a computer 1, a temperature control system, a light source and an optical path system, wherein the light source is composed of an ultraviolet LED light source group 8 and a light source control system 15, and the optical path system is composed of an optical fiber bundle 12, focusing fiber lens group 13 and imaging lens 14, powder spreading system includes drum 4, powder supply cylinder 5, molding cylinder 6 and lifting platform 11, temperature control system includes heater 2 and temperature sensor 3, the LED light source The group 8 includes a plurality of light emitting units 81 arranged in an array, and the light emitting units 81 are installed on the substrate 86 of the ultraviolet light source group.

[0038] The working process of the present embodiment is: draw a...

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Abstract

The invention discloses a selective laser sintering method and device based on a surface light source. The method comprises the steps of firstly, drawing a three-dimensional solid model in a computer, and carrying out slicing processing on the three-dimensional solid model, so as to acquire information of section layers; converting information of the section layers in the computer into parallel surface light beams of corresponding images through a light source device and a light path system, and irradiating the light beams on powder of a processing layer; after one processing plane is sintered and molded, paving the processing plane with a layer of powder through a roller or scraper, and sintering a new processing layer; and repeating the steps till the entire part is sintered. The device comprises a powder paving system, a temperature control system, the light source device and the light path system which are connected with the computer. According to the selective laser sintering method and device, workpiece selective laser sintering efficiency is improved, molding quality is uniform, and the device is simple in structure, long in service life, and convenient to operate.

Description

technical field [0001] The invention relates to the technical field of additive manufacturing, in particular to a surface light source-based selective laser sintering method and device. Background technique [0002] Selective laser sintering (SLS) is an important additive manufacturing method, which can be used for free forming of various powder materials such as metals, ceramics, polymers, etc. Therefore, it has broad application prospects in the fields of machinery, aerospace, bioengineering and so on. [0003] The existing selective laser sintering technology uses a high-energy infrared laser beam to scan on the preheated powder layer according to the slicing path of the designed entity. The scanned powder will be sintered due to the high temperature generated by the laser, thereby forming a certain shape and At the same time, the melted powder of each layer will also be fused to its next layer; after the sintering of one layer is completed, the workbench is lowered to a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C64/153B29C64/268B29C64/205B22F3/105B33Y10/00B33Y30/00
CPCB33Y10/00B33Y30/00B22F10/00B22F12/44B22F12/42B22F12/90B22F10/28B22F12/13Y02P10/25
Inventor 贺健康仝站国李涤尘蔡智豪孟子捷曹毅王丰平
Owner XI AN JIAOTONG UNIV
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