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Insulating ceramic for integrated circuit substrate and preparation method thereof

A technology of insulating ceramics and integrated circuits, applied in the direction of circuits, electrical components, electrical solid devices, etc., can solve problems such as low insulation performance, low insulation resistance, and reduced product durability, and achieve low production costs and high insulation resistance. Low, the effect of reducing energy consumption

Inactive Publication Date: 2017-11-24
HEFEI TONGYOU ELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the prior art, the insulation resistance value prepared by alumina is low, and the insulation performance is not high, which reduces the durability of the product

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] An insulating ceramic for an integrated circuit substrate, consisting of the following raw materials in parts by weight: 70 parts of willemite, 35 parts of barium titanate, 25 parts of calcined talc, 20 parts of titanium dioxide, 15 parts of silicon dioxide, silicon nitride 10 parts, 5.5 parts of quartz powder, 7.5 parts of mica powder, 5 parts of boron carbide, 7 parts of sodium polyacrylate, 12 parts of phenolic resin, 5.5 parts of alumina, 4 parts of composite additives, 3 parts of binder and 110 parts of deionized water .

[0024] Wherein, the composite additive is a mixture of boric acid, ammonium chloride and aluminum fluoride in a mass ratio of 1:0.3:0.3.

[0025] Wherein, the binder is paraffin or polymethylacrylate.

[0026] A method for preparing an insulating ceramic for an integrated circuit substrate, comprising the following steps:

[0027] (1) Weigh willemite, barium titanate, burnt talc, titanium dioxide, silicon dioxide, silicon nitride, quartz powder...

Embodiment 2

[0035] An insulating ceramic for an integrated circuit substrate, which is composed of the following raw materials in parts by weight: 60 parts of willemite, 30 parts of barium titanate, 20 parts of calcined talc, 10 parts of titanium dioxide, 10 parts of silicon dioxide, silicon nitride 5 parts, 3 parts of quartz powder, 5 parts of mica powder, 2 parts of boron carbide, 5 parts of sodium polyacrylate, 8 parts of phenolic resin, 3 parts of alumina, 2 parts of composite additives, 1 part of binder and 100 parts of deionized water .

[0036] Wherein, the composite additive is a mixture of boric acid, ammonium chloride and aluminum fluoride in a mass ratio of 1:0.2:0.2.

[0037] Wherein, the binder is paraffin or polymethylacrylate.

[0038] A method for preparing an insulating ceramic for an integrated circuit substrate, comprising the following steps:

[0039] (1) Weigh willemite, barium titanate, burnt talc, titanium dioxide, silicon dioxide, silicon nitride, quartz powder, ...

Embodiment 3

[0047] An insulating ceramic for an integrated circuit substrate, which is composed of the following raw materials in parts by weight: 80 parts of willemite, 40 parts of barium titanate, 30 parts of calcined talc, 30 parts of titanium dioxide, 20 parts of silicon dioxide, silicon nitride 15 parts, 8 parts of quartz powder, 10 parts of mica powder, 8 parts of boron carbide, 10 parts of sodium polyacrylate, 15 parts of phenolic resin, 8 parts of alumina, 6 parts of composite additives, 5 parts of binder and 120 parts of deionized water .

[0048] Wherein, the composite additive is a mixture of boric acid, ammonium chloride and aluminum fluoride in a mass ratio of 1:0.4:0.4.

[0049] Wherein, the binder is paraffin or polymethylacrylate.

[0050] A method for preparing an insulating ceramic for an integrated circuit substrate, comprising the following steps:

[0051] (1) Weigh willemite, barium titanate, burnt talc, titanium dioxide, silicon dioxide, silicon nitride, quartz powde...

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PUM

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Abstract

The invention discloses insulating ceramic for an integrated circuit substrate. The insulating ceramic consists of the following raw materials in parts by weight: 60-80 parts of willemite, 30-40 parts of barium titanate, 20-30 parts of burnt talc, 10-30 parts of titanium dioxide, 10-20 parts of silicon dioxide, 5-15 parts of silicon nitride, 3-8 parts of quartz powder, 5-10 parts of mica powder, 2-8 parts of boron carbide, 5-10 parts of sodium polyacrylate, 8-15 parts of phenolic resin, 3-8 parts of aluminum oxide, 2-6 parts of a compound additive, 1-5 parts of an adhesive and 100-120 parts of deionized water. The insulating ceramic for the integrated circuit substrate, disclosed by the invention, has the advantages of being low in insulation resistance value, good in insulation performance, long in service life, low in production cost and the like; meanwhile, according to a preparation method disclosed by the invention, via strictly controlling process parameters, the structural change and the chemical change of an insulating ceramic material in the sintering process can be controlled, and the requirements for industrial application can be met.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an insulating ceramic for an integrated circuit substrate and a preparation method thereof. Background technique [0002] Ceramics are various products made of natural clay and various natural minerals as the main raw materials through crushing, kneading, molding and calcination. In the past, people called ceramics made of clay and fired at high temperature in special kilns. Ceramics is the general term for pottery and porcelain. The traditional concept of ceramics refers to all artificial industrial products that use inorganic non-metallic minerals such as clay as raw materials. It includes various products made of clay or a mixture containing clay through kneading, shaping, and calcination. It ranges from the roughest earthenware to the finest fine pottery and porcelain. There are many types of ceramics, and they are widely used in the fields of chemical industry...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/16C04B35/626H01L23/15
CPCC04B35/16C04B35/6261C04B2235/3206C04B2235/3215C04B2235/3217C04B2235/3232C04B2235/3284C04B2235/34C04B2235/3409C04B2235/3418C04B2235/3463C04B2235/3821C04B2235/3873C04B2235/445C04B2235/606H01L23/15
Inventor 李丹丹
Owner HEFEI TONGYOU ELECTRONICS TECH CO LTD
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