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Resin composition for mold cleaning

A technology of resin composition and mold, applied in the field of resin composition for mold cleaning, can solve problems such as adhesion and dirt, and achieve the effect of excellent cleaning performance

Active Publication Date: 2021-06-15
NIPPON CARBIDE KOGYO KK
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

If the dirt adhering to the inner surface of the molding die is left unattended, there will be a problem that dirt will adhere to the surface of package molded products such as integrated circuits and LED elements.

Method used

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  • Resin composition for mold cleaning
  • Resin composition for mold cleaning

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0108] [Manufacturing method of resin composition for mold cleaning]

[0109] The mold cleaning resin composition disclosed in the present invention can be prepared, for example, by mixing a melamine-based resin, zinc fatty acid, and an organic base (not including salts formed by strong acids and weak bases), and other components described above as needed. .

[0110] The mixing method is not particularly limited, and examples include those using known mixers such as kneaders, ribbon mixers, Nauta mixers, Henschel mixers, ball mills, roll kneaders, beaters, and drums. mixed approach.

[0111] 〔use〕

[0112] The resin composition for mold cleaning disclosed by the present invention can be well used to remove dirt from packaging molding materials containing thermosetting resins such as epoxy resins, silicone resins, melamine resins, urea resins, phenolic resins, and polyimide resins. Clean from inside surfaces of forming molds.

[0113] The mold cleaning resin composition dis...

Embodiment 1

[0123] 30 parts by mass of the pulp-containing melamine-formaldehyde resin obtained above as a melamine-based resin and 50 parts by mass of Nikaresin (registered trademark) S-166 (trade name, melamine-formaldehyde resin, Nippon Calcium Industry Co., Ltd.) were used as inorganic fillers. 20 parts by mass of silicon oxide (trade name: pure silica powder, crystalline silica, Seto Ceramics Co., Ltd.) as a material, zinc myristate (trade name: Powder base M, NOF Corporation) as fatty acid zinc 1 part by mass and 0.025 part by mass of guanidine carbonate (trade name: GC, Sanwa Chemical Co., Ltd.) as an organic base were charged into a ball mill and pulverized. Next, 0.4 parts by mass of ethylene bisstearic acid amide (trade name: ALFLOW (registered trademark) H50T, NOF Corporation) was added as a lubricant with a Nauta mixer and stirred to obtain the mold of Example 1 Resin composition for cleaning.

Embodiment 2～ Embodiment 8

[0125] In Example 1, the composition of the resin composition for mold cleaning was changed to the composition shown in Table 1 below, and the resin compositions for mold cleaning of Examples 2 to 8 were obtained in the same manner as in Example 1. .

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Abstract

The present invention relates to a resin composition for mold cleaning, which contains melamine-based resin, fatty acid zinc and organic base (excluding salts formed by strong acid and weak base), the content of the above-mentioned fatty acid zinc relative to the resin composition for mold cleaning The total solid content of 100 parts by mass is 1 part by mass or more, and the ratio of the content of the organic base to the content of the fatty acid zinc is 1 / 100 to 1 / 2 on a mass basis.

Description

technical field [0001] The present disclosure relates to a mold cleaning resin composition. Background technique [0002] When molding molding products such as integrated circuits and LED (Light Emitting Diode) elements are continuously molded using molding materials containing thermosetting resins for a long period of time, dirt from the molding materials adheres to the inner surface of the molding die. If the dirt adhering to the inner surface of the molding die is left unattended, a problem arises that the dirt adheres to the surface of a molded package such as an integrated circuit or an LED element. In order to prevent this kind of problem, it is necessary to clean the molding die regularly. As a method of cleaning a molding die, a method using a resin composition for mold cleaning is known. [0003] For example, International Publication No. 2002 / 030648 discloses a mold cleaning resin composition containing a melamine-based resin and a fibrous inorganic compound havi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L61/28C08K13/02C08K3/36C08K5/098C08K5/20C08K5/31B29C33/72
CPCB29C33/722C08L61/28C08L2205/025C08K13/02C08K3/36C08K5/098C08K5/20C08K5/31B29C45/1753
Inventor 福西阳一弘光清人野村弘明吉村胜则
Owner NIPPON CARBIDE KOGYO KK
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