Vibration device direct contact heat dissipation method based on microarray structure and application

A technology of microarray structure and vibration device, which is applied to the structural parts of electrical equipment, nanotechnology for materials and surface science, electrical components, etc., can solve the contact fretting wear of piezoelectric transformer electrodes and reduce the service life of transformers and performance, affecting the working performance of piezoelectric transformers, etc., to ensure the direct contact area, improve the service life, and improve the heat dissipation performance.

Active Publication Date: 2017-12-01
ANHUI UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The contact between the piezoelectric transformer and the metal heat sink belongs to the direct contact between two rigid interfaces. Due to the influence of surface defects and roughness, it is impossible to completely fit the contact surfaces. There is an air gap and large thermal resistance, which affects the heat dissipation effect.
At the same time, the piezoelectric transformer is i

Method used

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  • Vibration device direct contact heat dissipation method based on microarray structure and application
  • Vibration device direct contact heat dissipation method based on microarray structure and application
  • Vibration device direct contact heat dissipation method based on microarray structure and application

Examples

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Embodiment 1

[0030] The following takes carbon nanotube microarray as an example of thermal interface material to explain its application in heat dissipation of piezoelectric transformer in detail:

[0031] Figure 1a It shows the microarray structure of carbon nanotubes grown on a rectangular silicon wafer substrate. The carbon nanotubes are vertically arranged and distributed on the substrate. The thermal conductivity measured by laser interferometry is 10-20W / m·K.

[0032] figure 2 A schematic diagram of the rectangular piezoelectric transformer to be subjected to heat dissipation treatment and its plane expansion mode shape is shown in this embodiment. The piezoelectric transformer is in a state of high-frequency vibration in the lateral direction. If a rigid radiator is directly used for contact heat dissipation, there will be relative sliding between the stationary radiator and the transformer, which will affect the vibration performance of the transformer; at the same time, contac...

Embodiment 2

[0037] Carbon nanotube microarray structure heat dissipation application technical scheme in columnar vibration devices:

[0038] Figure 5 Figure a in Fig. 1 shows a schematic diagram of the torsional vibration mode of the piezoelectric ceramic tube. For this kind of circular vibration device, because it is not in a normal plane motion state, it is usually inconvenient to manage its heat dissipation.

[0039] Figure 5 Figure b in is a schematic diagram of a carbon nanotube microarray structure grown radially on the inner wall of a circular substrate. Based on the high thermal conductivity and high flexibility of the above-mentioned carbon nanotube array, it can reduce the thermal resistance of the contact surface in the application of contact heat dissipation, and there is no relative sliding and no contact wear, so it can be used for thermal management applications of circular vibration devices.

[0040] Figure 6 It is a schematic diagram of the application of the radi...

Embodiment 3

[0042] The following takes copper nanowire microarray as an example of thermal interface material to explain its application in heat dissipation of piezoelectric transformer in detail:

[0043] Figure 1b It shows a copper nanowire microarray structure processed by laser etching or photolithography on a rectangular copper substrate. The copper nanowires are vertically arranged and distributed on the substrate. The unit is a cuboid with a cross-sectional size of about 100 nanometers. The height is in the order of microns, and the array density is about 1%.

[0044] For the piezoelectric transformer in the planar expansion working mode, the copper nanowire microarray structure is used for the embodiment of contact heat dissipation, which can also be used image 3 A schematic diagram showing the heat dissipation structure of the scheme. The piezoelectric transformer is directly in contact with the copper nanowire arrays vertically arranged and distributed on the substrate. The...

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Abstract

The invention discloses a vibration device direct contact heat dissipation method based on a microarray structure and an application. For problems such as high contact thermal resistance, serious device abrasion and vibration performance influence exist in direct contact heat dissipation of a high-frequency vibration device similar to a piezoelectric transformer, an elastic microarray contact heat dissipation structure with the low thermal resistance and a high thermal conductivity coefficient is provided. The microarray structure with a high length-diameter ratio and an appropriate array density is grown on a heat dissipater base on a large scale; and on the basis of the good longitudinal thermal conductivity, a van der Waals force effect and the good transverse flexibility of the microarray structure, the microarray structure can be applied to an occasion on which a vibration device not suitable for the direct contact heat dissipation. According to the vibration device thermal management scheme, no relative sliding exists, so no contact abrasion is generated; the flexibility vertical to a thermal transfer direction is high and the damping vertical to the thermal transfer direction is low, so the influence on device vibration is relatively low; no extra action force for fixing is required in the thermal transfer direction, so a structure is simple; and a demand of the vibration device on the thermal management is satisfied to a certain degree.

Description

technical field [0001] The invention relates to the thermal management field of microarray structures and vibration devices, in particular to the application of a carbon nanotube array structure in heat dissipation of piezoelectric transformers, that is, a direct contact heat dissipation method and application of a vibration device based on a microarray structure. Background technique [0002] As people's requirements for product portability are getting higher and higher, miniaturization, light weight, and low cost have become an inevitable development trend. However, people's diversified requirements for functions make the power requirements of products higher and higher, so their power density is also higher and higher, and the thermal management of devices is becoming more and more important. For some vibration devices, it is usually not suitable for direct contact heat dissipation, and water cooling or oil cooling is generally used. However, if the vibration device is s...

Claims

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Application Information

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IPC IPC(8): H05K7/20B82Y30/00B82Y40/00
CPCB82Y30/00B82Y40/00H05K7/2039H05K7/20472H05K7/20481
Inventor 琚斌张海姣郭治华申佳乐刘永斌刘方陆思良
Owner ANHUI UNIVERSITY
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