Organosilicon foamed material and preparation method thereof

An organosilicon foam and organic technology, applied in the field of organosilicon foam materials and its preparation, can solve problems such as uneven cells, limited application range, inactivation, etc., and achieve the effect of simple preparation method, easy promotion and strong practicability

Inactive Publication Date: 2017-12-05
QINGDAO UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the simultaneous crosslinking and foaming in the chemical foaming method, the selection and matching of the vulcanizing agent and the foaming agent are the key, and the decomposition of the external foaming agent at high temperature will produce toxic gas, the cells are not uniform, and the degree of foaming is not easy. control, limiting its range of application
For the reaction of Si-OH and Si-H, a platinum catalyst is required, which is easy to be poisoned and deactivated, and the process control is difficult; because the physical foaming needs to remove the pore-forming agent after vulcanization molding, and the pore size and cell structure of the foam material And the amount of compression deformation depends on the added pore-forming agent, the density uniformity and the mechanical properties of the material depend on the processing technology, and the shape and size of the material depend on the hot-pressing mold, so the preparation process has many processes and low efficiency

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Hydrogen-containing polyorganosiloxane 100g, (structural formula is:

[0039] , wherein, R is a methyl group, z / x+y+z=0.05, the viscosity at 25°C is about 10000mPa.s), and the crosslinking agent tetraethyl orthosilicate is 5g, and mixed evenly on a double-roll mill at room temperature Afterwards, 0.1 g of catalyst tris(pentafluorophenyl)borane was added, placed in a mold, and allowed to stand at room temperature for 6 hours to obtain a silicone foam material.

[0040] According to the national standard GB / T6343-2009, GB / T10799-2008, GB / T6344-2008, HGT2489-2007, GB / T6669-2008 respectively measure the product density, cell structure, tensile properties, hardness and compression set, the results Indicates: the density of the product is 0.56g / cm 3 , porosity 52.3%, open porosity 31.2%, hardness 23, tensile strength 0.21MPa, elongation at break 257%, compression set 2.38%.

Embodiment 2

[0042] Repeat the steps described in Example 1, except that the hydrogen-containing polyorganosiloxane has a viscosity of about 5000 mPa.s.

[0043] According to the national standard GB / T6343-2009, GB / T10799-2008, GB / T6344-2008, HGT2489-2007, GB / T6669-2008 respectively measure the product density, cell structure, tensile properties, hardness and compression set, the results It shows that the density of the product is 0.48g / cm 3 , porosity 61.3%, open porosity 36.5%, hardness 20, tensile strength 0.18MPa, elongation at break 235%, compression set 3.54%.

Embodiment 3

[0045] Repeat the steps described in Example 1, except that the hydrogen-containing polyorganosiloxane has a viscosity of about 50000 mPa.s.

[0046] According to the national standard GB / T6343-2009, GB / T10799-2008, GB / T6344-2008, HGT2489-2007, GB / T6669-2008 respectively measure the product density, cell structure, tensile properties, hardness and compression set, the results Indicates: the density of the product is 0.56g / cm 3 , porosity 57.2%, open porosity 28.7%, hardness 26, tensile strength 0.35MPa, elongation at break 269%, compression set 1.38%.

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Abstract

The invention relates to an organosilicon foamed material and a preparation method thereof. The method comprises the following steps: hydrogen-containing organopolysiloxane, alkoxy silane and tri(pentafluorophenyl)borane are uniformly mixed at room temperature, and a mixture is subjected to chemical foaming to prepare the organosilicon foamed material. A foaming agent is not required, a chemical reaction between Si-H and Si-OR is employed, alkane is released to prepare the organosilicon foamed material, and the problems of a uncontrollable foam structure, toxicity generated by decomposition of the foaming agent at high temperature, and easy poisoning of a platinum catalyst can be avoided. In addition, the different functional filling materials can be added in a mixing process, so that the special performance can be provided for the organosilicon foamed material. The method is suitable for sulfuration of silicone rubber foams at high temperature and room temperature, and the material can be used for sound insulation, shock absorbing, heat insulation, and package filling in the fields of national defense, aerospace, traffic transport, and electronic industry.

Description

technical field [0001] The invention belongs to the field of organosilicon polymer materials, in particular to an organosilicon foam material and a preparation method thereof. Background technique [0002] Silicone foam material is a porous polymer elastic material prepared by foaming silicone polymers. It not only maintains the excellent properties of silicone polymers, such as high and low temperature resistance, insulation and weather resistance, but also has foam The material has the characteristics of low density, good sound absorption and shock resistance, and it can also be given special properties by adding reinforcing fillers and other functional fillers, such as flame retardancy, fire prevention, hydrophobicity and ablation resistance. Silicone foam material, as an ideal lightweight packaging material, is expected to replace or partially replace carbon-based polymer foam materials, and play the role of "three defenses" of "moisture-proof, shock-proof, and corrosion...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J9/02C08G77/44C08G77/08
CPCC08G77/08C08G77/44C08J9/02C08J2205/05C08J2383/04C08L2203/14
Inventor 刘月涛孙佳文朱丹高传慧王传兴武玉民
Owner QINGDAO UNIV OF SCI & TECH
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