One-component rod sticking glue and preparation method thereof

A sticky stick, one-component technology, used in adhesives, adhesive types, polyurea/polyurethane adhesives, etc., can solve the problem of high epoxy AB adhesive viscosity, affecting silicon wafer yield, and silicon wafer collapse To solve problems such as shortage, to achieve the effect of low viscosity, improved silicon wafer yield and strong adhesion

Active Publication Date: 2017-12-08
GUANGZHOU SHUANGKE NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Epoxy AB adhesive has a high viscosity, and the adhesive layer is thicker after bonding and curing. After slicing, the wire bow cut at the adhesive layer is extremely large, causing silicon wafers to break and seriously affecting the yield of silicon wafers.

Method used

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  • One-component rod sticking glue and preparation method thereof
  • One-component rod sticking glue and preparation method thereof
  • One-component rod sticking glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] A kind of one-component stick glue of the present embodiment, by weight, comprises the following components:

[0031] 20 parts of triethylene glycol dimethacrylate, 25 parts of hydroxypropyl methacrylate, 15 parts of acryloyl morpholine, 35 parts of difunctional polyurethane acrylate, 4 parts of cumene hydroperoxide, 0.5 parts of saccharin part, 0.05 part of p-benzoquinone, and 1 part of fumed silica.

[0032] The preparation method of above-mentioned one-component sticky stick glue may further comprise the steps:

[0033] Step 1, weigh triethylene glycol dimethacrylate, hydroxypropyl methacrylate, acryloyl morpholine, difunctional urethane acrylate, saccharin, p-benzoquinone, and fumed silica in parts by weight In the reaction kettle, the temperature was raised to 40°C, and the reaction was stirred for 2 hours at a speed of 600r / min;

[0034] Step 2, after the reaction is completed, cool to room temperature, add cumene hydroperoxide, and continue stirring for 20 minu...

Embodiment 2

[0042] A kind of one-component stick glue of the present embodiment, by weight, comprises the following components:

[0043] 14 parts of triethylene glycol dimethacrylate, 30 parts of hydroxypropyl methacrylate, 20 parts of acryloyl morpholine, 31 parts of difunctional polyurethane acrylate, 4.5 parts of cumene hydroperoxide, 0.5 parts of saccharin parts, 0.05 parts of p-benzoquinone, and 0.5 parts of fumed silica.

[0044] The preparation method and construction process of the one-component stick glue in this embodiment are the same as in Embodiment 1.

Embodiment 3

[0046] The single-component sticky glue of the present embodiment, by weight, includes the following components:

[0047] 26 parts of triethylene glycol dimethacrylate, 20 parts of hydroxypropyl methacrylate, 19 parts of acryloyl morpholine, 30 parts of difunctional polyurethane acrylate, 3.5 parts of tert-butyl hydroperoxide, sodium saccharin 0.7 parts, p-benzoquinone 0.07 parts, fumed silica 1.5 parts.

[0048] The preparation method of the present embodiment one-component sticky stick glue may further comprise the steps:

[0049] Step 1, weigh triethylene glycol dimethacrylate, hydroxypropyl methacrylate, acryloyl morpholine, difunctional urethane acrylate, sodium saccharin, p-benzoquinone, and fumed silica in parts by weight Add it into the reaction kettle, raise the temperature to 35°C, and stir for 2 hours at a speed of 700r / min;

[0050] Step 2, after the reaction is completed, cool to room temperature, add tert-butyl hydroperoxide, and continue stirring for 10 minute...

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Abstract

The invention relates to one-component rod sticking glue and a preparation method thereof. The one-component rod sticking glue is prepared from components in parts by weight as follows: 14-26 parts of triethylene glycol dimethacrylate, 20-30 parts of hydroxypropyl methacrylate, 10-20 parts of 4-acryloylmorpholine, 30-40 parts of polyurethane acrylate, 3-5 parts of an initiator, 0.3-0.7 parts of an accelerator, 0.03-0.07 parts of a polymerization inhibitor and 0.5-1.5 parts of a thixotropic agent. The invention further provides the preparation method and an application process of the rod sticking glue. The one-component rod sticking glue has good storage stability, has the storage life as long as 1 year or longer, is high in curing activity on a resin plate, takes only 1-1.5 h to reach the maximum bonding strength, is high in bonding power and can be removed rapidly, so that the production efficiency of silicon wafers can be increased greatly.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a one-component stick glue and a preparation method thereof. Background technique [0002] As an important semiconductor material, silicon has good electrical properties and thermal stability. Since it was discovered and utilized by people in the 1960s, it has rapidly replaced single crystal germanium as the main material of semiconductors. Compared with other semiconductor materials, silicon single crystal has the characteristics of high hardness and rich source of raw materials, and has the advantages of easy growth of large-sized high-purity crystals, excellent thermal and mechanical properties, and so on. [0003] Wafer cutting is an upstream key technology for the production of silicon wafers (wafers), the main raw material in the electronics industry. The quality and scale of cutting directly affect the subsequent production of the entire industrial chain. In the electro...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/14C09J11/04C09J11/06C09J11/08
CPCC08K3/36C09J11/04C09J11/06C09J11/08C09J175/14C08L77/00
Inventor 梁锦坤肖世荣饶丽珍韦士应
Owner GUANGZHOU SHUANGKE NEW MATERIAL
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