High-temperature resistant low-dilatation coefficient heat conduction potting adhesive as well as preparation method and application thereof
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A low expansion coefficient, heat conduction potting technology, applied in the field of potting glue, can solve the problems of high temperature resistance and small volume expansion coefficient of PTC potting glue, achieve good adhesion, increase dosage, and enhance thermal conductivity.
Active Publication Date: 2017-12-26
广州天宸高新材料有限公司
View PDF4 Cites 5 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0006] In order to solve the problem that the PTC potting compound existing in the prior art cannot have both high temperature resistance and small volume expansion coefficient, the present invention provides a heat-conducting potting compound composition with high temperature resistance, low volume expansion coefficient and large thermal conductivity
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0031] Example Heat-conducting potting compound with high temperature resistance and low expansion coefficient
[0032] A-1 is a terminal group vinyl silicone oil with a viscosity of 300mPa.s and a vinyl content of 0.8%;
[0033] A-2 is a terminal vinyl silicone oil with a viscosity of 400Mpa.s and a vinyl content of 0.5%;
[0034] A-3 is a terminal vinyl silicone oil with a viscosity of 300MPa.s and a vinyl content of 0.8%;
[0035] B-1 is a hydroxyl vinyl oligomer with a viscosity of 30MPa.s and a vinyl content of 2.5%;
[0036] B-2 is a hydroxyvinyl oligomer with a viscosity of 40MPa.s and a vinyl content of 2%;
[0037] B-3 is a hydroxyvinyl oligomer with a viscosity of 25MPa.s and a vinyl content of 3%;
[0038] C-1 is aluminum powder and boron nitride with coating treatment on the surface, in which the average particle size of aluminum powder is 3 μm, boron nitride is a flake substance, and the content of boron nitride is 9%;
[0039] C-2 is spherical alumina, the av...
Embodiment 1
[0062] The preparation method of embodiment one comprises the steps:
[0063] S1 prepares A component and B component respectively; 1 and 10 parts of E-1 were stirred at a speed of 400r / min for 50min under the environment of vacuum degree of -0.06MPa and temperature of 28°C to obtain component A; the preparation method of component B was as follows: weigh 20 parts A-1, 6 parts of B-1, 7 parts of I-1, 1 part of D-1, 93 parts of C-1, 3 parts of F-1 and 0.008 parts of H-1, at a vacuum of -0.06MPa and a temperature of Stir at a speed of 400r / min for 50min at 28°C to obtain component B;
[0064] S2 defoaming and sub-packaging: put the A component and B component prepared in S1 in a high-speed defoaming machine, defoam at a speed of 3000r / min, pack, and obtain a high-temperature-resistant heat-conducting potting compound.
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Property
Measurement
Unit
viscosity
aaaaa
aaaaa
viscosity
aaaaa
aaaaa
viscosity
aaaaa
aaaaa
Login to view more
Abstract
The invention provides a high-temperature resistant low-dilatation coefficient heat conduction potting adhesive which consists of a component A and a component B, wherein the component A comprises the following components in parts by mass: 10-30 parts of end group vinyl silicon oil, 5-20 parts of a hydroxyl vinyl oligomer, 0.5-2 parts of a high-temperature resistant aid, 80-100 parts of heat conduction packing, 6-20 parts of a low-volume dilatation controller and 0.002-0.010 part of a catalyst; and the component B comprises the following components in parts by mass: 10-30 parts of end group vinyl silicon oil, 5-20 parts of a hydroxyl vinyl oligomer, 2-20 parts of end hydrogen-containing silicone oil, 0.5-2 parts of a high-temperature resistant aid, 80-100 parts of heat conduction packing, 2-4 parts of an adhesive accelerant and 0.002-0.010 part of an inhibitor. The adhesive provided by the invention belongs to the technical field of potting adhesives. The high-temperature resistant low-dilatation coefficient heat conduction potting adhesive provided by the invention has the advantages of being small in volume dilatation coefficient, good in high temperature resistance, good in adhesion property and the like.
Description
technical field [0001] The invention belongs to the technical field of potting glue, and in particular relates to a heat-conducting potting glue with high temperature resistance and low expansion coefficient, a preparation method and application thereof. Background technique [0002] The thermal management scheme design of new energy power batteries generally includes three parts: heat dissipation, heat preservation and heating. Among them, the most important component involved in the heating scheme part is the PTC resistor, which is the abbreviation of Positive Temperature Coefficient (Positive Temperature Coefficient). The most commonly used PTC is a kind of barium titanate (BaTiO 3 ) is the basic composition of the semiconductor resistor. This kind of resistor is in a low resistance state at a lower temperature; but when the temperature is above a certain temperature (called the Curie temperature), its own resistance rises sharply by 3 to 8 orders of magnitude (10 3 ~10...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more