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Chemical nickel-phosphate plating solution

A technology for electroless nickel-phosphorus plating and plating solution, applied in the field of electroless plating, can solve problems such as increasing the cost of sewage treatment, and achieve the effects of increasing the plating speed and corrosion resistance.

Active Publication Date: 2017-12-29
GUANGDONG GUANGHUA SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The discharge of these organic additives and fluoride will increase the cost of sewage treatment

Method used

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  • Chemical nickel-phosphate plating solution
  • Chemical nickel-phosphate plating solution
  • Chemical nickel-phosphate plating solution

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0022] The preparation of electroless nickel-phosphorus alloy plating solution: according to the ratio of nickel sulfate 27g / L, sodium hypophosphite 27.9g / L, lactic acid 14.5g / L, sodium acetate 15g / L, inorganic additive (ferrous sulfate) 40mg / L Prepare electroless nickel-phosphorus alloy plating solution, use 1mol / LH 2 SO 4 Adjust the pH to 4.4.

[0023] Electroless nickel-phosphorus plating: put a 1.5×2cm iron substrate in the above-mentioned electroless nickel-phosphorus alloy plating solution with a constant temperature in a water bath after alkali washing, water washing, and hydrochloric acid activation. The temperature is 90°C. Dry, get electroless nickel-phosphorus alloy.

[0024] Use an electronic balance to weigh the mass before and after plating, and calculate the plating speed of electroless nickel plating.

[0025] The calculation results show that the plating rate of the electroless nickel-phosphorus alloy plating is 18.29 μm / h.

[0026] The plating speed of th...

Embodiment 2

[0028] Preparation of electroless nickel plating solution: according to the ratio of nickel sulfate 27g / L, sodium hypophosphite 27.9g / L, lactic acid 14.5g / L, sodium acetate 15g / L, inorganic additive (ferrous sulfate) 60mg / L Phosphorus plating solution for nickel plating, use 1mol / L H 2 SO 4 Adjust the pH to 4.4.

[0029] The plating process of electroless nickel-phosphorus alloy plating is the same as that in Example 1.

[0030] Use an electronic balance to weigh the mass before and after plating, and calculate the plating speed of electroless nickel-phosphorus alloy plating.

[0031] The calculation results show that the plating speed of electroless nickel-phosphorus plating is 18.88μm / h, which is 10.41% higher than that of the basic electroless nickel plating solution formula.

Embodiment 3

[0033] Preparation of electroless nickel plating solution: according to the ratio of nickel sulfate 27g / L, sodium hypophosphite 27.9g / L, lactic acid 14.5g / L, sodium acetate 15g / L, inorganic additive (cobalt sulfate) 60mg / L to prepare chemical plating Nickel phosphorus plating solution, with 1mol / L H 2 SO 4 Adjust the pH to 4.4.

[0034] The plating process of electroless nickel-phosphorus alloy plating is the same as that in Example 1.

[0035] Use an electronic balance to weigh the mass before and after plating, and calculate the plating speed of electroless nickel-phosphorus alloy plating.

[0036] The calculation results show that the plating speed of electroless nickel-phosphorus plating is 18.11 μm / h, which is 5.90% higher than that of the basic electroless nickel plating solution.

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Abstract

The invention relates to a chemical nickel-phosphate plating solution. The chemical nickel-phosphate plating solution comprises a basic chemical nickel-phosphate plating solution and an inorganic additive, wherein the inorganic additive is selected from one or several of ferrous sulfate, cobaltous sulfate and zinc sulfate. According to the chemical nickel-phosphate plating solution, the inorganic additive (one or several of ferrous sulfate, cobaltous sulfate and zinc sulfate) is added in the basic chemical nickel-phosphate alloy plating solution. The plating speed of chemical nickel-phosphate alloy plating can be increased, and the corrosion resistance of a chemical nickel-phosphate alloy plating layer can be improved after the inorganic additive is added.

Description

technical field [0001] The invention relates to the technical field of electroless plating, in particular to an electroless nickel-phosphorus plating solution. Background technique [0002] After more than half a century of development, electroless nickel-phosphorus alloy plating has become a very mature process. Due to the good throwing and deep plating ability of electroless nickel-phosphorus alloy, it can be plated on complex surfaces and non-metallic surfaces, and the obtained electroless nickel-phosphorus alloy has an amorphous structure, dense coating, low porosity, and good wear resistance. , so it has been widely used in petrochemical, electronics, printing, mold, textile, medical equipment, automobile and aerospace and other fields. [0003] The plating speed of electroless nickel-phosphorus alloy plating has always been the focus of industrial production. In order to increase the deposition rate of electroless nickel-phosphorus alloy plating, a certain amount of a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/36
Inventor 王超男陆海彦李祥忠林海波
Owner GUANGDONG GUANGHUA SCI TECH