Silicon resin adhesive and application method in LED packaging

A technology of silicone resin glue and application method, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low bin yield rate of finished products, achieve low bin yield rate of finished products, increase cost, and have good consistency Effect

Active Publication Date: 2017-12-29
HUIZHOU THORLED OPTO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on this, it is necessary to provide a silicone resin glue and its application method in LED packaging to solve the problem of low Bin yield rate of LED packaging finished products in the prior art

Method used

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  • Silicon resin adhesive and application method in LED packaging
  • Silicon resin adhesive and application method in LED packaging
  • Silicon resin adhesive and application method in LED packaging

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0064] Weigh 45kg of silicone resin and place it in a mixing container, weigh 5kg of amino silicone resin and add it to the mixing container and stir evenly at 2500rmp, weigh 50kg of fluorescent powder and add it to the mixing container and stir evenly at 2500rmp, and use a centrifugal defoamer to defoam. Prepare silicone resin glue A1.

[0065] Fix the front-mounted chip in the groove of the COB substrate with a cofferdam-shaped groove, and weld the chip and the substrate through the bonding wire-gold wire, so that the positive and negative poles of the positive-mounted chip and the positive and negative poles of the substrate are electrically connected; Resin glue A1 was put into the cofferdam-shaped groove on the COB substrate by dispensing, put into a 120°C oven and heated for 10 minutes, and the oven temperature was raised to 150°C and heated for 3 hours to obtain the finished packaged LED product L1.

[0066] see figure 2 As shown, it is a comparison chart of phosphor ...

Embodiment 2

[0069] Weigh 78kg of silicone resin and place it in a mixing container, weigh 2kg of amino silicone resin into the mixing container and stir evenly at 2000rmp, weigh 20kg of fluorescent powder, add it to the mixing container and stir evenly at 2000rmp, and use a centrifugal defoamer to degas. A silicone resin gel A2 was prepared.

[0070] Fix the front-mount chip in the groove of the cup-shaped groove SMD bracket, and weld the front-mount chip and the SMD bracket by bonding wire-gold wire; put the silicone resin glue A2 into the bracket by dispensing Put it into the groove and heat it in an oven at 100°C for 30 minutes, then increase the temperature of the oven to 120°C and heat it for 2 hours to obtain the finished packaged LED product L2.

[0071] The obtained silicone resin glue A2 and the packaged LED finished product L2 were measured by the same method as in Example 1, and the measurement results are shown in Table 1.

Embodiment 3

[0073] Weigh 97kg of silicone resin and place it in a mixing container, weigh 3kg of amino silicone resin into the mixing container, stir evenly at 3000rmp, and use a centrifugal defoamer to defoam to obtain silicone resin A3.

[0074] Fix the front-mount chip on the flat substrate, and weld the front-mount chip with the substrate through bonding wire-aluminum alloy wire; package the front-mount chip with silicone resin glue A3 by molding, and heat it in an oven at 110°C for 20 minutes , raise the temperature of the oven to 130° C. and heat for 2.5 hours to obtain the packaged LED finished product L3.

[0075] The obtained silicone resin glue A3 and the packaged LED finished product L3 were measured by the same method as in Example 1, and the measurement results are shown in Table 1.

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Abstract

The invention discloses a silicon resin adhesive comprising 2 to 5% of thixotropic agents being amino silicone resin. The invention provides the silicon resin adhesive and an application method in LED packaging. The silicon resin adhesive has high thixotropy at a normal temperature and the thixotropic index is 2 to 3; the thixotropy is low at a high temperature and the thixotropic index is less than or equal to 1. Therefore, when the silicon resin adhesive is applied to LED packaging, uniformity of the concentration of fluorescent powder mixed in the silicon resin adhesive at a normal temperature is effectively ensured; and the fluorescent powder is prevented from sedimentation at a normal temperature, so that a problem of the non-uniform concentration of the fluorescent powder due to the gravity effect during the storage or transferring process is solved. Because the thixotropy and viscosity of the silicon resin adhesive at a temperature of 100 to 120 DEG C are reduced, uniform sedimentation of the fluorescent powder mixed in the silicon resin adhesive to the chip surface is realized, so that the falling Bin yield of finished products is improved on the premise that the cost is not increased basically and a problem of low falling Bin yield of the finished products during the LED packaging process is solved.

Description

technical field [0001] The invention relates to the field of LED packaging, in particular to a silicone resin glue and an application method thereof in LED packaging. Background technique [0002] In recent years, with the popularization of LED products, the lighting market is huge, and the pressure of product cost reduction is great. At the same time, in order to pursue higher light color quality in the design of terminal lighting products, the requirements for light color consistency of light sources are more stringent. From the original The 6th-order MacAdam ellipse has been upgraded to 5th-order, and even some are more stringently required to be 3rd-order, which prompts mid-stream packaging manufacturers to strive to improve the yield rate of finished product bin (effective color area), so as to improve the light color consistency of the light source, and At the same time reduce production costs and enhance their own competitiveness. [0003] Under normal circumstances,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/56H01L33/50H01L33/48
Inventor 任艳艳杜超
Owner HUIZHOU THORLED OPTO
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