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Production process of flexible circuit board

A flexible circuit board and production process technology, applied in printed circuits, printed circuit manufacturing, electrical components, etc., can solve the problem that the thickness of the protective film and the thickness of ink printing cannot be reduced, the accuracy of the protective film cannot meet the requirements, and the total thickness of the product cannot be reduced, etc. problems, to achieve the effect of reducing waste, reducing product thickness, and reducing production time

Pending Publication Date: 2017-12-29
欣兴同泰科技(昆山)有限公司
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  • Abstract
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  • Claims
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AI Technical Summary

Problems solved by technology

The production process of the above-mentioned process is long, resulting in large internal damage, and it is difficult to improve the yield rate; and the precision of the protective film is difficult to meet the requirements, and the thickness of the protective film and ink printing thickness cannot be reduced under the existing technology, so that the total thickness of the product cannot be reduced

Method used

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  • Production process of flexible circuit board

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Embodiment Construction

[0019] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0020] Such as figure 1 As shown, the present invention provides a kind of production technology of flexible circuit board, comprising:

[0021] First, cut the roll-shaped flexible copper foil substrate into a fixed size;

[0022] Then, the cut copper foil base material is subjected to drilling, copper plating, and line etching; specifically, the drilling step is to use ultraviolet light to conduct laser drilling on the position on the substrate that needs to be conducted, and control the drilling. Th...

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Abstract

The invention discloses a production process of a flexible circuit board. The production process comprises the following steps that: a rolled soft copper foil base material is cut into a fixed size; hole drilling, copper plating and circuit treatment are performed on the cut copper foil base material; a photosensitive developing cover film is attached and pressed onto the base material; exposure and development are performed on the photosensitive developing cover film; and surface treatment is performed on the exposed and developed base material. According to the production process of the flexible circuit board of the invention, the photosensitive developing cover film is adopted to replace a protective film and ink in the prior art, and therefore, the process of response can be omitted, and yield can be improved; and the cost of the photosensitive developing cover film is lower than that of the ink, the thickness of the photosensitive developing cover film can be controlled, and therefore, product precision can be improved.

Description

technical field [0001] The invention relates to a flexible circuit board, in particular to a production process of a flexible circuit board. Background technique [0002] Flexible Printed Circuit (FPC for short) is a printed circuit made of flexible insulating substrates, which has many advantages that rigid printed circuit boards do not have. For example, it can be freely bent, wound, and folded, and can be arranged arbitrarily according to the requirements of the spatial layout, and can be moved and stretched arbitrarily in three-dimensional space, so as to achieve the integration of component assembly and wire connection. The use of FPC can greatly reduce the volume of electronic FPC, which is suitable for the development of electronic FPC in the direction of high density, miniaturization and high reliability. Therefore, FPC has been widely used in aerospace, military, mobile communications, laptop computers, computer peripherals, PDA, digital cameras and other fields or...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCH05K3/06H05K2203/052
Inventor 严军周卫群赖永伟
Owner 欣兴同泰科技(昆山)有限公司
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