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Composition for non-conductive adhesive film and non-conductive adhesive film containing same

A non-conductive, composite technology, applied in adhesive types, film/sheet adhesives, circuits, etc., can solve problems such as poor bonding, bump damage, and contamination of multi-chip packaging, and achieve improved Adhesion and productivity, improvement of bump fillability, effect of high glass transition temperature

Active Publication Date: 2020-12-15
INNOX ADVANCED MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In the case of utilizing the above-mentioned non-conductive adhesive film, many problems occurred in the conventional sealing process by liquid-phase underfill resin are improved, however, in the non-conductive adhesive film developed so far , due to the lack of bump fillability, adhesion, etc. based on the film shape, there is a problem that poor bump adhesion frequently occurs. In order to solve this problem, a non-conductive adhesive film is bonded to the In the case of semiconductor wafers that include bumps, there is a problem of causing damage to the bumps
Also, when the curing speed of the thermosetting adhesive film is delayed, there is a problem of contaminating the multi-chip package due to the molten adhesive component flowing out between the chip and the chip or between the chip and the substrate.
Further, there is a problem that the productivity is significantly reduced as the slow curing speed prolongs the bonding time between chips
Moreover, in photocuring or low-temperature thermosetting non-conductive adhesive films, there may be a problem that poor adhesion occurs between bumps as bump bonding is performed at low temperature.
In addition, when thermal curing is performed at a low temperature, there is a problem that the aging properties of the adhesive film are significantly reduced.

Method used

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  • Composition for non-conductive adhesive film and non-conductive adhesive film containing same
  • Composition for non-conductive adhesive film and non-conductive adhesive film containing same
  • Composition for non-conductive adhesive film and non-conductive adhesive film containing same

Examples

Experimental program
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preparation example Construction

[0106] in as above image 3 In the production method of the adhesive film shown, although the adhesive film is produced in the following order, that is, the composition for non-conductive adhesive film is coated on the release base material, and the sheet base material is laminated after drying. However, it is also possible to apply the composition for a non-conductive adhesive film on a sheet base material instead of a release base material, and to laminate the release base material after drying. In the case of not laminating the release base material, can be prepared as figure 2 Adhesive film shown.

[0107] And, according to a preferred example of the present invention, it is also possible to prepare Figure 4 Non-conductive adhesive films for semiconductors shown, such as Figure 4 As shown, the above-mentioned non-conductive adhesive film for semiconductors includes a release substrate 21, a release film 11 formed on the release substrate 21 or an ultraviolet (UV) or ...

Embodiment 1

[0116] First, as a thermosetting part, with respect to 100 parts by weight of an epoxy component (solid phase, cycloaliphatic, EHPE3150, Daicel (DAICEL) company) as a first thermosetting part, 100 parts by weight of a second thermosetting part Acrylic component (M280, monosodium glutamate, molecular weight 508).

[0117] Based on the weight sum of the above-mentioned epoxy components and acrylic acid components of 100 parts by weight, 30 parts by weight of the thermoplastic part were dropped into a propylene copolymer (KW197CHM, Negami company) with a weight average molecular weight of about 700,000 and 10 parts by weight as a solvent. After the methyl ethyl ketone of weight part, use stirrer to carry out mixing, and above-mentioned propylene copolymer comprises the 2,3-epoxypropyl methacrylic acid as the acrylic acid monomer containing epoxy group in the multipolymer of 25 weight percent Esters (2,3-epoxypropyl methacrylate).

[0118] In the above mixture, on the basis of 10...

Embodiment 2 to Embodiment 5

[0120] Prepared in the same manner as in Example 1, however, as shown in the following Table 1 and Table 2, the composition ratio of the composition for a non-conductive adhesive film was changed to obtain the following Table 1 and Table 2. Non-conductive adhesive film.

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Abstract

The present invention relates to a composition for a non-conductive adhesive film and a non-conductive adhesive film containing the same. More specifically, it relates to the following composition for a non-conductive adhesive film and a non-conductive adhesive film containing the same. That is, it has a further improved curing speed, thereby minimizing resin flow during the bonding process between chips and the bonding between chips and substrates, improving productivity, bump filling properties, and adhesion to semiconductor wafers, and is durable at room temperature. It has excellent timeliness and achieves the required heat resistance in semiconductor products.

Description

technical field [0001] The present invention relates to a composition for a nonconductive adhesive film and a nonconductive adhesive film containing the same, and more specifically, to the following composition for a nonconductive adhesive film and a nonconductive adhesive film containing the same. That is, it has a further improved curing speed, thereby minimizing resin flow during bonding between chips and bonding between chips and substrates, and improving productivity, improving bump filling, and adhesion to semiconductor wafers, and is stable at room temperature. It is excellent in timing and realizes the heat resistance required in semiconductor products. Background technique [0002] Recently, electronic devices including mobile devices have been miniaturized and thinned. Correspondingly, the semiconductor industry has also achieved high capacity, ultra-high speed, and is developing in a trend of miniaturization and thinning. In order to meet the needs required by th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F291/10C08K7/18C08K5/5435C08J5/18H01L23/29C08L63/00C08L23/14
CPCC09J163/00C09J133/00C09J7/00C09J2301/312C09J2203/326
Inventor 蔡成芫尹勤泳李相泌具滋敏朴钟贤
Owner INNOX ADVANCED MATERIALS CO LTD