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Epoxy resin packaging adhesive for packaging high-power LED and preparation method and application of epoxy resin packaging adhesive

A technology of LED packaging and epoxy resin, which is applied in the direction of epoxy resin glue, adhesive, polymer adhesive additives, etc., can solve the problems of small output, urgent packaging materials, and high price of silicone resin, and achieve low cost and glass Effect of high transition temperature and thermal decomposition temperature, high refractive index

Inactive Publication Date: 2018-01-19
刘操
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Of course, in recent years, Shunde ACR, Changsha Bluestar, Jiangyin Tianxing and other manufacturers have emerged in China, but they basically maintain the production of low-power packaging materials, and the output is also small. Therefore, the development of high-end packaging products will promote the promotion of domestic power LEDs. of great significance
[0006] Traditional epoxy resins cannot fully meet the packaging requirements of LEDs, while silicone resins are expensive and monopolized by foreign countries, so the preparation of high temperature resistant and strong bonding performance, strong dielectric properties and UV radiation resistance, good light transmittance applications Encapsulation materials for high-power LEDs are urgently needed

Method used

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  • Epoxy resin packaging adhesive for packaging high-power LED and preparation method and application of epoxy resin packaging adhesive
  • Epoxy resin packaging adhesive for packaging high-power LED and preparation method and application of epoxy resin packaging adhesive

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Embodiment 1

[0025] In the embodiment of the present invention, the epoxy resin encapsulant for high-power LED encapsulation is a two-component system, consisting of 47% of component A and 53% of component B in terms of mass percentage; In percentage terms, it is made of 19.85% of bisphenol F epoxy resin, 80% of phenolic modified silicone resin and 0.15% of polyether modified polysiloxane. The B component is made of Korean pine Made from 14% extract, 85% adipic dihydrazide, 0.4% resorcinol monobenzoate and 0.6% 4-benzoyloxy-2,2,6,6-tetramethylpiperidine The preparation method of described Korean pine extract, comprises the following steps:

[0026] 1) Wash the roots or stems of the Korean pine, pulverize them, and pass through a 40-mesh sieve to obtain coarse powder;

[0027] 2) Adding 5 times the volume concentration of the coarse powder to the coarse powder is an 88% ethanol solution, soaked for 12 hours, then heated to boiling and refluxed for 3 hours, filtered, and slowed down by perc...

Embodiment 2

[0035] In the embodiment of the present invention, the epoxy resin encapsulant for high-power LED encapsulation is a two-component system, consisting of 42% of A component and 58% of B component in terms of mass percentage; In percentage terms, it is made of 80% of bisphenol F epoxy resin, 19.85% of phenolic modified silicone resin and 0.15% of polyether modified polysiloxane. The B component is made of Korean pine Made from 27% extract, 72% adipate dihydrazide, 0.4% resorcinol monobenzoate and 0.6% 4-benzoyloxy-2,2,6,6-tetramethylpiperidine The preparation method of described Korean pine extract, comprises the following steps:

[0036] 1) Wash the roots or stems of the Korean pine, pulverize them, and pass through a 40-mesh sieve to obtain coarse powder;

[0037]2) Adding 5 times the volume concentration of the coarse powder to the coarse powder is an 88% ethanol solution, soaked for 12 hours, then heated to boiling and refluxed for 3 hours, filtered, and slowed down by perc...

Embodiment 3

[0045] In the embodiment of the present invention, the epoxy resin encapsulant for high-power LED encapsulation is a two-component system, consisting of 43.8% of component A and 56.2% of component B in terms of mass percentage; In percentage terms, it is made of 45% of bisphenol F epoxy resin, 54.75% of phenolic modified silicone resin and 0.25% of polyether modified polysiloxane. The B component is made of Korean pine Made from 20% extract, 78% adipate dihydrazide, 1.0% resorcinol monobenzoate and 1.0% 4-benzoyloxy-2,2,6,6-tetramethylpiperidine The preparation method of described Korean pine extract, comprises the following steps:

[0046] 1) Wash the roots or stems of Korean pine, grind them, and pass through an 80-mesh sieve to obtain coarse powder;

[0047] 2) Add 6 times the mass of the coarse powder to the coarse powder in an ethanol solution with a volume concentration of 75%, soak for 18 hours, then heat to boiling and reflux for 5 hours, filter, and slowly use the pe...

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Abstract

The invention discloses an epoxy resin packaging adhesive for packaging a high-power LED and a preparation method and application of the epoxy resin packaging adhesive. The packaging adhesive comprises the following components in percentage by mass: 42-47% of a component A and 53-58% of a component B; the component A is prepared from the following components in percentage by mass: 19.85-80% of bisphenol F-type epoxy resin, 19.85-80% of phenolic modified organic silicone resin, and 0.15-0.25% of polyether modified polysiloxan; and the component B is prepared from the following components in percentage by mass: 14-27% of pinus koraiensis extracting solution, 72-85% of adipic dihydrazide, 0.4-1.0% of m-phenylene dibenzoate, and 0.6-1.2% of 4-benzoyloxy-2,2,6,6-tetramethylpiperidine. The packaging adhesive resists high temperature and ultraviolet radiation, is good in transmission of light, high in refractive index, simple in process and low in cost, and can be widely applied to the fieldof packaging of the high-power LED.

Description

[0001] This application is a divisional application with application number 2015108848051, application date December 1, 2015, and invention name "epoxy resin encapsulant for high-power LED encapsulation and its preparation method and application". technical field [0002] The invention relates to the technical field of LEDs, in particular to an epoxy resin encapsulation adhesive for high-power LED encapsulation, a preparation method and application thereof. Background technique [0003] As "green lighting", LED lighting is widely used in display screens, landscape lighting, special lighting and other fields. With the maturity of LED light source technology, the luminous lumens per watt has increased rapidly, prompting its decreasing price year by year. Looking forward to the future, LED general lighting has become an industry hotspot with the greatest market potential, so the packaging problem of high-power, high-brightness white LEDs has become increasingly prominent. [00...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J183/00C09J11/08C09J11/06H01L33/56
Inventor 不公告发明人
Owner 刘操
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