Acid etching liquid and preparation method thereof
An acid etching solution and hydrochloric acid technology, applied in the field of metal etching, can solve the problems of unstable etching rate and poor etching uniformity, and achieve the effects of fast etching speed, small equipment corrosion, safe and environmentally friendly operation
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preparation example Construction
[0024] The invention proposes a preparation method of an acidic etching solution, which is suitable for printed circuit boards, so as to be more effectively used for etching and forming copper surfaces in the production of printed circuit boards.
[0025] The technical means of the preparation method of the acid etching solution for printed circuit boards of the present invention is to adopt an alternative chemical substance with the same effect under the condition that the principle of action remains unchanged through the adjustment of the formula components, so that it has new characteristics and advantages in terms of performance. effect.
[0026] The technical scheme of the method for preparing the acid etching solution for printed circuit boards of the present invention is to mix the chemical components together in a certain proportion, mix the used raw materials uniformly in a certain order, react for a certain period of time, and then finish the reaction. The product is...
Embodiment 1
[0035] 100mL acidic etching solution and its preparation method:
[0037] Refined salt: 17g
[0039] Additive: 1.5g
[0040] Concentrated hydrochloric acid: 1mL
[0041] The balance is water.
[0042] Add sodium chlorate, refined salt, ammonium chloride and additives (ureas, including urea, thiourea, dithiourea, etc.) acid etchant.
[0043] The parameter of gained etching solution is as follows:
[0044] Specific gravity: 1.25~1.35
[0045] pH: 6~9
[0046] Chloride ion content: 220~280g / L
[0047] In addition, it should be noted that when using this acidic etching solution, it is required to control the copper ion content of the use environment to be 140-170g / L, and the oxidation-reduction potential to be 500-550mV.
Embodiment 2
[0049] 1000L acid etching solution and its preparation method:
[0050] Sodium chlorate: 250Kg
[0051] Refined salt: 95Kg
[0052] Ammonium chloride: 30Kg
[0053] Additives: 12Kg
[0054] Concentrated hydrochloric acid: the concentration is 31%, less than 10Kg
[0055] The balance is water.
[0056] Add sodium chlorate, refined salt, ammonium chloride and additives (urea, including urea, thiourea, dithiourea, etc.) , to obtain an acidic etchant.
[0057] The parameter of gained etching solution is as follows:
[0058] Specific gravity: 1.25~1.35
[0059] pH: 6~9
[0060] Chloride ion content: 220~280g / L
[0061] In addition, it should be noted that: the same requirements as in Example 1, when using this acidic etching solution, it is required to control the copper ion content to 140-170g / L, and the oxidation-reduction potential to be 500-550mV.
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