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High-heat-conductivity fluorine-containing resin based prepreg and copper-clad plate prepared with same

A technology of fluorine-containing resin and prepreg, which is applied in the field of communication materials, can solve the problems of low thermal conductivity and limit wide application, and achieve the effects of simple operation process, low production cost and mild preparation conditions

Active Publication Date: 2018-01-30
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the thermal conductivity of fluorine-containing resin itself is extremely low (~0.15W / m*K), which limits its wider application. It is imminent to develop high-frequency fluorine-containing resin-based copper clad laminates with high thermal conductivity.

Method used

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  • High-heat-conductivity fluorine-containing resin based prepreg and copper-clad plate prepared with same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Add 20 parts of SiC (particle size 6 μm) to a mixed solvent composed of 800 parts of ethanol and 200 parts of water, stir well and add 2 parts of Al 2 o 3 (particle size 200nm), further stir evenly; then, add 0.04 parts of coupling agent KH550, stir at 80°C for 0.5h; add 20 parts of SiC (particle size 6μm) again, so that the SiC concentration increases to 4wt / v%, stir After uniformity, add 2 parts of Al again 2 o 3 (particle size 200nm), further stir evenly; then, add 0.04 parts of coupling agent KH550 again, and stir at 80°C for 0.5h; repeat the above operation until the concentration of SiC reaches 10wt / v%; Drying at ℃ to obtain high thermal conductivity SiC / Al 2 o 3 Composite inorganic filler; Weigh 60 parts of polytetrafluoroethylene emulsion (DuPont Teflon ® PTFE DISP30, solid content 60%) and 40 parts tetrafluoroethylene-perfluoroalkoxy vinyl ether copolymer emulsion (DuPont Teflon ® PFAD 335D, solid content 60%), after mixing evenly, add 80 parts of high ...

Embodiment 2

[0028] Add 10 parts of BN (particle size 10 μm) and 10 parts of SiC (particle size 6 μm) to a mixed solvent composed of 800 parts of ethanol and 200 parts of water, stir well and then add 2 parts of Al 2 o 3 (particle size 200nm), further stir evenly; then, add 0.04 parts of coupling agent KH550, stir at 80°C for 0.5h; then add 10 parts of BN (particle size 10μm) and 10 parts of SiC (particle size 6μm), so that The concentrations of BN and SiC were respectively increased to 2wt / v%, and after stirring evenly, 2 parts of Al were added again 2 o 3 (particle size 200nm), further stir evenly; then, add 0.04 parts of coupling agent KH550 again, and stir at 80°C for 0.5h; repeat the above operation until the concentrations of BN and SiC reach 6wt / v% respectively; after removing the solvent by filtration, The solid was dried at 110°C to obtain high thermal conductivity BN / SiC / Al 2 o 3 Composite inorganic filler; Weigh 50 parts of polytetrafluoroethylene emulsion (DuPont Teflon ® ...

Embodiment 3

[0030] Add 20 parts of BN (particle size 10μm) to a mixed solvent composed of 850 parts of ethanol and 150 parts of water, stir well, then add 2 parts of MgO (particle size 500nm), and stir evenly; then, add 0.04 parts of coupling agent KH550 , stirred at 80°C for 0.5h; then added 20 parts of BN (particle size 10μm) in order to increase the BN concentration to 4wt / v%, after stirring evenly, added 2 parts of MgO (particle size 500nm) again, and further stirred evenly; then , add 0.04 parts of coupling agent KH550 again, and stir at 80°C for 0.5h; repeat the above operation until the concentration of BN reaches 12wt / v%; filter to remove the solvent, and dry the solid at 110°C to obtain high thermal conductivity BN / Al 2 o 3 Composite inorganic filler; Weigh 50 parts of polytetrafluoroethylene emulsion (DuPont Teflon ® PTFE DISP30, solid content 60%) and 60 parts perfluoroethylene propylene emulsion (DuPont Teflon ® FEPD121, solid content 54%), after mixing evenly, add 80 part...

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Abstract

The invention relates to a high-heat-conductivity fluorine-containing resin based prepreg and a copper-clad plate prepared with the same. By introduction of a coupling agent modified inorganic nano supporting material into high-heat-conductivity inorganic filler, compatibility of the high-heat-conductivity inorganic filler to a fluorine-containing resin matrix is improved, and gathering of the high-heat-conductivity inorganic filler in a resin matrix is inhibited while heat conductivity of fluorine-containing resin is increased. The prepreg prepared by steps of impregnating glass fibers in dispersion liquid of the fluorine-containing resin mixture, drying and the like is high in heat conductivity, uniform in resin content, high in impregnation quality, high in resin adhesion, high in surface smoothness and appropriate in toughness and viscosity. The copper-clad plate prepared with the high-heat-conductivity fluorine-containing resin based prepreg is high in transverse heat conductivity, excellent in heat and mechanical property and dielectric property and high in copper foil peel strength and weather resistance, meets the requirement of high-power devices on quick transverse heat dissipation and accords with requirements on various comprehensive performances of substrate materials in the field of high-frequency communication.

Description

technical field [0001] The invention belongs to the field of communication materials, and in particular relates to a high thermal conductivity fluorine-containing resin-based prepreg and a copper-clad laminate prepared therefrom. Background technique [0002] With the rapid development of wearable devices, unmanned vehicles, drones and intelligent robots, there is an increasing demand for miniaturized, lightweight and thin electronic products. As the main carrier of electronic components, copper clad laminates have higher and higher integration and finer lines. In order to ensure the stability of electronic components, copper clad laminates must have stable insulation and thermal-mechanical properties. , but also need to have a good heat dissipation function. Metal-based CCL has the best heat dissipation capability, but its manufacturing cost remains high and production is difficult, so it is mostly used for high-current modules. Ceramic substrates such as alumina-based, a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/06B32B17/10B32B15/085B32B17/04B32B37/10B32B27/32B32B15/04B32B27/06C08L27/18C08K13/06C08K9/06C08K3/38C08K3/34C08K3/22C08K7/14
Inventor 俞卫忠顾书春俞丞冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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