Large storage window charge trapping memory based on graphene oxide quantum dots and preparation method thereof
A technology of graphene quantum dots and charge trapping, which is applied in the direction of electric solid-state devices, circuits, electrical components, etc., and can solve problems such as reducing operating voltage
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Embodiment 1
[0038] Example 1 Large storage window charge trap memory based on graphene oxide quantum dots
[0039] like figure 2As shown, the large storage window charge trapping memory based on graphene oxide quantum dots provided by the present invention has a structure including the bottom substrate 1, an oxide dielectric layer on the substrate 1, and an electrode film on the oxide dielectric layer Layer 5.
[0040] The substrate 1 is a p-type Si substrate;
[0041] The oxide dielectric layer is a composite structure of a silicon dioxide tunneling oxide layer 2, a charge trapping layer 3 and an aluminum oxide blocking oxide layer 4, wherein the charge trapping layer 3 is sequentially composed of the first zinc oxide film layer 3-1 from bottom to top. , a single-layer graphene oxide quantum dot layer 3-2, and a second zinc oxide film layer 3-3; wherein, the thickness of the silicon dioxide tunneling oxide layer 2 is 2-5nm, and the thickness of the aluminum oxide blocking oxide layer ...
Embodiment 2
[0043] Example 2 Preparation method of large storage window charge trap memory based on graphene oxide quantum dots
[0044] (1) Forming an oxide dielectric layer on the substrate.
[0045] ①. Selection and processing of substrate materials
[0046] Select p-type Si (100 crystal orientation) as the substrate, place the substrate in acetone and clean it ultrasonically for 10 minutes, then put it in alcohol and clean it ultrasonically for 10 minutes, then take it out with clips and put it into deionized water and clean it ultrasonically for 5 minutes Minutes, then take it out and use nitrogen (N 2 ) and blow dry; then soak the substrate in a hydrofluoric acid solution diluted with deionized water, take it out and clean it again with ultrasonic waves in deionized water for 5 minutes, and then take it out with N 2 Blow dry to clean the treated Si substrate.
[0047] ② Growth of silicon dioxide tunneling oxide layer
[0048] Fix the cleaned Si substrate in a rapid thermal oxida...
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