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PCB back-drilling cover plate and preparation method thereof

A cover plate and back-drilling technology, applied in chemical instruments and methods, printed circuit manufacturing, other household appliances, etc., can solve the problems of high production cost of PCB back-drilling cover plates, poor positioning effect drilling accuracy, etc., and reduce drilling costs. Needle wear, good drilling depth control accuracy, easy drilling effect

Active Publication Date: 2018-02-23
烟台柳鑫新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a PCB back-drilling cover and its preparation method, aiming to solve the problems of high manufacturing cost, poor positioning effect and poor drilling accuracy of the existing PCB back-drilling cover. question

Method used

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  • PCB back-drilling cover plate and preparation method thereof
  • PCB back-drilling cover plate and preparation method thereof
  • PCB back-drilling cover plate and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] Take two phenolic prepregs, one impregnated polyaluminum foil adhesive prepreg and one single-sided roughened aluminum foil, press at 160°C and 20-25MPa pressure for 1 hour to obtain a single-sided aluminum foil-clad phenolic cover plate, phenolic resin insulation The thickness of the dielectric layer is 0.353mm, the thickness of the aluminum foil adhesive medium is 0.130mm, the thickness of the aluminum foil is 18μm, and the total thickness of the cover plate is 0.501mm.

Embodiment 2

[0043] Take a piece of phenolic prepreg, a piece of prepreg impregnated with aluminum foil adhesive, and a piece of aluminum foil with one-sided roughening treatment, and press it at a high temperature of 160°C and a pressure of 20-25MPa for 1 hour to obtain a single-sided aluminum foil-clad phenolic cover plate, phenolic resin insulation medium The thickness of the layer is 0.156mm, the thickness of the aluminum foil adhesive medium is 0.130mm, the thickness of the aluminum foil is 18μm, and the total thickness of the cover plate is 0.304mm.

Embodiment 3

[0045] Take five phenolic prepregs, one impregnated aluminum foil adhesive prepreg and one single-side roughened aluminum foil, press at 160°C and 20-25MPa pressure for 1 hour to obtain a single-sided aluminum foil-clad phenolic cover plate, phenolic resin insulation medium The thickness of the layer is 0.655mm, the thickness of the aluminum foil adhesive medium is 0.130mm, the thickness of the aluminum foil is 18μm, and the total thickness of the cover plate is 0.803mm.

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Abstract

The invention discloses a PCB back-drilling cover plate and a preparation method thereof. The cover plate is a single-sided aluminum-laminated foil phenolic aldehyde cover plate formed by compoundingphenolic resin, an aluminum foil adhesive, paper and alloy aluminum foil. An insulating medium layer formed by the phenolic resin, the aluminum foil adhesive and the paper is utilized for replacing ahigh-cost epoxy resin glass fiber composite insulating medium layer, and the prepared cover plate has the effects that the drilling is easy, the positioning effect is good, the abrasion of a drillingneedle is reduced; and the alloy aluminum foil is utilized for replacing a high-cost aluminum foil, so that the cost is substantially lowered, and the prepared cover plate has the characteristics thata metal conductive layer is thin, the thickness tolerance is small, the adhesion with a PCB is good, and the control depth precision of a drill hole is high. According to the PCB back-drilling coverplate, the problems of an aluminum piece that the positioning effect and the drilling precision are poor, adhesion with the PCB is poor and the control depth precision of a drill hole is poor are solved, and the problem that a single-sided copper-laminated plate is high in cost is solved, and the appearance problems of appearance corrugation and water stain in the production of single-sided aluminum-laminated foils similar to the single-sided aluminum-laminated foil phenolic aldehyde cover plate as well as and scratching in a baking process are solved.

Description

technical field [0001] The invention relates to the field of PCB cover plates, in particular to a PCB backdrill cover plate and a preparation method thereof. Background technique [0002] PCB back-drilling technology is to remove the non-transmitting conductive layer part of the via hole after sinking copper by mechanical drilling to ensure the stability of the remaining part of the signal transmission, which is conducive to high-speed signal transmission. PCB back-drilling technology usually uses high-frequency electronic induction principle drilling rigs for drilling back-drilling processing. Using high-frequency electronic conduction loops, the calculation starts when the tip of the drill needle touches the cover plate or PCB board, and the depth of drilling is designed. At present, the cover plates commonly used in back drilling include aluminum sheets, single-sided copper-clad laminates, and single-sided aluminum-clad laminates. [0003] However, when aluminum sheets a...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/06H05K3/00
CPCB32B37/06B32B37/10B32B2260/028B32B2260/046B32B2309/02B32B2309/04B32B2309/12B32B2457/08H05K3/0047H05K2203/0214
Inventor 杨勇成李雪顺王京旭
Owner 烟台柳鑫新材料科技有限公司
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