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Polyimide precursor and polyimide made therefrom

A polyimide precursor, polyimide technology, used in synthetic resin layered products, lamination, photovoltaic power generation, etc., can solve the problems of low CTE heat resistance, transparency, difficulty in production, and difficulty in peeling , to achieve the effect of high transparency and low thermal expansion

Active Publication Date: 2018-02-23
NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, it is also reported that a polyimide film with a low coefficient of linear expansion is directly laminated on a support substrate (Patent Document 4), but the separation becomes difficult due to the combination of the support substrate and the polyimide precursor.
[0014] Considering the above aspects, when replacing the support base material for the display device from a glass substrate to a resin base material, it is necessary to be able to at least simultaneously satisfy low CTE, high heat resistance, high transparency, and easy peeling properties of the support base material. , but it is difficult to produce materials that satisfy all of the stated properties

Method used

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  • Polyimide precursor and polyimide made therefrom
  • Polyimide precursor and polyimide made therefrom
  • Polyimide precursor and polyimide made therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0119] Hereinafter, the present invention will be specifically described based on Examples and Comparative Examples. Furthermore, the present invention is not limited by these contents.

[0120] The codes and evaluation methods of materials used in Examples and Comparative Examples are shown.

[0121] (acid dianhydride)

[0122] BPDA: 3,3',4,4'-biphenyltetracarboxylic dianhydride

[0123] CBDA: 1,2,3,4-cyclobutane tetracarboxylic dianhydride

[0124] 6FDA: 4,4'-(2,2'-hexafluoroisopropylidene)diphthalic dianhydride

[0125] (diamine)

[0126] AAPBZI: 5-amino-2-(4-aminophenyl)benzimidazole

[0127] TFMB: 2,2'-bis(trifluoromethyl)benzidine

[0128] m-TB: 2,2'-dimethyl-4,4'-diaminobiphenyl

[0129] AAPBZO: 5-amino-2-(4-aminophenyl)benzoxazole

[0130] (solvent)

[0131] NMP: N-methyl-2-pyrrolidone

[0132] (Light transmittance and YI)

[0133] The light transmittance (T308, T355, T400, T430) at 308nm, 355nm, 400nm and 430nm was obtained for the polyimide film (50mm×50mm) ...

Synthetic example 1

[0149] 8.5575 g of TFMB were dissolved in 85 g of NMP in a 100 ml separable flask under nitrogen flow. Next, 0.6678 g of AAPBZI was added to the solution. After stirring for 10 minutes, 5.7757 g of CBDA was added. In addition, the molar ratio (a / b) of an acid dianhydride (a) and a diamine (b) was made into 0.990. The solution was heated at 40° C. for 10 minutes to dissolve the contents, and then, at room temperature, the solution was continuously stirred for 24 hours to carry out a polymerization reaction to obtain a high degree of polymerization polyimide precursor A (viscous without color solution).

[0150] Synthesis Example 2 to Synthesis Example 9

[0151] Except that the acid dianhydride and diamine were changed to the mass compositions shown in Table 1 and Table 2, the polyimide precursor solution was prepared in the same manner as in Synthesis Example 1 to obtain polyimide precursor B to polyimide Precursor I.

[0152] [Table 1]

[0153] Synthesis exampl...

Embodiment 1

[0157] Add the solvent NMP to the polyimide precursor solution A obtained in Synthesis Example 1, dilute it so that the viscosity becomes 4000cP, and then use a spin coater so that the thickness of the cured polyimide becomes about 13 μm It was applied on a glass substrate (E-XG manufactured by Corning, size=150 mm×150 mm, thickness=0.7 mm). Next, heating was performed at 100° C. for 15 minutes. Then, in a nitrogen atmosphere, the temperature was raised from room temperature to 300°C at a certain temperature increase rate (3°C / min), and kept at 130°C for 10 minutes in the middle, thereby forming the first polyimide layer of 150mm×150mm on the glass substrate (Polyimide A), the polyimide laminated body A was obtained.

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Abstract

The present invention provides a polyimide and the precursor of same, being excellent in low thermal expansivity and film forming property, being able to be easily peeled from a supporting substrate,and having excellent heat resistance or high transparency. The polyimide precursor has a structural unit derived from diamine and a structural unit derived from acid dianhydride, and has i) a structural unit derived from an aromatic diamine represented by the following formula (1), and Ii) Structural units derived from 2,2'-bis(trifluoromethyl)benzidine or structural units derived from 1,2,3,4-cyclobutanetetracarboxylic dianhydride. (In formula (1), Z is NH or O).

Description

technical field [0001] The present invention relates to a polyimide and its precursor which can be used as a support substrate and the like for forming a display device having high transparency, low thermal expansion coefficient, high heat resistance, and laser lift-off characteristics . Background technique [0002] For organic electroluminescence (EL) devices used in various display applications including large displays such as televisions and small displays such as mobile phones, personal computers, and smartphones, glass substrates as supporting substrates are usually used A thin film transistor (thin film transistor, TFT) is formed on it, and then an electrode, a light-emitting layer, and an electrode are sequentially formed thereon, and they are airtightly sealed with a glass substrate or a multi-layer thin film. Among the structures of the organic EL device, there are a bottom emission structure in which light is output from the support substrate side and a top emiss...

Claims

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Application Information

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IPC IPC(8): C08G73/10C08J5/18C08L79/08B32B27/06B32B27/28B32B37/02
CPCC08G73/1007C08G73/1078C08J5/18C08L79/08B32B27/06B32B27/281B32B37/02C08J2379/08B32B2307/306B32B2307/412Y02E10/549C08G73/1085C08G73/1039C08G73/1075
Inventor 王宏远石山贵也森本敏弘平石克文
Owner NIPPON STEEL CHEMICALL &MATERIAL CO LTD
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