Treating method for crystalline silicon solar cell
A technology of solar cells and processing methods, applied in circuits, photovoltaic power generation, electrical components, etc., can solve the problems of high cost of plant land occupation, low production efficiency, poor quality of silicon oxide films, etc., achieve compact quality and improve production efficiency , Stabilize the effect of anti-PID effect
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Embodiment 1
[0048] The structure of the crystalline silicon battery device in Embodiment 1 of the present invention is described in detail as follows.
[0049] like image 3It shows that crystalline silicon solar cell equipment systems all work in a vacuum state. The vacuum state, ie the atmospheric pressure, is 10 mbar less. The structure of the crystalline silicon solar cell equipment system includes a loading chamber 31 , a pretreatment chamber 32 , a coating deposition chamber 33 , and an unloading chamber 34 . Wherein the loading chamber 31 is used to load the substrate to be processed; the pretreatment chamber 32 is used to pretreat the substrate to be processed, and the pretreatment includes oxidation treatment so that the substrate surface forms a dense Silicon oxide film.
[0050] In some embodiments of the present invention, the coating deposition chamber 33 is used for coating deposition on the substrate to be processed, the coating deposition chamber includes a front anti-r...
Embodiment 2
[0077] The structure of the crystalline silicon battery device in Embodiment 2 of the present invention is described in detail as follows.
[0078] like Image 6 The crystalline silicon solar cell equipment system includes a vacuum system and a non-vacuum system. The vacuum state, ie the atmospheric pressure, is 10 mbar less. The non-vacuum state, that is, the atmospheric pressure is in the range of 500mbar-1013mbar. The structure of the crystalline silicon solar cell equipment system includes a loading chamber 41 , a pretreatment chamber 42 , a coating deposition chamber 43 , and an unloading chamber 44 . Wherein the loading chamber 41 is used for loading substrates to be processed. The pretreatment chamber 42 is used to pretreat the substrate to be treated, and the pretreatment includes oxidation treatment to form a dense silicon oxide film on the surface of the substrate; in some embodiments of the present invention, the coating deposition chamber 43, For performing coa...
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Abstract
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