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A vacuum microwave processing method for crisp persimmon chips

A technology of vacuum microwave and persimmons, which is applied in the field of food processing, can solve the problems of high moisture content of persimmons, difficulty in satisfying persimmons, and few types of products, and achieve the effects of sweet and crisp taste, high production efficiency, and less loss of internal nutrients

Pending Publication Date: 2018-03-02
HEZHOU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As the production of persimmons increases year by year, the market price of fresh persimmons and dried persimmons continues to decrease. Persimmons have a high moisture content and obvious seasonality. They are easy to rot and deteriorate after maturity, while persimmons are mainly eaten fresh and processed into persimmons, and a small part of them are processed. Persimmon wine, persimmon vinegar, persimmon sauce, etc. have relatively few product types, and it is difficult to meet the requirements of the development of the persimmon industry. It is urgent to carry out deep processing of persimmons, increase the variety of persimmon products, and at the same time extend the supply period of persimmon products and increase the added value of products

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The invention discloses a method for vacuum microwave processing persimmon chips. The processing method includes material selection, cleaning, peeling, slicing, puffing and drying, softening, secondary puffing and drying, cooling and packaging. The specific steps are as follows:

[0029] (1) Material selection: Choose fresh, disease-free, non-damaged, 6-8 mature Gongcheng Yueshi persimmons that have been deastringent.

[0030] (2) Cleaning: Use tap water to wash off the soil and impurities on the surface of Gongcheng Yueshi.

[0031] (3) Peeling: Use artificial peeling method to peel off the skin of Gongcheng Yue persimmon and remove the fruit pedicle.

[0032] (4) Slicing: Cut the peeled Gongcheng Yue persimmon vertically in half, and then cut into 4mm slices.

[0033] (5) Segmented puffing and drying: put 600g persimmon slices into vacuum microwave drying equipment, under the vacuum degree of -0.09Mpa, first puff and dry under microwave power 1500W for 15min, then i...

Embodiment 2

[0038] The invention discloses a method for vacuum microwave processing persimmon chips. The processing method includes material selection, cleaning, peeling, slicing, puffing and drying, softening, secondary puffing and drying, cooling and packaging. The specific steps are as follows:

[0039] (1) Material selection: Choose fresh, disease-free, non-damaged, 6-8 mature Gongcheng Yueshi persimmons that have been deastringent.

[0040] (2) Cleaning: Use tap water to wash off the soil and impurities on the surface of Gongcheng Yueshi.

[0041] (3) Peeling: Use artificial peeling method to peel off the skin of Gongcheng Yue persimmon and remove the fruit pedicle.

[0042] (4) Slicing: Cut the peeled Gongcheng Yue persimmon vertically in half, and then cut into 10mm slices.

[0043] (5) Segmented puffing and drying: put 1000g persimmon thin slices into vacuum microwave drying equipment, under the vacuum degree of -0.09Mpa, first puff and dry under microwave power 1500W for 32min,...

Embodiment 3

[0048] The invention discloses a method for vacuum microwave processing persimmon chips. The processing method includes material selection, cleaning, peeling, slicing, puffing and drying, softening, secondary puffing and drying, cooling and packaging. The specific steps are as follows:

[0049] (1) Material selection: Choose fresh, disease-free, non-damaged, 6-8 mature Gongcheng Yueshi persimmons that have been deastringent.

[0050](2) Cleaning: Use tap water to wash off the soil and impurities on the surface of Gongcheng Yueshi.

[0051] (3) Peeling: Use artificial peeling method to peel off the skin of Gongcheng Yue persimmon and remove the fruit pedicle.

[0052] (4) Slicing: Cut the peeled Gongcheng Yue persimmon into two halves vertically, and then cut into 8mm slices.

[0053] (5) Segmented puffing and drying: put 1350g persimmon slices into vacuum microwave drying equipment, under the vacuum degree of -0.08Mpa, first puff and dry under microwave power 2000W for 31min...

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PUM

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Abstract

The invention discloses a vacuum microwave processing method for crisp persimmon chips, and belongs to the technical field of food processing. The objective of the invention is to provide the vacuum microwave processing method for crisp persimmon chips, with the method having advantages of a high production efficiency, a low cost, capability of preparing crisp persimmon chips having rich nutritionand good taste, and the like. The method includes subjecting thin persimmon sheets to staged microwave puffing and drying in vacuum with the vacuum degree being -0.09 MPa to -0.06 MPa.

Description

technical field [0001] The invention belongs to the technical field of food processing, in particular to a method for vacuum microwave processing persimmon chips. Background technique [0002] Persimmon is a perennial deciduous fruit tree belonging to the family Persimmonaceae. It is native to my country and has a cultivation history of more than 3,000 years. As one of the five major fruits in my country (grape, citrus, banana, apple, persimmon), persimmon has high nutritional value and is rich in sucrose, glucose, fructose, pectin, protein, carotene, vitamin C, cellulose, melon Amino acid, iodine, calcium, phosphorus, iron, zinc. Persimmon has the effects of clearing heat, moistening the lungs, quenching thirst, antitussive, and expectorant, and has pharmacological effects such as preventing cardiovascular diseases, anti-tumor, antibacterial, hemostasis, and diarrhea. [0003] Vacuum microwave technology combines the instantaneity of microwave heating and the low-temperatu...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): A23L19/00A23P30/32
CPCA23L19/01A23P30/32A23V2002/00A23V2300/10
Inventor 刘艳段振华唐小闲杨金凤谷毅鹏商飞飞
Owner HEZHOU UNIV
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