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Silicone-free gel-like thermally conductive composition

A composition and silicone technology, applied in heat exchange materials, chemical instruments and methods, etc., can solve the problems of reducing the dielectric strength, failure, and flow of thermally conductive grease of thermally conductive materials, and achieve excellent insulation performance and dielectric strength. Effects of excellent shape retention, excellent long-term reliability

Active Publication Date: 2021-03-16
BEIJING BEIHUAXINXIANG SPECIAL MATERIAL TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] US20100181663 discloses a thermally conductive paste using non-silicon organic matter and metal powder aluminum powder. The use of aluminum powder greatly reduces the dielectric strength of the thermally conductive material, which may lead to short circuits or electrical breakdown of components
[0007] Patents WO / 2008 / 126829, WO / 2009 / 025304, and JP2011111517 disclose a silicone-free thermal grease composition, but the thermal grease is only suitable for a very thin thermal interface, such as a thickness of 30-50 microns, and is not suitable for use in Filled with a certain thickness (above 0.1mm) of the thermal interface, when the thickness is too large, it is easy to cause the thermal grease to flow, and the sliding will cause the problem of poor heat dissipation and failure of the component
Moreover, the thermal grease is easy to dry out after long-term use.

Method used

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  • Silicone-free gel-like thermally conductive composition
  • Silicone-free gel-like thermally conductive composition
  • Silicone-free gel-like thermally conductive composition

Examples

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preparation example Construction

[0030] Preparation method of silicone-free gel-like thermally conductive composition

[0031] The composition described above can be made into a gel-like thermally conductive composition by, for example, mixing all the ingredients. Suitable mixing equipment such as twin planetary mixers, extruders such as twin screw extruders and the like can be used to prepare the compositions described herein. Usually, components (a), (c), (d), and (e) can be mixed uniformly in a double planetary mixer, and then component (b) can be added under the protection of an inert gas such as nitrogen, and after mixing, store in an anaerobic conditioned (e.g. in an airtight container) until ready to use. For example, the obtained gel-like thermally conductive composition is filled into containers suitable for automatic dispensing and mounting of electronic components, such as dispensing tubes or syringes.

[0032] According to the technical scheme provided by the present invention, the thermal condu...

Embodiment 1

[0046] Use polyalphaolefin with a kinematic viscosity of 1,240cSt at 40°C, such as SpectraSyn100 manufactured by ExxonMobil, use linseed oil as a reactive and curable component, and use 45 micron and 5 micron spherical alumina as a thermal conductive filler, such as Japan Denka Manufactured DAM-45 and DAW-05, adding nano-alumina, thixotropic agent fumed silica, such as Aerosil 200 manufactured by Evonik, antioxidant is Irganox 1010. The weight percentage of each component in the composition is as follows Table 1 shows.

[0047] component Example 1 Example 2 Example 3 Comparative Example 1 Comparative Example 2 SpectraSyn 100 5.5％ 4.5％ 8.5％ SpectraSyn 40 5.5％ Ketjenlube-165 5％ Linseed oil 3％ 2％ 3.5％ 3％ DAM-45 55％ 33％ 55％ 55％ 55％ DAM-90 26％ DAW-05 31.5％ 32.6％ 31.5％ 31.5％ 31.5％ Nano alumina 4％ 1.5％ 4％ 4％ 4％ Aerosil 200 0.8％ 0.2％ 0.8％ 0.8％ 0.8％ Irganox 10...

Embodiment 2

[0051] A silicone-free gel-like heat-conducting composition, the weight percentage of each component in the composition is shown in Table 1. The preparation method is also the same as that of Example 1. Firstly, the components other than the linseed oil are mixed uniformly, and then the linseed oil is added under the protection of nitrogen, and mixed uniformly under vacuum. Press it into the dispensing syringe under the protection of nitrogen, and store it in a sealed and low temperature (<5°C).

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Abstract

The invention provides an organosilicone-free gel-like thermal conduction composition, and relates to the field of thermal conduction interface materials. The invention in particular relates to organosilicone-free thermal conduction gel which is applied in electronic products and communication equipment and is used for heat conduction of contact interfaces of heating elements and cooling fins. Thethermal conduction gel is prepared from organosilicone-free base oil, dry oil, heat conduction filler, a thixotropic agent and additives. The thermal conduction gel has the advantages of extrudable dispensing, high thermal conductivity, excellent shape retention capability and no organic silicon contamination, and can significantly improve the long-term reliability performance of the electronic products at the same time.

Description

technical field [0001] The present invention relates to the field of thermally conductive interface materials. In particular, a silicone-free thermally conductive gel used in electronic products and communication equipment for heat conduction at the contact interface of a heating element and a heat sink, characterized in that the thermally conductive gel is composed of a silicone-free base. Composed of oil, drying oil, thermally conductive filler, thixotropic agent and additives, the thermally conductive gel has the advantages of extrudable dispensing, high thermal conductivity, excellent shape retention, and no silicone contamination, which can significantly improve electronic Long-term reliability performance of the product. Background technique [0002] The heat generated by the electronic components needs to be transferred to the external environment through the radiator. Because the solid surface of the electronic components and the radiator in contact with the radiato...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L23/00C08L67/00C08L91/00C08K13/04C08K7/18C08K3/22C08K3/36C08K5/134C09K5/14
CPCC08K2003/2227C08K2201/011C08L23/00C08L67/00C08L2203/20C09K5/14C08L91/00C08K13/04C08K7/18C08K3/22C08K3/36C08K5/1345
Inventor 杨建
Owner BEIJING BEIHUAXINXIANG SPECIAL MATERIAL TECH
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