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Composite partition board

A composite partition wall and substrate layer technology, which is applied in the field of building panels, can solve the problems of low strength, easy cracking of joints, and single function of partition boards, so as to improve bonding strength, prevent joint cracking, and achieve strong bonding Effect

Inactive Publication Date: 2018-03-23
SHENYANG JIANZHU UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose is to develop a composite partition wall panel with good integrity, safety and reliability, material saving, industrial production, heat preservation, heat insulation, sound insulation and convenient construction, which can effectively solve the problem of single function of partition wall panels, low strength and easy cracking of joints question

Method used

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  • Composite partition board
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Examples

Experimental program
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Embodiment

[0025] Example: such as Figure 1 to Figure 7 As shown, a composite partition wall panel of the present invention includes a finishing layer 1, a substrate layer 2, a sound insulation layer 3, an insulating layer 4 and an adhesive layer 5; the finishing layer 1 is arranged on the outer surface of the substrate layer 2, The veneer layer 1 is a natural wood veneer decorative panel or a technical wood veneer decorative panel. The veneer layer 1 is fixed on the outer surface of the substrate layer 2 in the factory through the factory prefabrication process, eliminating the need to apply putty on the construction site Wet work for leveling and pasting the finish layer 1; the substrate layer 2 is a calcium silicate board or asbestos-free fiber cement board for heat preservation; the sound insulation layer 3 is a damping sound insulation board for sound insulation, and has environmental protection, fire prevention, heat preservation Mildew, moisture-proof and high strength, high impa...

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Abstract

The invention relates to a composite partition wall board, which belongs to the field of building boards. Including finishing layer, substrate layer, sound insulation layer, insulation layer and bonding layer. The veneer layer is arranged on the outer surface of the substrate layer; the sound insulation layer and the outer surface of the heat insulation layer are provided with a number of conical grooves for accommodating adhesives, which can improve the bonding strength between layers ; There are several cavities inside the insulation layer; in addition, the top of the invention is provided with a trapezoidal groove, one side of the invention has a first boss and a second groove, and the other side has a first groove that matches it and the second boss. The invention has high strength, light overall weight, outstanding heat insulation and sound insulation effect, adopts dry construction, reduces on-site wet work and assembly workload, is simple and convenient to install, and greatly reduces labor intensity, operation time and cost of workers.

Description

technical field [0001] The invention belongs to the field of building panels, in particular to a composite partition wall panel. Background technique [0002] The wall materials currently used in the market, such as clay bricks, are slow in construction, heavy in quality, and destroy land resources; light-duty keel and gypsum board partition walls have cumbersome construction, low strength, no sound insulation, no moisture resistance, and no heat preservation, causing great harm to use. Big trouble; there are also foam lightweight dividers on the market now. Perlite light-duty partitions are afraid of moisture, low in strength, do not eat nails, the surface is difficult to handle, and the sound insulation effect needs to be improved. In addition, the entire wall panel is only made of perlite, which cannot meet various application requirements. In addition, the partition boards in the prior art have the disadvantages that they are easily dislocated during splicing, the male ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): E04C2/288E04C2/30E04B2/74E04B2/82B32B7/12B32B13/04B32B27/06B32B27/30B32B33/00
CPCE04C2/288B32B7/12B32B13/04B32B27/06B32B27/302B32B33/00B32B2307/102B32B2307/304B32B2307/50B32B2607/00E04B2/7403E04B2/821E04C2/30
Inventor 张延年张琦秦桂娟
Owner SHENYANG JIANZHU UNIVERSITY
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