Heat conduction and insulation composite material with anisotropic structure and preparation method of heat conduction and insulation composite material

A technology of heat conduction insulation and composite materials, which is applied in the field of heat conduction insulation composite materials and their preparation, which can solve the problems of not meeting the heat dissipation needs of electronic systems, high thermal expansion coefficient, and restricting applications, and achieve short preparation cycle, high thermal conductivity, and improved heat conduction performance effect

Inactive Publication Date: 2018-04-03
HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, PDMS has a high coefficient of thermal expansion and low thermal conductivity, which makes it unable to meet the heat dissipation needs of electronic systems, thus seriously restricting its application; and graphene, as a new type of material, is a carbon atom with sp2 hybrid orbital The new material of single-layer flake structure planar film composed of hexagonal honeycomb lattice is a two-dimensional material with a thickness of only one carbon atom. The best performing nanomaterials

Method used

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  • Heat conduction and insulation composite material with anisotropic structure and preparation method of heat conduction and insulation composite material
  • Heat conduction and insulation composite material with anisotropic structure and preparation method of heat conduction and insulation composite material
  • Heat conduction and insulation composite material with anisotropic structure and preparation method of heat conduction and insulation composite material

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Embodiment 1

[0031] The present embodiment prepares thermally conductive and insulating composite material (graphene accounts for 0.2% of the mass of the silicone rubber matrix) as follows:

[0032] First, accurately weigh 0.044g of surface-modified graphene, add it to 10mL dispersant 1,4-dioxane, disperse it ultrasonically for 30min, then add 20g of PDMS A component, stir evenly for 10min, disperse ultrasonically for 30min, then add 2g of PDMS B component, sonicate until the dispersant is completely volatilized to obtain a mixture;

[0033] Vacuumize to remove the air bubbles in the mixture, then pour it into a mold, and cure it at 80°C for 2 hours under a 10T strong magnetic field, so that the graphene is arranged in the matrix to form a chain structure, thereby forming an anisotropic heat conduction channel, and the target product is obtained Thermally conductive and insulating composite materials.

[0034] figure 1 It is a schematic diagram of the change of the microstructure of the ...

Embodiment 2

[0039] The present embodiment prepares thermally conductive and insulating composite material (graphene accounts for 0.5% of the mass of the silicone rubber matrix) as follows:

[0040]First, accurately weigh 0.11g of surface-modified graphene, add it to 10mL dispersant 1,4-dioxane, disperse it ultrasonically for 30min, then add 20g of PDMS A component, stir evenly for 10min, disperse ultrasonically for 30min, then add 2g of the PDMSB component, sonicated until the dispersant was completely volatilized to obtain a mixture;

[0041] Vacuumize to remove the air bubbles in the mixture, then pour it into a mold, and cure it at 80°C for 2 hours under a 10T strong magnetic field, so that the graphene is arranged in the matrix to form a chain structure, thereby forming an anisotropic heat conduction channel, and the target product is obtained Thermally conductive and insulating composite materials.

[0042] In order to compare the effect of the anisotropic structure on the performan...

Embodiment 3

[0045] The present embodiment prepares thermally conductive and insulating composite material (graphene accounts for 1.0% of the quality of the silicone rubber matrix) as follows:

[0046] First, accurately weigh 0.22g of surface-modified graphene, add it to 10mL dispersant 1,4-dioxane, and disperse it ultrasonically for 30min, then add 20g of PDMS A component, stir evenly for 10min, disperse ultrasonically for 30min, then add 2g of the PDMSB component, sonicated until the dispersant was completely volatilized to obtain a mixture;

[0047] Vacuumize to remove the air bubbles in the mixture, then pour it into a mold, and cure it at 80°C for 2 hours under a 10T strong magnetic field, so that the graphene is arranged in the matrix to form a chain structure, thereby forming an anisotropic heat conduction channel, and the target product is obtained Thermally conductive and insulating composite materials.

[0048] In order to compare the effect of the anisotropic structure on the p...

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Abstract

The invention discloses a heat conduction and insulation composite material with an anisotropic structure and a preparation method of the heat conduction and insulation composite material. Silicone rubber is used as a matrix, and graphene is arrayed in the matrix to form a chain type structure, thus forming a heat conduction channel with anisotropism. According to the heat conduction and insulation composite material with the anisotropic structure and the preparation method of the heat conduction and insulation composite material, by full use of excellent properties such as extremely high heatconductivity and extremely high strength of the graphene, the graphene is doped into a polymer matrix, so that a new idea is provided for development of a polymer-based composite material with high heat conductivity, and the heat conductivity of a conventional polymer is improved.

Description

technical field [0001] The invention belongs to the field of rubber heat-conducting polymer composite materials, and in particular relates to a heat-conducting and insulating composite material with anisotropic structure and a preparation method thereof. Background technique [0002] With the rapid development of microelectronics integration technology and high-density assembly technology of air-core printed boards, the assembly density has increased rapidly, and the volume of electronic components and logic circuits has shrunk sharply, making electronic instruments and equipment increasingly lighter, thinner, shorter, and smaller. direction of development. Under high-frequency operating frequency, the working thermal environment of semiconductors changes rapidly to high temperature. At this time, the heat generated by electronic components accumulates and increases rapidly. If it cannot be released in time, the life of electronic products will be shortened and the reliabil...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K9/06C08K3/04
CPCC08K3/04C08K9/06C08L83/04
Inventor 李彬王晓杰耿佳露董帅吴晅
Owner HEFEI INSTITUTES OF PHYSICAL SCIENCE - CHINESE ACAD OF SCI
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