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A kind of electroplating method of flexible circuit board

A flexible circuit board, flexible circuit board technology, applied in the direction of electrodes, electrolytic coatings, coatings, etc., can solve the problems that modern production performance cannot be improved, and the performance of circuit boards is limited. wide-ranging long-lasting effects

Active Publication Date: 2019-06-14
江西鑫力华数码科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The circuit boards of the above-mentioned patents have limited performance improvement after electroplating, which cannot meet the performance improvement of modern production

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] A kind of electroplating method of flexible circuit board, its step comprises:

[0021] (1) Preparation of graphene-containing electroplating solution

[0022] Nitrogen-containing leveler, Sn 2+ : 26g, free acid: 13g, ENSA: 3.0g and graphene: 15.8g joins in 1L distilled water, stirs and mixes to form electroplating solution for subsequent use, and nitrogen-containing leveling agent comprises primary amine, secondary amine and aniline, and its mass ratio is 1 :1:2;

[0023] (2) Pretreatment of the surface of the flexible circuit board

[0024] Wipe off the oil stains on the surface of the flexible circuit board with an alcohol dipped cloth, or use soaking method to spray a conductive coating on the surface of the flexible circuit board. The conductive coating sprayed on the surface of the flexible circuit board is coated aluminum foil. The thickness of the cloth is 35 microns, and it is dried for use. The coating is dried by infrared drying, and the drying condition i...

Embodiment 2

[0028] A kind of electroplating method of flexible circuit board, its step comprises:

[0029] (1) Preparation of graphene-containing electroplating solution

[0030] Nitrogen-containing leveler, Sn 2+ : 30g, free acid: 15g, ENSA: 3.5g and graphene: 20.5g joins 1L distilled water, stirs and mixes to form electroplating solution standby, nitrogen-containing leveler comprises primary amine, secondary amine and aniline, and its mass ratio is 1 :1:2;

[0031] (2) Pretreatment of the surface of the flexible circuit board

[0032] Use 120# solvent gasoline to wipe off the oil stains on the surface of the flexible circuit board, or use the soaking method to spray a conductive coating on the surface of the flexible circuit board. The conductive coating sprayed on the surface of the flexible circuit board is the coating Aluminum foil, coated with a thickness of 35 microns, is dried for later use, and the coating is dried by infrared drying, and the drying condition is 70°C for 25 mi...

Embodiment 3

[0036] A kind of electroplating method of flexible circuit board, its step comprises:

[0037] (1) Preparation of graphene-containing electroplating solution

[0038] Nitrogen-containing leveler, Sn 2+ : 32g, free acid: 16g, ENSA: 4.0g and graphene: 27.2g joins in 1L distilled water, stirs and mixes to form electroplating solution standby, nitrogen-containing leveling agent comprises primary amine, secondary amine and aniline, and its mass ratio is 1 :1:2;

[0039] (2) Pretreatment of the surface of the flexible circuit board

[0040] Wipe off the oil stains on the surface of the flexible circuit board with an alcohol dipped cloth, or use soaking method to spray a conductive coating on the surface of the flexible circuit board. The conductive coating sprayed on the surface of the flexible circuit board is coated aluminum foil. The thickness of the cloth is 35 microns, and it is dried for use. The coating is dried by infrared drying, and the drying condition is 75°C for 25 m...

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PUM

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Abstract

The invention discloses an electroplating method for a flexible circuit board. The electroplating method for the flexible circuit board comprises the steps of preparation of graphene electroplating liquid, surface pretreatment of the flexible circuit board and electroplating of the flexible circuit board. In the electroplating process of the flexible circuit board, graphene is added in the electroplating liquid, is a cellular plane film formed by carbon atoms in an sp2 hybridized mode and has quite great characteristics such as strength, flexibility, electrical conductivity, heat conductivityand optical properties, a great film can be formed on the flexible circuit board through the matched electroplating method for the flexible circuit board, and the strength, toughness, electrical conductivity and heat conductivity of the circuit board are improved.

Description

technical field [0001] The invention relates to the field of circuit board processing, in particular to an electroplating method for a flexible circuit board. Background technique [0002] Flexible circuit boards, also known as "soft boards", are printed circuits made of flexible insulating substrates. Flexible circuits provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability. Because of the wide use of flexible circuit boards, higher requirements are required, and their performance requirements are higher. [0003] Similar to patent CN200910110650.0, the present invention relates to a circuit board electroplating device and an electroplating method. The circuit board electroplating device constructed in the present invention includes a plating hole unit, and the electroplating unit is used to electroplate the plating hole unit on a circuit board. The distribu...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D15/00C25D17/10C25D5/00
CPCC25D5/00C25D15/00C25D17/10
Inventor 刘新华李真瑞
Owner 江西鑫力华数码科技有限公司