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Polycarbonate imide resin and paste using same

A technology of polycarbonate imide resin and paste, which is applied in the field of polycarbonate imide resin and the paste obtained by using the same, can solve the problems of adhesion, solvent resistance, chemical resistance reduction, low elasticity Modulus, thermal degradation of electronic components, etc., to achieve the effect of excellent bending resistance and low warpage

Active Publication Date: 2021-01-15
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, since the solder resist layer, surface protection layer, and adhesive layer, which are constituent elements of COF substrates, are often applied and printed in the form of a solution, a solvent-soluble ring-closed polyimide has been proposed as its material. Resin complexes, however, have conventionally used high-boiling-point nitrogen-based solvents such as N-methyl-2-pyrrolidone as solvents for varnish-forming polyimide-based resins, and thus have the following problems: In some cases, a high-temperature and long-time curing process of 200°C or higher is required, and electronic components will be thermally degraded.
[0006] These polysiloxane-modified polyimide-based resins use expensive diamines having dimethylsiloxane bonds as starting materials for low elastic modulus, which is economical.
In addition, as the amount of polysiloxane copolymerization increases, there is a problem that adhesiveness, solvent resistance, and chemical resistance decrease.

Method used

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  • Polycarbonate imide resin and paste using same
  • Polycarbonate imide resin and paste using same
  • Polycarbonate imide resin and paste using same

Examples

Experimental program
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Embodiment

[0126] In order to demonstrate this invention more concretely, although an Example is given below, this invention is not limited to an Example at all. In addition, the measured value described in an Example was measured by the following method.

[0127]

[0128] The polycarbonate imide resin (A) was dissolved in N-methyl-2-pyrrolidone so that the polymer concentration would be 0.5 g / dl. The solution viscosity and solvent viscosity of this solution were measured at 30 degreeC with the Ubbelohde type viscometer, and it calculated using the following formula.

[0129] Logarithmic viscosity (dl / g)=[ln(V1 / V2)] / V3

[0130] In the above formula, V1 represents the solvent viscosity measured with an Ubbelohde viscometer, and V1 and V2 are obtained from the time for the polymer solution and the solvent (N-methyl-2-pyrrolidone) to pass through the capillary of the viscosity tube. In addition, V3 is a polymer concentration (g / dl).

[0131]

[0132] Evaluation was performed by addin...

manufacture example 1

[0161] (Production Example 1) (b) Synthesis of acid dianhydride having polycarbonate skeleton represented by general formula (4) (b-1)

[0162] 167 g (0.87 mol) of trimellitic anhydride (TMA) and thionyl chloride were put into a reaction container, they were made to react, and trimellitic anhydride acid chloride was synthesize|combined. Next, 183 g (0.87 mol) of trimellitic anhydride acid chloride was mixed with DURANOL T5651 (polycarbonate diol manufactured by Asahi Kasei Chemical Co., Ltd.: 1,5-pentanediol / 1,6-hexanediol, molecular weight: 1000) as a diol compound. ) 434 g (0.43 mol) was esterified at 30° C. in toluene to synthesize a tetracarboxylic dianhydride containing a polycarbonate skeleton.

manufacture example 2

[0164] 60.0 g (0.04 mol) of component (b-1) synthesized in Production Example 1, 3.8 g (0.02 mol) of trimellitic anhydride (TMA), and 16.4 g (0.04 mol) of ethylene glycol dianhydrotrimellitate (TMEG) were put into 26.4 g (0.1 mol) of o-toluidine diisocyanate (TODI) as a diisocyanate, 0.08 g of 1,8-diazabicyclo[5,4,0]-7-undecene as a polymerization catalyst, Dissolve in 97.9g of γ-butyrolactone. Thereafter, it was reacted at 80° C. to 190° C. for 6 hours while stirring under a nitrogen stream, and then diluted by adding 83.9 g of γ-butyrolactone and cooled to room temperature to obtain 35% by mass of non-volatile components. Brown viscous polycarbonate imide resin solution A-1.

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Abstract

[Problem] To provide a polycarbonate-imide resin paste which is applicable as a solder resist layer, surface-protective layer, or adhesive layer that satisfies all of (1) solubility in nitrogen-free solvents, (2) low warpage, and (3) flex resistance. [Solution] A polycarbonate-imide resin (A) characterized by comprising a constituent component represented by specific structural formula (1), a constituent component represented by specific structural formula (2), and a constituent component represented by specific structural formula (3), the amounts of the constituent component represented by specific structural formula (1), the constituent component represented by specific structural formula (2), and the constituent component represented by specific structural formula (3) being 10 mol% or greater, greater than 30 mol% but less than 70 mol%, and greater than 50 mol%, respectively, when the amount of all the constituent components is taken as 200 mol%.

Description

technical field [0001] The present invention relates to a polycarbonate imide resin and a paste obtained by using the same. In particular, it relates to a polycarbonate imide resin paste that is useful for COF substrate applications, has excellent heat resistance and flexibility, and is suitable for coating methods such as printing machines, dispensers, and spin coaters, and An electronic component having a solder resist layer, a surface protection layer, or an adhesive layer obtained by curing the paste. Background technique [0002] In general, polyimide-based resins are excellent in heat resistance, insulation, chemical resistance, and the like, and thus are widely used as insulating materials for electrical and electronic devices. In particular, it is often used as a raw material for COF substrates, and is applied to wiring board materials and mounting substrate materials for electronic devices requiring flexibility and small space. Widely used in, for example, equipme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08G73/10B32B15/08B32B27/36C08L63/00C08L79/08H05K3/28
CPCB32B15/08B32B27/36C08G73/10C08L63/00C08L79/08H05K3/28B32B27/08B32B27/281B32B2255/10B32B2255/205B32B2457/08C08G73/1035H05K3/285
Inventor 内山翔子青山知裕
Owner TOYOBO CO LTD