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Copper graphite heat dissipation film and preparation method thereof

A technology of graphite heat dissipation film and graphite base material, which is applied in semiconductor/solid-state device manufacturing, superimposed layer plating, coating, etc., can solve the problems of reducing the machinability of heat sinks, high equipment requirements, and high cost, and achieves Ease of large-scale mass production, improved thermal conductivity, and convenient operation

Inactive Publication Date: 2018-04-20
TIANNUO PHOTOELECTRIC MATERIAL
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

[0004] The Chinese invention application with the publication number CN105101758A discloses a natural graphite / copper composite heat sink and its preparation method, including a copper foil layer and graphite layers located on the upper and lower sides of the copper foil layer; The roughened layer on the upper and lower sides of the material; the surface of the roughened layer is uniformly distributed with a nodular copper particle structure; the roughened layer interlocks with the graphite layer through the nodular copper particle structure, and the structure of the heat sink formed by the invention is graphite layer-copper layer - Graphite layer, the invention mainly uses copper as the base material, and its surface will reduce the machinability of the heat sink after the graphite is compounded, and the process of the invention is complicated, the equipment requirements are high, and the cost is expensive

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  • Copper graphite heat dissipation film and preparation method thereof

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Embodiment 1

[0035] The copper-graphite heat dissipation film includes a graphite substrate layer, a metal transition layer and a metal copper layer, and the structural layer is a metal copper layer-nickel layer-graphite substrate layer-nickel layer-metal copper layer; wherein the metal transition layer is a metal Nickel, the thickness of a single layer is 0.1 μm; the thickness of a single layer of metal copper is 2 μm; the graphite substrate is roll-shaped natural graphite, with a thickness of 100 μm.

[0036] Preparation method, proceed as follows:

[0037] (1) drying the graphite substrate layer at 60°C for 24 hours;

[0038] (2) Surface treatment is performed on both sides of the graphite substrate after step (1) under the action of an ion source for 2 minutes;

[0039] (3) adopting the physical vapor deposition method, the graphite substrate after step (2) is double-sidedly coated with a metal transition layer;

[0040] (4) Using an electroless plating method, the surface of the met...

Embodiment 2

[0042] The copper-graphite heat dissipation film includes a graphite substrate layer, a metal transition layer and a metal copper layer, and the structural layer is a graphite substrate layer-silver copper layer-metal copper layer; wherein the metal transition layer is a combination of metal silver and copper, The thickness of a single layer is 0.5 μm; the thickness of a single layer of metallic copper is 4 μm; the graphite substrate is roll-shaped natural graphite with a thickness of 20 μm.

[0043] Preparation method, proceed as follows:

[0044] (1) drying the graphite substrate layer at 80° C. for 36 hours;

[0045] (2) The single side of the graphite substrate dried in step (1) is subjected to surface treatment under the action of plasma for 5 minutes;

[0046] (3) adopting the vacuum evaporation method, the graphite substrate after the step (2) is processed is coated with a metal transition layer on one side;

[0047] (4) Using an electroless plating method, the surfac...

Embodiment 3

[0049] The copper-graphite heat dissipation film includes a graphite substrate layer, a metal transition layer and a metal copper layer, and the structural layer is a graphite substrate layer-aluminum layer-metal copper layer; wherein the metal transition layer is metal aluminum, and the thickness of a single layer is 0.02 μm; the thickness of a single metal copper layer is 10 μm; the graphite substrate is roll-shaped synthetic graphite with a thickness of 200 μm.

[0050] Preparation method, proceed as follows:

[0051] (1) drying the graphite substrate layer at 100°C for 36 hours;

[0052] (2) surface-treating one side of the dried graphite substrate in step (1) under the action of an ion source for 10 minutes;

[0053] (3) adopting the vacuum evaporation method, the graphite substrate after the step (2) is processed is coated with a metal transition layer on one side;

[0054] (4) Using an electroplating method, the surface of the metal transition layer after plating in s...

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Abstract

The invention belongs to the technical field of a new material, and specifically relates to a copper graphite heat dissipation film and a preparation method thereof. The copper graphite heat dissipation film comprises a graphite base material layer, a metal transitional layer and a metal copper layer; the metal transitional layer and the metal copper layer are arranged on the single surface or twosurfaces of the graphite base material layer in sequence; the preparation method comprises the following steps of performing drying and surface treatment on the graphite base material; next, coveringthe surface with the metal transitional layer in a plating manner; and finally, covering the metal transitional layer with the metal copper layer in a plating manner. The copper graphite heat dissipation film has the advantages of high heat conductivity (in horizontal and vertical directions), low specific gravity, high temperature resistance, high binding force, high re-machinability and the like, and has the effects of heat dissipation, static prevention and the like; and in addition, the preparation method is simple, safe and reliable, and economic and environment friendly.

Description

technical field [0001] The invention relates to the technical field of new materials, in particular to a copper-graphite heat dissipation film and a preparation method thereof. Background technique [0002] In the field of heat dissipation of electronic products such as mobile phones, notebooks, and LED TVs, electronic components will continue to generate heat when they are working. If the heat cannot be exported or eliminated in time, it will lead to local high temperature of electronic components, which will seriously affect the operating efficiency and life of electronic equipment. It may even lead to fire or explosion accidents. With the development of electronic products towards high power, light and thin, and large screen size, high heat puts forward higher requirements for the use of electronic components, and people pay more and more attention to the safety of electronic products. Therefore, improving electronic components The heat dissipation function of the device...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373H01L21/48C23C28/02
CPCC23C28/023H01L21/4871H01L23/3735H01L23/3736H01L23/3738
Inventor 朱焰焰陈士冰郑杰杨亚宁
Owner TIANNUO PHOTOELECTRIC MATERIAL
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