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White light LED and manufacturing method

A technology of LED chips and white light, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., can solve the problems of derivation, high temperature of white light LEDs, and reduction of luminous efficiency and life of white light LEDs, so as to improve thermal conductivity, small absorption effect, and improve Effect of Optical Stability and Lifetime

Active Publication Date: 2018-05-29
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, after research, it is found that phosphors and quantum dots will generate heat while photoluminescence, this part of the heat cannot be exported through the colloidal matrix in time, and eventually the heat will accumulate inside the white LED, resulting in an excessively high internal temperature of the white LED, which will Seriously reduce the luminous efficiency and lifespan of white LEDs

Method used

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  • White light LED and manufacturing method

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preparation example Construction

[0044] Such as figure 2 As shown, the present invention also provides a preparation method of the white light LED, comprising the following steps:

[0045] S1. Install the LED chip 104 on the upper surface of the substrate 115, and then apply the fluorescent colloid mixed with the colloid matrix, fluorescent powder and quantum dot composite material on the top of the LED chip, and heat and cure at a heating temperature of 100°C to 150°C;

[0046] S2. Nesting the light-transmitting housing 108 above the LED chip and the fluorescent colloid to seal the LED chip and the fluorescent colloid;

[0047] S3. Fill the gap between the fluorescent colloid and the light-transmitting shell with encapsulation glue, and prepare a white light LED after curing.

[0048] Among them, such as figure 1 As shown, the quantum dot composite material is prepared by the following steps:

[0049] S11. When configuring the quantum dot particle solution, metal cations are placed on the surface of the ...

Embodiment 1

[0054] see image 3 , in this embodiment, the LED chip is a horizontal electrode chip, its substrate is sapphire, the material of the light-transmitting shell is polymethyl methacrylate, and its light transmittance is 95%, and the shape of the light-transmitting shell is hemispherical. shape, the diameter of the inner surface is 6mm, the height of the inner surface is 6mm, and the encapsulation glue is heat-curing silicone.

[0055] First, prepare the quantum dot composite material, including the following steps:

[0056] S1. When synthesizing the solution of quantum dot particles, make the surface of quantum dot particles positively charged, the core compound of quantum dot particles is CdSe, the shell compound is ZnS, and the surface ligand is oleic acid with metal cations to obtain surface bands Positively charged quantum dot solution 110; the specific steps for synthesizing the quantum dot particle solution are:

[0057] S11. Preparation of precursor: 0.26g CdO was disso...

Embodiment 2

[0068] see Figure 4 , repeating Example 1 with the same steps as described, the difference is that in the fluorescent colloid, the mass fraction of the phosphor powder accounting for the fluorescent colloid is 15%, the quantum dot composite material accounts for 15% of the mass fraction of the fluorescent colloid, and the dispensing of the fluorescent colloid The volume is 20 μL.

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Abstract

The invention belongs to the LED packaging field and discloses a white light LED and a manufacturing method. The white light LED comprises a substrate, an LED chip and a light transmission shell. TheLED chip is arranged on a substrate surface and is coated with a fluorescence colloid formed through mixing a colloid matrix, a fluorescent powder and a quantum dot composite material. The quantum dotcomposite material is formed by quantum dot particles and high heat conductivity coefficient material particles. The light transmission shell is arranged above the substrate. The LED chip and the fluorescence colloid are sealed inside and a packaging glue is filled between the light transmission shell and the fluorescence colloid. The method comprises the following steps of installing the LED chip on an upper surface of the substrate; dispensing the fluorescence colloid above the LED chip, heating and curing; nesting the light transmission shell above the LED chip and the fluorescence colloid; and filling the packaging glue in a gap between the fluorescence colloid and the light transmission shell and curing, and then acquiring the white light LED. In the invention, a work temperature ofthe white light LED can be effectively reduced, amounts of the fluorescent powder and quantum dots are decreased and cost is reduced.

Description

technical field [0001] The invention belongs to the field of LED packaging, and more specifically relates to a white light LED and a preparation method thereof. Background technique [0002] White Light Emitting Diode (WLED) is a semiconductor light emitting device based on the principle of P-N junction electroluminescence. Compared with traditional lighting sources, it has the advantages of high electro-optic conversion efficiency, long service life, environmental protection and energy saving, and small size. It is recognized as one of the most promising high-tech fields in the 21st century. At the same time, flat panel display technology based on white LED backlight has developed rapidly in recent years and has become a new economic growth point. It is estimated that by 2020, my country's white light LED-related output value is expected to reach one trillion yuan. [0003] High-power white LEDs are usually composed of blue LED chips that excite yellow phosphors. Althoug...

Claims

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Application Information

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IPC IPC(8): H01L33/50H01L33/64
CPCH01L33/502H01L33/641H01L2933/0041H01L2933/0075
Inventor 罗小兵谢斌余兴建蓝威周姝伶张晓钰王梦王佳雯
Owner HUAZHONG UNIV OF SCI & TECH
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