Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage

A technology of copper-clad laminates and high breakdown voltage, which is applied in the field of copper-clad laminates, can solve the problems of poor PCB processing performance, low interlayer bonding strength, and board toughness to be improved, achieving low CTE, Effect of high breakdown voltage and improved processability

Inactive Publication Date: 2018-06-01
GUANGDE LONGTAI ELECTRONICS SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, when the existing copper clad laminates are machined, the interlayer bonding strength is not high, and the PCB

Method used

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  • Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage
  • Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage
  • Production technology of high-tenacity copper-clad laminated board with low CTE and high breakage voltage

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0019] Example 1

[0020] The technical scheme adopted by the present invention is: a low CTE, high breakdown voltage and high toughness copper clad laminate production process, the production process of the copper clad laminate includes the following steps:

[0021] 1). Set the resin glue formula: first transfer the raw materials of the resin glue formula used in the production of copper clad laminates to the inside of the high-speed disperser, and mix and stir for 4.5h at a high speed inside the high-speed disperser until mixed Uniformity, and the gelation time of the resin glue is 350s;

[0022] 2). Adjust the production parameters of the P sheet: then apply the uniformly mixed resin glue solution obtained in step 1 to 7628 glass fiber cloth, and the resin content after the glue is 43%, and it is made by drying in the vertical glue machine Prepreg

[0023] 3). Adjust the press molding process: then laminate the 8 prepregs, then laminate with copper foil, press and shape in a vacuu...

Example Embodiment

[0030] Example 2

[0031] The technical scheme adopted by the present invention is: a low CTE, high breakdown voltage and high toughness copper clad laminate production process, the production process of the copper clad laminate includes the following steps:

[0032] 1). Set the resin glue formula: first transfer the raw materials of the resin glue formula used in the production of copper-clad laminates to the inside of the high-speed disperser, and mix and stir well for 6h at the high-speed stirring rate inside the high-speed disperser until it is evenly mixed. , And test the gelation time of resin glue;

[0033] 2). Adjust the production parameters of the P sheet: then apply the uniformly mixed resin glue solution obtained in step 1 on the 7628 glass fiber cloth, and the resin content after the glue is 45%, and it is made by drying in the vertical glue machine Prepreg

[0034] 3). Adjust the compression molding process: then laminate the 9 prepregs, then laminate with copper foil, ...

Example Embodiment

[0041] Example 3

[0042] The technical scheme adopted by the present invention is: a low CTE, high breakdown voltage and high toughness copper clad laminate production process, the production process of the copper clad laminate includes the following steps:

[0043] 1). Set the resin glue formula: first transfer the raw materials of the resin glue formula used in the production of copper-clad laminates to the inside of the high-speed disperser, and mix and stir thoroughly for 4 hours at the high-speed stirring rate inside the high-speed disperser until the mixture is uniform , And test the gelation time of resin glue;

[0044] 2). Adjust the production parameters of the P sheet: then apply the uniformly mixed resin glue solution obtained in step 1 to 7628 glass fiber cloth, and the resin content after the glue is 48%, and it is made by drying in a vertical glue machine Prepreg

[0045] 3). Adjust the compression molding process: then laminate 10 prepregs, then laminate them with cop...

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Abstract

The invention relates to a production technology of a high-tenacity copper-clad laminated board with low CTE and high breakage voltage. The production technology of the copper-clad laminated board comprises the following steps: setting the formula of a resin glue solution, adjusting P sheet production parameters and adjusting a compression molding technology, specifically firstly sufficient and uniformly mixing raw materials of the formula of the resin glue solution used for producing the copper-clad laminated board, then gluing the uniformly mixed resin glue solution onto electronic grad glass fiber cloth, drying the resin glue solution on a vertical gluing machine to obtain prepregs, then laminating two to ten prepregs, then overlapping a copper foil, carrying out compression molding inside a vacuum pressing machine, and finally packaging the prepared copper-clad laminated board for shipment after the testing for the appearance and inner materials of the board is qualified. The boardafter compression molding manufactured through the production technology of the copper-clad laminated board has the characteristics of low CTE and high breakage voltage, and through modification of the formula, the tenacity and durability of the board are greatly improved, so that the PCB processing performance is greatly improved.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a production process for copper-clad laminates with low CTE, high breakdown voltage and high toughness. Background technique [0002] With the rapid development of electronic products, the requirements for integration are getting higher and higher, and the size of components is shrinking, the number of devices per unit area is increasing, the circuit is becoming more and more complex, and the span of the application environment is also increasing. Copper plates have a lower coefficient of thermal expansion (CTE), higher toughness, and higher breakdown voltage to improve interconnection and installation reliability. [0003] At present, when the existing copper clad laminates are machined, the interlayer bonding strength is not high, and the PCB processing performance is poor. The mechanical processing performance, that is, the toughness of the board needs to be impr...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B37/06B32B37/12B32B38/00C08L79/04C08L63/00C08L61/06C08K3/22H05K3/02
CPCH05K3/022C08L79/04B32B37/06B32B37/1018B32B37/1284B32B38/164C08K2003/2227C08L2205/03B32B2457/08B32B2307/20B32B2307/734B32B2307/558C08L63/00C08L61/06C08K3/22
Inventor 陈伟福林英荣巴晶
Owner GUANGDE LONGTAI ELECTRONICS SCI TECH
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