Preparation and application of 3D (Three-dimensional) printing photosensitive resin containing POSS (Polyhedral Oligomeric Silsesquioxane)

A photosensitive resin and 3D printing technology, which is applied in the field of 3D printing and photocuring, can solve the problems of limited application, poor mechanical properties and thermal stability, and achieve high heat distortion temperature, high tensile strength, and the effect of expanding applications

Inactive Publication Date: 2018-06-05
FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, poor mechanical properties and thermal stability limit their wider application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] Mix 20 parts of polyethylene glycol acrylate, 15 parts of hydroxyethyl methacrylate and 3 parts of monomethacryloxy POSS, ultrasonically disperse for 1 hour, mix 60 parts of polyurethane acrylate prepolymer with it, and use constant temperature magnetic force The stirring device was heated to 60°C and stirred until it became transparent, and 2 parts of photoinitiator 1-hydroxycyclohexyl phenyl ketone was added, and stirred for 1 hour in the dark to prepare a photosensitive resin for use.

[0025] Using a 405nm laser stereolithography (SLA) 3D printer for 3D printing and molding, the directly printed sample was tested with a universal mechanical testing machine. The tensile modulus was 2432.21MPa, the tensile strength was 38.62MPa; the flexural modulus was 1985.52MPa , Bending strength 32.33MPa. The heat distortion temperature is 79.2°C.

Embodiment 2

[0027] Mix 20 parts of polyethylene glycol acrylate, 13 parts of hydroxyethyl methacrylate and 5 parts of monomethacryloxy POSS, ultrasonically disperse for 1 hour, mix 60 parts of polyurethane acrylate prepolymer with it, and use constant temperature magnetic force The stirring device was heated to 60°C and stirred until it became transparent, and 2 parts of photoinitiator 1-hydroxycyclohexyl phenyl ketone was added, and stirred for 1 hour in the dark to prepare a photosensitive resin for use.

[0028] Using a 405nm laser stereolithography (SLA) 3D printer for 3D printing and molding, the directly printed sample was tested with a universal mechanical testing machine. The tensile modulus was 2637.62MPa, the tensile strength was 44.62MPa; the flexural modulus was 2323.21MPa , Bending strength 39.60MPa. The heat distortion temperature is 85.1°C.

Embodiment 3

[0030] Mix 20 parts of polyethylene glycol acrylate, 11 parts of hydroxyethyl methacrylate and 7 parts of monomethacryloxy POSS, ultrasonically disperse for 1 hour, mix 60 parts of polyurethane acrylate prepolymer with it, and use constant temperature magnetic The stirring device was heated to 60°C and stirred until it became transparent, and 2 parts of photoinitiator 1-hydroxycyclohexyl phenyl ketone was added, and stirred for 1 hour in the dark to prepare a photosensitive resin for use.

[0031] Using a 405nm laser stereolithography (SLA) 3D printer for 3D printing and molding, the directly printed sample was tested with a universal mechanical testing machine, the tensile modulus was 2837.62MPa, the tensile strength was 39.62MPa; the flexural modulus was 2423.21MPa , Bending strength 33.08MPa. The heat distortion temperature was 83.0°C.

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Abstract

The invention discloses a preparation method and application of a highly crosslinked 3D (Three-dimensional) printing photosensitive resin containing POSS (Polyhedral Oligomeric Silsesquioxane). The photosensitive resin is prepared from the components in parts by weight: 10 to 70 parts of prepolymer, 30 to 80 parts of diluents, 1 to 5 parts of photoinitiators and 0.5 to 10 parts of POSS, wherein the POSS is provided with one or more R groups with acrylic ester structures. According to the photosensitive resin for 3D printing provided by the invention, during a photocuring 3D printing process, the POSS is connected with a polymer matrix through a chemical bond and physical crosslinking, so that a real organic-inorganic nanometer hybrid material is formed. The highly crosslinked 3D printing photosensitive resin containing the POSS provided by the invention has higher heat deformation temperature, is widely applied to a high-temperature environment, and has a more excellent mechanical property.

Description

technical field [0001] The invention relates to the fields of 3D printing and photocuring, in particular to a preparation method and application of a POSS-containing photocuring 3D printing resin. Background technique [0002] 3D printing technology was born in the late 1970s. Because 3D printing has a series of advantages: no need for traditional processing equipment, short manufacturing cycle, parts with complex structures can be processed, high utilization rate of materials, etc., it is developing rapidly in the world, and it is widely used in industrial modeling, packaging, manufacturing, architecture, art, etc. , medicine, aviation, aerospace and film and television and other fields have been well applied. [0003] Light-curing 3D printing usually uses liquid photosensitive resin as the raw material. Under the trigger of ultraviolet light, chain polymerization occurs, and it is formed in a layer-by-layer manner. The 3D printing technologies using photosensitive resin ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08F283/00C08F220/28C08F220/20C08F230/08C08F222/20C08F2/48B33Y70/00
CPCC08F2/48C08F283/008B33Y70/00C08F220/286C08F222/104C08F230/08
Inventor 李悦微吴立新钟捷
Owner FUJIAN INST OF RES ON THE STRUCTURE OF MATTER CHINESE ACAD OF SCI
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