Sintering project abandoned soil expanded perlite heat insulation and decoration integral board and preparation method thereof

A technology of expanded perlite and engineering spoils, which is applied in the field of building materials, can solve the problems of affecting the thermal insulation performance of the board, increasing the thermal conductivity, and increasing the cost, and achieves significant economic and social benefits, high solid waste utilization, and saves The effect of decoration construction

Active Publication Date: 2018-06-08
山西晟科微生物建材科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But their obvious disadvantages are: (1) The expansion perlite slab is prepared by pressing, which causes the expansion perlite to be broken and affects the thermal insulation performance of the board; The density of the board is increased, which leads to a further increase in the thermal conductivity of the board; (3) It does not have the integrated effect of heat preservation and decoration. After the board is installed on the wall, it needs to be plastered and decorated, resulting in cumbersome construction technology and increased costs.

Method used

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  • Sintering project abandoned soil expanded perlite heat insulation and decoration integral board and preparation method thereof
  • Sintering project abandoned soil expanded perlite heat insulation and decoration integral board and preparation method thereof
  • Sintering project abandoned soil expanded perlite heat insulation and decoration integral board and preparation method thereof

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Embodiment Construction

[0034] Specific embodiments of the present invention will be described in detail below.

[0035] A sintering engineering spoil expanded perlite thermal insulation and decoration integrated board, the specific examples are shown in Table 1, Table 2, Table 3 and Table 4.

[0036] Table 1 shows the raw materials of the thermal insulation base layer corresponding to each embodiment. Table 2 shows the parts by weight of the raw materials of the thermal insulation base layer corresponding to each embodiment. Table 3 shows the parts by weight of the decorative surface layer raw materials corresponding to each embodiment. Table 4 shows the sintering temperature and sintering time corresponding to each embodiment, as well as the compressive strength and thermal conductivity of the sintering project spoil expanded perlite thermal insulation and decoration integrated board measured by the test.

[0037] The specific steps of the preparation method of the sintering engineering spoil exp...

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Abstract

The invention discloses a sintering project abandoned soil expanded perlite heat insulation and decoration integral board, which consists of a heat insulation base layer and a decoration surface layer, wherein the heat insulation base layer is prepared from 50 to 80 parts of engineering waste soil, 50 to 80 parts of expanded perlite, 5 to 10 parts of bonding agents, 0.5 to 1 part of foaming agents, 2 to 6 parts of foam stabilizing agents, 6 to 8 parts of reinforced fiber, 0.2 to 0.3 part of cosolvents and 30 to 50 parts of water through sintering; the decoration surface layer is prepared from20 to 70 parts of silicon dioxide, 30 to 80 parts of zinc oxide, 5 to 8 parts of boric oxide, 2 to 4 parts of aluminum oxide, 0.5 to 2 parts of lithium oxide, 0.5 to 3 parts of coloring agents, 0.2 to0.3 part of dispersing agents, 0.1 to 0.4 part of anti-foaming agents and 20 to 40 parts of water through sintering. The solid wastes are efficiently utilized; meanwhile, the prepared sintering project abandoned soil expanded perlite heat insulation board has the integral functions of fire prevention, heat insulation and decoration.

Description

technical field [0001] The invention belongs to the field of building materials, and specifically relates to a sintering project spoil expanded perlite thermal insulation and decoration integrated board and a preparation method thereof. Background technique [0002] Building energy consumption has exceeded 1 / 3 of the total energy consumption of society. Improving the thermal insulation performance of building envelope is an effective means to reduce building energy consumption. Organic insulation materials commonly used in buildings, such as polystyrene board (EPS), extruded polystyrene board (XPS), polyurethane board (PU), etc., have low thermal conductivity and good thermal insulation performance, but due to their poor fire resistance and durability It has been unable to meet the development needs of building fire protection and safety. Inorganic insulation materials such as rock wool, expanded perlite, and expanded vermiculite have good fire resistance, chemical stabili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B33/36C04B33/13C04B33/132C04B33/32C04B38/10C04B38/02C04B41/86C03C8/14
CPCC03C8/14C04B33/1305C04B33/131C04B33/132C04B33/1328C04B33/32C04B33/36C04B38/02C04B38/10C04B41/009C04B41/5022C04B41/86C04B2235/3201C04B2235/3206C04B2235/3427C04B2235/5216C04B2235/5228C04B2235/5232C04B2235/96C04B2235/9607C04B41/4539Y02P40/60
Inventor 赵林李珠贾冠华
Owner 山西晟科微生物建材科技有限公司
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