Epoxy resin curing agent and preparation method
An epoxy resin curing and curing agent technology, which is applied in the preparation of imino compounds, organic chemistry, etc., can solve the problems that epoxy resin is difficult to process and recycle, so as to alleviate environmental pollution and waste of resources, meet the needs of use, Effect of good solvent resistance and mechanical properties
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Embodiment 1
[0028] Step 1: Weigh 15.0g of ethylenediamine and dissolve it in 30ml of methanol, stir at room temperature for 10min to obtain a clear solution 1; weigh 16.5g of terephthalaldehyde and dissolve it in 15ml of methanol, and ultrasonically treat it for 5min at room temperature to obtain a clear solution 2. Heat solution 1 to 40°C, and slowly add solution 2 drop by drop to rapidly stirred solution 1 with a constant pressure dropping funnel, and after fully reacting for 12 hours, vacuum-dry to obtain an epoxy curing agent containing an imine bond structure, The structural formula is as follows:
[0029]
[0030] Step 2: Mix 100g of bisphenol A epoxy resin solution E51 and 28g of the above-mentioned curing agent evenly, put it in a vacuum oven for 30-50 minutes to vacuumize and defoam, and pour the defoamed solution into a preheated stainless steel mold The epoxy resin was obtained after curing at 60°C for 4 hours, at 80°C for 4 hours, and after cooling and demoulding.
[0031...
Embodiment 2
[0033] Step 1: Weigh 50g of diaminodiphenylmethane (DDM) and dissolve it in 60ml of methanol, stir at room temperature for 10min to obtain a clear solution 1; weigh 16.7g of terephthalaldehyde and dissolve it in 15ml of methanol, and sonicate at room temperature for 5min , a clear solution 2 was obtained. Heat solution 1 to 40°C, and slowly add solution 2 drop by drop to rapidly stirred solution 1 with a constant pressure dropping funnel, and after fully reacting for 12 hours, vacuum-dry to obtain an epoxy curing agent containing an imine bond structure, The structural formula is as follows:
[0034]
[0035] Step 2: Mix 100g of bisphenol A epoxy resin solution E51 and 60g of the above-mentioned curing agent evenly, put it in a vacuum oven for 30-50 minutes to vacuumize and defoam, and pour the defoamed solution into a preheated stainless steel mold In the middle, cure at 60°C for 4 hours, and then cure at 100°C for 4 hours, and then obtain the epoxy resin after cooling an...
Embodiment 3
[0038] Step 1: Weigh 20g of ethylenediamine and dissolve it in 30ml of ethanol / dichloromethane solvent (volume ratio 8:2), stir at room temperature for 10min to obtain a clear solution 1; weigh 18g of trimesaldehyde and dissolve it in 15ml of ethanol / In dichloromethane solvent, sonication at room temperature for 5 min, a clear solution 2 was obtained. Heat solution 1 to 40°C, and slowly add solution 2 drop by drop to rapidly stirred solution 1 with a constant pressure dropping funnel, and after fully reacting for 12 hours, vacuum-dry to obtain an epoxy curing agent containing an imine bond structure, The structural formula is as follows:
[0039]
[0040] Step 2: Mix 100g of bisphenol A epoxy resin solution E51 and 25g of the above-mentioned curing agent evenly, put it in a vacuum oven for 30-50 minutes to vacuumize and defoam, and pour the defoamed solution into a preheated stainless steel mold The epoxy resin was obtained after curing at 60°C for 4 hours, at 90°C for 4 ...
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