Copper clad ceramic and preparation method thereof

A technology of copper-clad ceramics and aluminum nitride ceramics, which is applied in the field of ceramic copper cladding, can solve the problems of non-dense bonding between ceramic layers and copper layers, small bubbles, and low bonding strength, so as to reduce small bubbles and bulges, reduce bubbles, The effect of increasing the bonding strength

Active Publication Date: 2018-06-12
BYD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] Aiming at the problems in the existing aluminum nitride ceramic copper clad technology that the ceramic layer and the copper layer are not tightly bonded, there are small

Method used

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  • Copper clad ceramic and preparation method thereof
  • Copper clad ceramic and preparation method thereof
  • Copper clad ceramic and preparation method thereof

Examples

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Example Embodiment

[0058] In another embodiment of the present invention, a method for preparing copper-clad ceramics is disclosed, which includes the following steps:

[0059] An aluminum oxide film is formed on the surface of aluminum nitride ceramics;

[0060] Forming a modified layer on the surface of the aluminum oxide film; wherein the modified layer includes modified particles, and the modified particles include glass powder;

[0061] A copper layer is formed on the surface of the modified layer, and the copper layer, the modified layer and the aluminum nitride ceramic are integrated by heat treatment.

[0062] It should be noted that this embodiment does not limit the specific shape of the aluminum nitride ceramic. The aluminum nitride ceramic can be a sheet material with a flat surface, a regular three-dimensional shape, or an irregular curved surface. The materials can be selected by those skilled in the art according to their needs.

[0063] In this embodiment, an aluminum oxide film is formed...

Example Embodiment

[0083] Example 1

[0084] This embodiment is used to illustrate the copper-clad ceramic and its preparation method disclosed in the present invention, including the following process steps:

[0085] ①Place the aluminum nitride ceramic substrate in a flowing atmosphere, and heat up to 1200°C at a heating rate of 10°C / min for 90 minutes. The oxygen partial pressure in the flowing atmosphere is 0.21atm, and oxidation is formed on the surface of the aluminum nitride ceramic substrate. Aluminum film, then naturally cool down to room temperature;

[0086] ②Disperse modified particles in a dispersant and an organic binder to prepare a modified slurry. The modified particles include the following weight components: glass powder (main components silicate, silicon dioxide): 50%; Alumina powder (molecular formula Al 2 O 3 ): 45%; copper powder: 5%;

[0087] ③Print the prepared modified slurry on the aluminum oxide film surface of the aluminum nitride ceramic substrate by screen printing, and ba...

Example Embodiment

[0092] Example 2

[0093] This embodiment is used to illustrate the copper-clad ceramic and its preparation method disclosed in the present invention, including the following process steps:

[0094] ①Place the aluminum nitride ceramic substrate in a flowing atmosphere, and heat up to 1200°C at a heating rate of 10°C / min for 90 minutes. The oxygen partial pressure in the flowing atmosphere is 0.21atm, and oxidation is formed on the surface of the aluminum nitride ceramic substrate. Aluminum film, then naturally cool down to room temperature;

[0095] ②Disperse modified particles in a dispersant and an organic binder to prepare a modified slurry. The modified particles include the following weight components: glass powder (main components silicate, silicon dioxide): 50%; Alumina powder (molecular formula Al 2 O 3 ): 40%; cuprous oxide: 5%; copper powder: 5%;

[0096] ③Print the prepared modified slurry on the aluminum oxide film surface of the aluminum nitride ceramic substrate by scre...

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Abstract

In order to overcome the problems such as combination of a ceramic layer and a copper layer is not compact, small bubbles exist in an interface, bulge easily occurs, and bonding strength is relativelylow in the existing aluminium nitride ceramic copper cladding technology, the invention provides a copper clad ceramic and a method for preparing the copper clad ceramic. The method comprises following operation steps: forming an aluminium oxide film on an aluminium nitride ceramic surface; forming a modification layer on the aluminium oxide film surface. The modification layer includes modifiedparticles, and the modified particles include glass powder; a copper layer is formed on the modified layer surface; and the copper layer, the modification layer and the aluminium nitride ceramic are combined integrally through thermal treatment. The invention also provides the copper clad ceramic prepared by the method. The surface modification layer containing the glass powder is formed on the aluminium nitride ceramic surface, the phenomena such as the generation of small bubbles and bulges are inhibited in a DBS technical process, and interface bonding force between the copper layer and thealuminium nitride ceramic is added.

Description

technical field [0001] The invention belongs to the technical field of copper-clad ceramics, in particular to a copper-clad ceramic and a preparation method thereof. Background technique [0002] Aluminum nitride ceramics is a non-oxygen compound with strong covalent bonds, and there is a strong directionality of covalent bonds between Al-N. It is a ceramic with good chemical stability. The aluminum nitride ceramic copper-clad laminate formed by cladding copper on the surface is the basic key material in the production of high-integration modules for high-power electronic devices. [0003] The existing aluminum nitride ceramic copper-clad laminate utilizes DBC technology (direct copper-clad technology) to realize the direct bonding of the rolled copper sheet and the aluminum nitride ceramic substrate. Since the aluminum nitride substrate and the copper-oxygen eutectic are not wet, Therefore, it is necessary to perform surface modification treatment on the aluminum nitride c...

Claims

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Application Information

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IPC IPC(8): C04B37/02
CPCC04B37/025C04B2237/064C04B2237/10C04B2237/366C04B2237/60
Inventor 邵长健林信平徐强刘成臣宋山青
Owner BYD CO LTD
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