Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Copper clad ceramic and preparation method thereof

A technology of copper-clad ceramics and aluminum nitride ceramics, which is applied in the field of ceramic copper cladding, can solve the problems of non-dense bonding between ceramic layers and copper layers, small bubbles, and low bonding strength, so as to reduce small bubbles and bulges, reduce bubbles, The effect of increasing the bonding strength

Active Publication Date: 2018-06-12
BYD CO LTD
View PDF4 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the problems in the existing aluminum nitride ceramic copper clad technology that the ceramic layer and the copper layer are not tightly bonded, there are small bubbles at the interface, it is easy to bulge, and the bonding strength is relatively low, the present invention provides a copper clad ceramic and a preparation method thereof

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Copper clad ceramic and preparation method thereof
  • Copper clad ceramic and preparation method thereof
  • Copper clad ceramic and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0058] In another embodiment of the present invention, a method for preparing copper-clad ceramics is disclosed, comprising the following steps:

[0059] Form an aluminum oxide film on the surface of aluminum nitride ceramics;

[0060] A modified layer is formed on the surface of the aluminum oxide film; wherein, the modified layer includes modified particles, and the modified particles include glass powder;

[0061] A copper layer is formed on the surface of the modified layer, and the copper layer, the modified layer and the aluminum nitride ceramic are combined into one body through heat treatment.

[0062] It should be noted that this embodiment does not limit the specific shape of the aluminum nitride ceramic. The aluminum nitride ceramic can be a flat sheet material, or a regular three-dimensional shape, or an irregular curved surface. Materials can be selected by those skilled in the art according to needs.

[0063] In this embodiment, an aluminum oxide film is formed...

Embodiment 1

[0084] This embodiment is used to illustrate the copper-clad ceramic disclosed in the present invention and its preparation method, including the following process steps:

[0085] ① Place the aluminum nitride ceramic substrate in a flowing atmosphere, raise the temperature to 1200°C at a heating rate of 10°C / min and keep it for 90 minutes. The oxygen partial pressure in the flowing atmosphere is 0.21atm, forming oxide aluminum film, and then naturally cooled to room temperature;

[0086] ② Disperse the modified particles in a dispersant and an organic binder to prepare a modified slurry, the modified particles include the following weight components: glass powder (main components silicate, silicon dioxide): 50%; Alumina powder (molecular formula Al 2 o 3 ): 45%; copper powder: 5%;

[0087] ③ Print the prepared modified slurry on the surface of the aluminum oxide film of the aluminum nitride ceramic substrate by screen printing, and bake in an oven at 90°C for 120 minutes to...

Embodiment 2

[0093] This embodiment is used to illustrate the copper-clad ceramic disclosed in the present invention and its preparation method, including the following process steps:

[0094] ① Place the aluminum nitride ceramic substrate in a flowing atmosphere, raise the temperature to 1200°C at a heating rate of 10°C / min and keep it for 90 minutes. The oxygen partial pressure in the flowing atmosphere is 0.21atm, forming oxide aluminum film, and then naturally cooled to room temperature;

[0095] ② Disperse the modified particles in a dispersant and an organic binder to prepare a modified slurry, the modified particles include the following weight components: glass powder (main components silicate, silicon dioxide): 50%; Alumina powder (molecular formula Al 2 o 3 ): 40%; cuprous oxide: 5%; copper powder: 5%;

[0096] ③ Print the prepared modified slurry on the surface of the aluminum oxide film of the aluminum nitride ceramic substrate by screen printing, and bake in an oven at 90°C...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Printing thicknessaaaaaaaaaa
Login to View More

Abstract

In order to overcome the problems such as combination of a ceramic layer and a copper layer is not compact, small bubbles exist in an interface, bulge easily occurs, and bonding strength is relativelylow in the existing aluminium nitride ceramic copper cladding technology, the invention provides a copper clad ceramic and a method for preparing the copper clad ceramic. The method comprises following operation steps: forming an aluminium oxide film on an aluminium nitride ceramic surface; forming a modification layer on the aluminium oxide film surface. The modification layer includes modifiedparticles, and the modified particles include glass powder; a copper layer is formed on the modified layer surface; and the copper layer, the modification layer and the aluminium nitride ceramic are combined integrally through thermal treatment. The invention also provides the copper clad ceramic prepared by the method. The surface modification layer containing the glass powder is formed on the aluminium nitride ceramic surface, the phenomena such as the generation of small bubbles and bulges are inhibited in a DBS technical process, and interface bonding force between the copper layer and thealuminium nitride ceramic is added.

Description

technical field [0001] The invention belongs to the technical field of copper-clad ceramics, in particular to a copper-clad ceramic and a preparation method thereof. Background technique [0002] Aluminum nitride ceramics is a non-oxygen compound with strong covalent bonds, and there is a strong directionality of covalent bonds between Al-N. It is a ceramic with good chemical stability. The aluminum nitride ceramic copper-clad laminate formed by cladding copper on the surface is the basic key material in the production of high-integration modules for high-power electronic devices. [0003] The existing aluminum nitride ceramic copper-clad laminate utilizes DBC technology (direct copper-clad technology) to realize the direct bonding of the rolled copper sheet and the aluminum nitride ceramic substrate. Since the aluminum nitride substrate and the copper-oxygen eutectic are not wet, Therefore, it is necessary to perform surface modification treatment on the aluminum nitride c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C04B37/02
CPCC04B37/025C04B2237/064C04B2237/10C04B2237/366C04B2237/60
Inventor 邵长健林信平徐强刘成臣宋山青
Owner BYD CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com