Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Composite profile made from waste dry film and preparation method thereof

A composite profile and dry film technology, applied in the field of composite profiles, can solve problems such as environmental pollution, and achieve the effects of reducing solid waste discharge, realizing resource utilization, and simple processing equipment

Active Publication Date: 2018-06-15
常州厚德再生资源科技有限公司
View PDF3 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Waste circuit boards produced when electrical and electronic products are scrapped usually contain toxic substances such as epoxy resins, brominated flame retardants, and heavy metals. Traditional treatment methods such as incineration and landfill will produce dioxins, fly ash Pollutants such as filtrate can easily cause environmental pollution

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] 1. Preparation of dry film fines

[0037]Use 0.1mol / L NaOH solution to carry out alkali treatment (alkali boiling) on ​​the waste dry film, wherein the mass ratio of NaOH solution to waste dry film is 2:1, and the temperature of the alkali treatment is controlled at 90°C, and the time is 120min. An alkaline treatment solution is obtained.

[0038] The above-mentioned alkali treatment liquid is filtered, and the filtrate is collected to obtain an alkaline filtrate containing a small amount of colloid, which is combined into a NaOH solution for reuse; at the same time, the filter residue is collected to obtain a water-containing dry film filter residue, which is ventilated and dried. The drying temperature is controlled to be 100° C. and the drying time is 120 minutes to obtain a dry film dispersion slag.

[0039] The above dry film dispersion slag is crushed and sieved to obtain dry film fines with an average particle size of 120 mesh and a water content of <1%.

[004...

Embodiment 2

[0046] 1. Preparation of dry film fines

[0047] Use 0.2mol / L NaOH solution to carry out alkali treatment (alkali boiling) on ​​the waste dry film, wherein the mass ratio of NaOH solution to the waste dry film is 2:1, and the temperature of the alkali treatment is controlled at 90°C and the time is 60min. An alkaline treatment solution is obtained.

[0048] The above-mentioned alkali treatment liquid is filtered, and the filtrate is collected to obtain an alkaline filtrate containing a small amount of colloid, which is combined into a NaOH solution for reuse; at the same time, the filter residue is collected to obtain a water-containing dry film filter residue, which is ventilated and dried. The drying temperature is controlled to be 105° C. and the drying time is 100 min to obtain a dry film dispersion slag.

[0049] The above dry film dispersion slag is crushed and sieved to obtain dry film fines with an average particle size of 130 mesh and a water content of <1%.

[0050...

Embodiment 3

[0056] 1. Preparation of dry film fines

[0057] Use 0.3mol / L NaOH solution to carry out alkali treatment (alkali boiling) on ​​the waste dry film, wherein the mass ratio of NaOH solution to waste dry film is 3:1, and control the temperature of alkali treatment to 90°C for 30 minutes, An alkaline treatment solution is obtained.

[0058] The above-mentioned alkali treatment liquid is filtered, and the filtrate is collected to obtain an alkaline filtrate containing a small amount of colloid, which is combined into a NaOH solution for reuse; at the same time, the filter residue is collected to obtain a water-containing dry film filter residue, which is ventilated and dried. The drying temperature is controlled to be 110° C., and the drying time is 80 minutes to obtain a dry film dispersion slag.

[0059] The above dry film dispersion slag is crushed and sieved to obtain dry film fines with an average particle size of 110 mesh and a water content of <1%.

[0060] The above-menti...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
compressive strengthaaaaaaaaaa
bending strengthaaaaaaaaaa
Login to View More

Abstract

The invention provides a composite profile made from a waste dry film and a preparation method thereof. The composite profile comprises, by weight, 25-35 parts of dry film fines, 35-45 parts of wastecircuit board resin powder, 5-20 parts of polyethylene plastic and / or dry wood powder, 5-10 parts of waste glass fiber reinforced plastic, and 10-15 parts of an auxiliary agent, wherein the dry film fines is obtained from alkali treatment on a waste dry film and contains no more than 3% by mass of colloid. Through resource utilization of the waste dry film, waste circuit board resin powder and waste glass fiber reinforced plastic, a composite profile with excellent mechanical properties is obtained. The composite profile has significant economic and social benefit.

Description

technical field [0001] The invention relates to a composite profile, in particular to a composite profile prepared by using waste dry film and a preparation method thereof. Background technique [0002] Photoresist is a light-sensitive mixed liquid composed of photosensitive resin, sensitizer, solvent and other components. The photosensitive resin in the photoresist can quickly undergo photocuring reaction in the exposure area after being illuminated, so that the physical properties such as solubility and affinity will change significantly. After being treated with an appropriate solvent, the soluble part can be removed to get the desired image. In view of the photoresist's function of blocking electroplating and etching, it is widely used in the production and transfer of circuit components, solder resist masks and dielectric patterns in the circuit board industry. [0003] DuPont of the United States developed a photoresist (usually named dry film) in 1968, which is comp...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): C08L101/00C08L25/10C08L23/06C08L63/00C08L97/02C08K13/04C08K7/14C08K3/22C08K3/38C08K5/544
CPCC08K2003/2227C08K2003/2241C08K2003/2272C08K2003/387C08L101/00C08L2205/025C08L2205/035C08L25/10C08L23/06C08L63/00C08L97/02C08K13/04C08K7/14C08K3/22C08K3/38C08K5/544
Inventor 王怀栋
Owner 常州厚德再生资源科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com