Preparation method of photosensitive resin with flame retardancy and application of photosensitive resin on circuit board
A photosensitive resin, flame retardant technology, applied in the application field of photosensitive ink on circuit boards, can solve the problems of non-flame retardant, poor flexibility, poor chemical resistance of covering materials, etc., to achieve good chemical resistance, Good bending resistance
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[0041] Example 1
[0042] Pour 40 grams of solvent γ-butyrolactone into a three-necked flask, add 26 grams of IPDI and 15.2 grams of tetrahydrophthalic anhydride, slowly heat to 150°C, react for 2 hours, then add 80 grams of phenolic epoxy resin, and react at 150°C In 4 hours, imide-modified epoxy resin 1 was obtained.
[0043] Add 20 grams of solvent γ-butyrolactone, 25 grams of unsaturated monocarboxylic acid acrylic acid, and 1 gram of catalyst triphenylphosphine to 160 grams of the above-mentioned imide-modified epoxy resin 1. Heat to 100-120°C for 8 hours Then, 25 grams of tetrahydrophthalic anhydride containing acid anhydride is added, and the reaction is heated to 100-120° C. for 5 hours to obtain photosensitive resin 1 with flame retardancy.
Example Embodiment
[0044] Example 2
[0045] Pour 40 grams of diethylene glycol ethyl ether acetate into a three-necked flask, add 96 grams of TDI and 20 grams of alkene succinic anhydride, slowly heat to 200°C, react for 6 hours, and then add 4,5-epoxycyclohexane 70 g of diglycidyl alkane-1,2-dicarboxylate was reacted at 200° C. for 8 hours to obtain imide-modified epoxy resin 2.
[0046] Add 40 grams of diethylene glycol ethyl ether acetate, 40 grams of crotonic acid, and 10 grams of triethylamine to 200 grams of the above-mentioned imide modified epoxy resin 2. After heating to 120-140°C for 2 hours, add olefin. 40 grams of succinic anhydride, heated to 120-140°C and reacted for 3 hours to obtain photosensitive resin 2 with flame retardant properties.
Example Embodiment
[0047] Example 3
[0048] Pour 50 grams of dimethyl propionamide into a three-necked flask, add 50 grams of MDI and 30 grams of glutaric anhydride, slowly heat to 250°C, react for 2 hours, and then add N,N-glycidyl-2,4, 80 g of 6-tribromoaniline was reacted at 200° C. for 3 hours to obtain imide-modified epoxy resin 3.
[0049] Add 150 grams of solvent dimethyl propionamide, 120 grams of 5-hexenoic acid, and 90 grams of N, N-dimethylethanolamine to 210 grams of the above-mentioned imide modified epoxy resin 2, and heat to 70-90°C for reaction After 10 hours, 90 grams of glutaric anhydride was added, and the mixture was heated to 70-90° C. for reaction for 9 hours to obtain photosensitive resin 3 with flame retardant properties.
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