Process for preparing folding-resistant high barrier composite film in sputtering mode

A composite film and preparation process technology, applied in sputtering plating, metal material coating process, ion implantation plating and other directions, can solve the problems of sputtering process interference, film prone to cracks, inflexibility and other problems, to reduce Permeability and cost, overall material performance improvement, easy-to-achieve effects

Inactive Publication Date: 2018-06-26
GUIZHOU MINZU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The technical problem to be solved by the present invention is: to solve the problems that the thin-film gas barrier film is prone to cracks and cannot be folded during the use of such materials, polymer and inorganic composite materials are used as target materials, and radio frequency plasma vacuum technology i...

Method used

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  • Process for preparing folding-resistant high barrier composite film in sputtering mode
  • Process for preparing folding-resistant high barrier composite film in sputtering mode
  • Process for preparing folding-resistant high barrier composite film in sputtering mode

Examples

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Effect test

Embodiment 1

[0036] A preparation process for preparing a folding-resistant high-barrier composite packaging film by sputtering vacuum plasma deposition technology of polymer, inorganic material or inorganic oxide composite target material, the specific steps are as follows:

[0037] (1) Preparations for cleaning and drying the base material; using PET as the base material, ultrasonically clean it with acetone, alcohol, and deionized water for 20 minutes, and then send it to the blower unit for drying.

[0038] (2) Send the prepared substrate into the pre-sputtering vacuum box for pre-sputtering cleaning, the pre-sputtering gas is 999.99% argon, the sputtering power increase rate is 1.5W hours / square centimeter, and the sputtering time is 120 seconds;

[0039] (3) With PI / SiO 2 The composite material is the target (wherein SiO 2 The mass content is 50%), turn on the radio frequency power supply, carry out co-deposition on the pre-sputtering substrate to prepare C-Si composite high resist...

Embodiment 2

[0041] (1) Preparations for cleaning and drying the base material; using PET as the base material, use acetone, alcohol, and deionized water to ultrasonically clean it for 30 minutes, and then send it to the blower unit for drying.

[0042] (2) Send the prepared substrate into the pre-sputtering vacuum box for pre-sputtering cleaning, the pre-sputtering gas is 999.99% argon, the sputtering power is 1.2Wh / cm2, and the sputtering time is 150 seconds;

[0043] (3) PTFE / SiO2 2 Composite material (SiO 2 Content is 60wt%) as the target material, turn on the radio frequency power supply, carry out co-deposition on the pre-sputtering substrate to prepare F-Si composite high resistance film, the vacuum degree of the vacuum chamber is controlled at 2 × 10 -5 Pa, the working gas is 999.99% argon, the flow rate of argon gas is 90sccm, the working air pressure is 0.4Pa, the target base distance is 8cm, the drum rotation speed is 2m / min, and the sputtering power of the composite target is ...

Embodiment 3

[0045] (1) Preparations for cleaning and drying of the substrate; PP is used as the substrate, ultrasonically cleaned with acetone, alcohol, and deionized water for 15 minutes, and then sent to the blower unit for drying.

[0046] (2) Send the prepared substrate into the pre-sputtering vacuum box for pre-sputtering cleaning, the pre-sputtering gas is 999.99% argon, the sputtering power increase rate is 1.4W hours / square centimeter, and the sputtering time is 120 seconds;

[0047] (3) Using PTFE / ZnO (ZnO content is 40wt%) as the target material, turn on the radio frequency power supply, and prepare C-Al composite high resistance film by co-deposition on the pre-sputtered substrate, and the vacuum degree of the vacuum chamber is controlled at 4× 10-5Pa, the working gas is 999.99% argon, the flow rate of argon gas is 75sccm, the working pressure is controlled at 0.3Pa, the distance between the target and the base is 10cm, the rotation speed of the drum is controlled at 2.5m / min, ...

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Abstract

The invention discloses a process for preparing a folding-resistant high barrier composite film in a sputtering mode. The process is characterized in that a target is a composite material formed by blending a high-molecular polymer with an inorganic material or blending the high-molecular polymer with an inorganic oxide, specifically, the mass ratio of the high-molecular polymer to the inorganic material or to the inorganic oxide is 100:0.01-100:90; and with the high-molecular and inorganic composite material as the target, organic high-molecular flexible chain fragments are led into a barriermembrane through a radio frequency magnetic control co-sputtering method, and folding resistance of the film is improved. The prepared composite high barrier film has high resistance to vapor and oxygen, reduces permeability of water and oxygen, prolongs the preservation time of food aroma, prolongs the shelf life of food, reduces the permeability of toxic gas in the transportation process and further reduces the cost; and besides, the process of preparing the flexible high barrier packaging film through the radio frequency sputtering method is effectively simplified, the preparation cycle isobviously shortened, and the process has quite high practical application value.

Description

technical field [0001] The invention relates to the technical field of barrier packaging, in particular to a production process for preparing a folding-resistant high barrier film by co-sputtering vacuum plasma deposition technology of polymer and inorganic material composite targets. Background technique [0002] The development of barrier packaging stems from the barrier requirements for packaging films that are easy to oxidatively degenerate and deteriorate in food, medicine, and microelectronics products. On the other hand, high-barrier packaging materials are widely used in the packaging of precision mechanical parts, electronic parts and solar modules to improve their service life, and are used in packaging of food, medicine and medical equipment to prevent the migration of harmful substances. Therefore, the research on high barrier packaging materials is of great significance. [0003] Most of the general barrier packaging materials are polymer plastics, most of whic...

Claims

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Application Information

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IPC IPC(8): C23C14/35C23C14/12C23C14/08
CPCC23C14/35C23C14/0036C23C14/08C23C14/12
Inventor 王超楠罗笙芸张朝珍鲁听杨吟野任达森杨林
Owner GUIZHOU MINZU UNIV
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