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Laser cleaning process

A laser cleaning and process technology, applied in the field of laser processing, can solve problems such as low production capacity, high metal loss, and failure of phosphating layer, and achieve the effects of stable and reliable quality, high processing efficiency, and reduced impact

Inactive Publication Date: 2018-06-29
WUHAN JINDUN LASER TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method has high requirements for the concentration of cleaning agent. The concentration is low, and it is not easy to clean, and the residue is bonded to the surface of the pores. If the concentration is too high, it is easy to damage the substrate material and cause the phosphating layer to fail; the solution used It is harmful to the human body, highly corrosive, pollutes the environment, high cost, low production capacity, large consumables, and high metal loss

Method used

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  • Laser cleaning process

Examples

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Embodiment 1

[0023] The laser cleaning process of the present embodiment comprises the following specific steps:

[0024] Step S01: Stop heating the reflow soldering machine in working state, open the outer cover after the temperature drops to 40°C, and check the residual solder balls and solder resist on the surface of the internal mounting board;

[0025] Step S02: Using a pulsed laser with a laser wavelength of 1064nm, place the surface of the mounting board to be cleaned on the laser out-of-focus plane. The surface of the mounting board to be cleaned is solder balls, solder resist, etc. remaining during the welding heating process Debris, especially the position on the surface of the clogged pores; the position of the laser from the focal plane is positive defocus 20mm, located above the focal plane, so that the power density distribution of the laser spot is relatively uniform, and when processing the surface of the mounting board, if the laser energy is too large Concentrated, it is ...

Embodiment 2

[0028] A kind of laser cleaning process of the present embodiment comprises the following specific steps:

[0029] Step S01: Stop heating the reflow soldering machine in working state, open the outer cover after 50°C, and check the residual solder balls and solder resist on the surface of the internal mounting board;

[0030] Step S02: Using a pulsed laser with a laser wavelength of 1064nm, using laser processing technology, place the surface of the mounting board to be cleaned on the laser defocus plane for scanning; the surface of the mounting board to be cleaned is the residual Solder balls, solder resist and other sundries, especially the position on the surface of the clogged pores; the defocus plane position of the laser is negative defocus 20mm, which is located below the focal plane, so that the power density distribution of the laser spot is relatively uniform, and when processing the mounting board On the surface, if the laser energy is too concentrated, it is easy t...

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Abstract

The invention provides a laser cleaning process. A pulse laser is used to perform laser scanning at a defocused plane position; residual solder balls, solder resist and other sundries during welding and heating are removed at the premise of not damaging base material of a surface-mounted board; noncontact processing is used; compared with traditional polishing methods, the laser cleaning process has the advantages that laser processing causes no direct impact on a surface-mounted board, and no mechanical deformation occurs. In addition, laser processing precision is high, only the surface to be cleaned is processed for the surface-mounted board, non-laser-irradiated parts are not or slightly affected, and the impact of human factors upon processing quality can be decreased; processing efficiency is high, the quality is stable and reliable, and the appearance is attractive.

Description

technical field [0001] The invention relates to the technical field of laser processing, in particular to a laser cleaning process. Background technique [0002] Due to the continuous miniaturization of PCB boards of electronic products, chip components have appeared, and the traditional welding method can no longer meet the needs. At first, the reflow soldering process was only used in the assembly of hybrid integrated circuit boards. Most of the components assembled and welded were chip capacitors, chip inductors, mount transistors and diodes. With the improvement of the entire technology of SMT, the emergence of a variety of chip components (SMC) and mount devices (SMD), the reflow soldering process technology and equipment as part of the mounting technology have also been developed accordingly, and its application is becoming more and more extensive. It has been applied in almost all fields of electronic products. In this reflow soldering process, residual solder balls...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B08B7/00B23K26/08B23K26/0622B23K101/42
CPCB08B7/0042B23K26/0624B23K26/082B23K26/0821
Inventor 汪军金翔汪于涛张骆熊凯凃宣梦郝磊
Owner WUHAN JINDUN LASER TECH CO LTD
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