Low-dielectric constant low-loss low-temperature co-fired ceramic material and preparation method thereof

Abstract

The invention discloses a low-dielectric constant low-loss low-temperature co-fired ceramic material and a preparation method thereof. The ceramic material comprises the following components in partsby mass: 10-40 parts of Al2O3, 0-40 parts of SiO2, 0-60 parts of powder A, 0-60 parts of powder B, and 8-30 parts of powder C, and the material has at least one of the powder A and the powder B; the powder A comprises the following raw materials by parts: 40-70 parts of Bi2O3, 10-30 parts of ZnO, and 15-45 parts of H3BO3; the powder B comprises the following raw materials: a BaO precursor, CuO andH3BO3 which have a mol ratio being 1:1:2; and the powder C comprises the following raw materials: MgO and SiO2 which have the mol ratio being 2:1. The preparation method comprises the following steps: mixing the raw materials in proportion, performing steps of ball milling, drying, granulation, tabletting, glue discharging and sintering, and finally preparing the low-temperature co-fired ceramicmaterial which has the advantages that the dielectric constant is adjustable in a scope of 5.2-10, the dielectric loss is less than 0.002, and the insulation resistivity is higher than 1*1014 omega.cm.

Description

technical field [0001] The invention relates to the technical field of low-temperature co-fired ceramics, in particular to a low-dielectric constant and low-loss low-temperature co-fired ceramic material and a preparation method thereof. Background technique [0002] Low temperature co-fired ceramics (Low Temperature Co-fired Ceramic, LTCC) are prepared on green ceramic belts made of low temperature co-fired ceramic powder through laser drilling, microporous grouting, precision conductor printing and other processes. The circuit, and then multiple passive components (such as capacitors, resistors, filters, couplers, etc.) are embedded in the substrate through the lamination of green ceramic tapes, and finally sintered at a temperature below 900 ° C to form a three-dimensional network structure. Passive integrated components can also be made into active / passive integrated functional modules by mounting ICs and active devices on its surface. Due to the excellent performance o...

AI Technical Summary

Problems solved by technology

However, the commonly used glass sintering aids have complex components and high production costs, and require professional equipment for high-temperature melting and refining of glass. The heat treatment takes a long time, consumes a lot of energy, and is not easy to scale up production.

Moreover, the cold quenching process of glass has a large loss of equipment, the glass slag after quenching has high hardness, it is difficult to grind, the shape of the glass is poor, and the process adaptability is not good

Adding too much low-melting oxide directly will directly deteriorate the material performance and process applicability, and it is difficult to meet the requirements of industrial applications. Therefore, the selection of suitable low-sintering aids and matching microwave ceramic matrix materials is the key to the development of LTCC ceramics

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