Unlock instant, AI-driven research and patent intelligence for your innovation.
Epoxy resin composition, prepreg, laminated board and printed circuit board
What is Al technical title?
Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology of epoxy resin and composition, which is applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., and can solve the problem of high water absorption
Active Publication Date: 2018-06-29
GUANGDONG SHENGYI SCI TECH
View PDF4 Cites 11 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
However, it is found in practice that these resins have the disadvantage of high water absorption.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Image
Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
Click on the blue label to locate the original text in one second.
Reading with bidirectional positioning of images and text.
Smart Image
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1-4 and comparative example 1-3
[0145] Put epoxy resin, maleimide, active ester, curing accelerator, and filler into the container according to the formula shown in Table 1 and a suitable solvent, stir to mix and disperse evenly, and make glue, and adjust the solution solid with solvent content to 60%-70% to make a glue solution, that is, to obtain a halogen-free thermosetting resin composition glue solution, impregnate the glue with 2116 electronic grade glass fiber cloth, bake in an oven to form a prepreg, take 4 pieces of 2116 prepreg, double-sided Cover with 18um thick electrolytic copper foil, do vacuum lamination in hot press, cure at 220℃ / 120min, press pressure 45kg / cm 2 , made of copper clad laminate with a thickness of 0.50mm. The performance test results are shown in Table 2.
[0146] Each component used in embodiment and comparative example is described in detail as follows:
[0147] (A) epoxy resin
[0148] (A-1) Biphenyl type epoxy resin: NC-3000-H (Nippon Kayaku)
[0149] (A-2) Dicyclopenta...
Embodiment 5-8 and comparative example 4-6
[0169]Put epoxy resin, maleimide, active ester, cyanate ester, curing accelerator, and filler into the container according to the formula shown in Table 3 and a suitable solvent, stir to make it mix and disperse evenly, and make glue. The solvent adjusts the solid content of the solution to 60%-70% to make a glue solution, that is, a halogen-free thermosetting resin composition glue solution, impregnate the glue with 2116 electronic grade glass fiber cloth, bake it in an oven to form a prepreg, and take 4 2116 prepregs , both sides are covered with 18um thick electrolytic copper foil, vacuum laminated in a hot press, cured at 220°C / 120min, press pressure 45kg / cm 2 , made of copper clad laminate with a thickness of 0.50mm. The performance test results are shown in Table 4.
[0170] Table 3. Resin composition formulation (parts by weight)
[0171]
[0172] Table 4. Base material property values
[0173]
[0174]
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Property
Measurement
Unit
Thickness
aaaaa
aaaaa
Login to View More
Abstract
The invention relates to an epoxy resin composition as well as prepreg, a laminated board and a printed circuit board, which use the epoxy resin composition. The epoxy resin composition provided by the invention is prepared from epoxy resin (A), a maleimide compound (B) with the structure of a formula (I) and an active ester compound (C). The prepreg, the laminated board (including a metallic foilclad laminated board) and the printed circuit board, which are made by using the epoxy resin composition, have the characteristics of being low in dielectric constant (Dk) / dielectric loss angle tangent value (Df), high in glass-transition temperature (Tg), low in water absorption, low in coefficient of thermal expansion (CTE) and excellent in heat resistance and heat and humidity resistance, andthe like.
Description
technical field [0001] The invention relates to the technical field of electronic products, in particular to an epoxy resin composition and its prepreg, laminated board and printed circuit board. Background technique [0002] With the rapid development of the electronics industry, electronic products are developing toward lightness, thinness, shortness, high density, safety, and high functionality. Electronic components are required to have higher wiring density, high integration and reliability. Metal clad laminates for making printed circuit boards have more excellent heat and humidity resistance, low thermal expansion coefficient, dielectric constant and low water absorption. [0003] Epoxy resin has excellent mechanical properties and processability. It is a commonly used matrix resin in the production of metal foil-clad laminates for high-end printed circuit boards. The prepregs and laminates produced are widely used as a A modified raw material is used in high-perform...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More