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Epoxy resin composition, prepreg, laminated board and printed circuit board

A technology of epoxy resin and composition, which is applied in the direction of printed circuit, printed circuit parts, circuit substrate materials, etc., and can solve the problem of high water absorption

Active Publication Date: 2018-06-29
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is found in practice that these resins have the disadvantage of high water absorption.

Method used

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  • Epoxy resin composition, prepreg, laminated board and printed circuit board
  • Epoxy resin composition, prepreg, laminated board and printed circuit board
  • Epoxy resin composition, prepreg, laminated board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1-4 and comparative example 1-3

[0145] Put epoxy resin, maleimide, active ester, curing accelerator, and filler into the container according to the formula shown in Table 1 and a suitable solvent, stir to mix and disperse evenly, and make glue, and adjust the solution solid with solvent content to 60%-70% to make a glue solution, that is, to obtain a halogen-free thermosetting resin composition glue solution, impregnate the glue with 2116 electronic grade glass fiber cloth, bake in an oven to form a prepreg, take 4 pieces of 2116 prepreg, double-sided Cover with 18um thick electrolytic copper foil, do vacuum lamination in hot press, cure at 220℃ / 120min, press pressure 45kg / cm 2 , made of copper clad laminate with a thickness of 0.50mm. The performance test results are shown in Table 2.

[0146] Each component used in embodiment and comparative example is described in detail as follows:

[0147] (A) epoxy resin

[0148] (A-1) Biphenyl type epoxy resin: NC-3000-H (Nippon Kayaku)

[0149] (A-2) Dicyclopenta...

Embodiment 5-8 and comparative example 4-6

[0169]Put epoxy resin, maleimide, active ester, cyanate ester, curing accelerator, and filler into the container according to the formula shown in Table 3 and a suitable solvent, stir to make it mix and disperse evenly, and make glue. The solvent adjusts the solid content of the solution to 60%-70% to make a glue solution, that is, a halogen-free thermosetting resin composition glue solution, impregnate the glue with 2116 electronic grade glass fiber cloth, bake it in an oven to form a prepreg, and take 4 2116 prepregs , both sides are covered with 18um thick electrolytic copper foil, vacuum laminated in a hot press, cured at 220°C / 120min, press pressure 45kg / cm 2 , made of copper clad laminate with a thickness of 0.50mm. The performance test results are shown in Table 4.

[0170] Table 3. Resin composition formulation (parts by weight)

[0171]

[0172] Table 4. Base material property values

[0173]

[0174]

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Abstract

The invention relates to an epoxy resin composition as well as prepreg, a laminated board and a printed circuit board, which use the epoxy resin composition. The epoxy resin composition provided by the invention is prepared from epoxy resin (A), a maleimide compound (B) with the structure of a formula (I) and an active ester compound (C). The prepreg, the laminated board (including a metallic foilclad laminated board) and the printed circuit board, which are made by using the epoxy resin composition, have the characteristics of being low in dielectric constant (Dk) / dielectric loss angle tangent value (Df), high in glass-transition temperature (Tg), low in water absorption, low in coefficient of thermal expansion (CTE) and excellent in heat resistance and heat and humidity resistance, andthe like.

Description

technical field [0001] The invention relates to the technical field of electronic products, in particular to an epoxy resin composition and its prepreg, laminated board and printed circuit board. Background technique [0002] With the rapid development of the electronics industry, electronic products are developing toward lightness, thinness, shortness, high density, safety, and high functionality. Electronic components are required to have higher wiring density, high integration and reliability. Metal clad laminates for making printed circuit boards have more excellent heat and humidity resistance, low thermal expansion coefficient, dielectric constant and low water absorption. [0003] Epoxy resin has excellent mechanical properties and processability. It is a commonly used matrix resin in the production of metal foil-clad laminates for high-end printed circuit boards. The prepregs and laminates produced are widely used as a A modified raw material is used in high-perform...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L67/00C08L25/14C08K5/3415C08J5/24B32B15/14B32B17/06H05K1/03
CPCB32B15/14B32B17/061B32B2260/021B32B2260/046B32B2262/101B32B2457/08C08J5/24C08J2363/00C08J2425/14C08J2467/00C08L63/00C08L2203/20H05K1/0353C08L67/00C08K5/3415C08L25/14
Inventor 董晋超唐军旗
Owner GUANGDONG SHENGYI SCI TECH
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